Arbitrary Modeling Of Tsvs For 3d Integrated Circuits
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Arbitrary Modeling Of Tsvs For 3d Integrated Circuits
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Author : Khaled Salah
language : en
Publisher: Springer
Release Date : 2014-08-21
Arbitrary Modeling Of Tsvs For 3d Integrated Circuits written by Khaled Salah and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-08-21 with Technology & Engineering categories.
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
Next Generation Eda Flow
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Author : Khaled Salah Mohamed
language : en
Publisher: Springer Nature
Release Date : 2025-05-13
Next Generation Eda Flow written by Khaled Salah Mohamed and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2025-05-13 with Technology & Engineering categories.
This book serves as a comprehensive guide to the world of EDA tools, offering readers a deeper understanding of their inner workings and a glimpse into the future of electronic design. With a meticulous focus on numerical methods, the author delves deeply into the mathematical foundations that underpin EDA tools. From finite element analysis to Monte Carlo simulations, readers will gain a thorough understanding of the numerical techniques employed to model and simulate complex electronic systems. Furthermore, this book elucidates the diverse modeling methods utilized in EDA tools, providing readers with a holistic view of the methods employed to represent and analyze electronic circuits and systems. Whether exploring circuit-level simulations or system-level modeling, readers will be equipped with the knowledge needed to navigate the intricacies of EDA toolsets. The author also delves into the fascinating intersection of quantum mechanics and electronic design, examining the evolving landscape of quantum EDA tools and offering insights into the transformative potential of quantum computing in electronic design. Lastly, this book explores the transformative impact of machine learning on EDA tools, offering insights into how artificial intelligence techniques can enhance performance and productivity.
3d Interconnect Architectures For Heterogeneous Technologies
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Author : Lennart Bamberg
language : en
Publisher: Springer Nature
Release Date : 2022-06-27
3d Interconnect Architectures For Heterogeneous Technologies written by Lennart Bamberg and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-06-27 with Technology & Engineering categories.
This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.
Neuromorphic Computing And Beyond
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Author : Khaled Salah Mohamed
language : en
Publisher: Springer Nature
Release Date : 2020-01-25
Neuromorphic Computing And Beyond written by Khaled Salah Mohamed and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-01-25 with Technology & Engineering categories.
This book discusses and compares several new trends that can be used to overcome Moore’s law limitations, including Neuromorphic, Approximate, Parallel, In Memory, and Quantum Computing. The author shows how these paradigms are used to enhance computing capability as developers face the practical and physical limitations of scaling, while the demand for computing power keeps increasing. The discussion includes a state-of-the-art overview and the essential details of each of these paradigms.
Postphenomenology And Media
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Author : Stacey O'Neal Irwin
language : en
Publisher: Bloomsbury Publishing PLC
Release Date : 2017-06-23
Postphenomenology And Media written by Stacey O'Neal Irwin and has been published by Bloomsbury Publishing PLC this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-06-23 with Philosophy categories.
Postphenomenology and Media: Essays on Human–Media–World Relations sheds light on how new, digital media are shaping humans and their world. It does so by using the postphenomenological framework to comprehensively study “human-media relations,” making use of conceptual instruments such as the transparency-opacity distinction, embodiment, multistability, variational analysis, and cultural hermeneutics. This collection outlines central issues of media and mediation theory that can be explored postphenomenologically and showcases research at the cutting edge of philosophy of media and technology. The contributors together enlarge the range of thinking about human-media-world relations in contemporary society, reflecting the interdisciplinary range of this school of thought, and explore, sometimes self-reflexively and sometimes critically, the provocative landscape of postphenomenology and media.
3d Stacked Chips
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Author : Ibrahim (Abe) M. Elfadel
language : en
Publisher: Springer
Release Date : 2016-05-11
3d Stacked Chips written by Ibrahim (Abe) M. Elfadel and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-05-11 with Technology & Engineering categories.
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.
Three Dimensional Integrated Circuit Design
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Author : Vasilis F. Pavlidis
language : en
Publisher: Newnes
Release Date : 2017-07-04
Three Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and has been published by Newnes this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-07-04 with Technology & Engineering categories.
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization
Strain Effect In Semiconductors
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Author : Yongke Sun
language : en
Publisher: Springer Science & Business Media
Release Date : 2009-11-14
Strain Effect In Semiconductors written by Yongke Sun and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-11-14 with Technology & Engineering categories.
Strain Effect in Semiconductors: Theory and Device Applications presents the fundamentals and applications of strain in semiconductors and semiconductor devices that is relevant for strain-enhanced advanced CMOS technology and strain-based piezoresistive MEMS transducers. Discusses relevant applications of strain while also focusing on the fundamental physics pertaining to bulk, planar, and scaled nano-devices. Hence, this book is relevant for current strained Si logic technology as well as for understanding the physics and scaling for future strained nano-scale devices.
Materials For Advanced Packaging
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Author : Daniel Lu
language : en
Publisher: Springer
Release Date : 2016-11-18
Materials For Advanced Packaging written by Daniel Lu and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-11-18 with Technology & Engineering categories.
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Fundamentals Of Electromigration Aware Integrated Circuit Design
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Author : JENS. ROTHE LIENIG (SUSANN. THIELE, MATTHIAS.)
language : en
Publisher:
Release Date : 2025-04-19
Fundamentals Of Electromigration Aware Integrated Circuit Design written by JENS. ROTHE LIENIG (SUSANN. THIELE, MATTHIAS.) and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2025-04-19 with Computers categories.