Characterization Of Substrate Noise Coupling Its Impacts And Remedies In Rf And Mixed Signal Ics
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Substrate Noise Coupling In Rfics
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Author : Ahmed Helmy
language : en
Publisher: Springer Science & Business Media
Release Date : 2008-03-23
Substrate Noise Coupling In Rfics written by Ahmed Helmy and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-03-23 with Technology & Engineering categories.
The book reports modeling and simulation techniques for substrate noise coupling effects in RFICs and introduces isolation structures and design guides to mitigate such effects with the ultimate goal of enhancing the yield of RF and mixed signal SoCs. The book further reports silicon measurements, and new test and noise isolation structures. To the authors’ knowledge, this is the first title devoted to the topic of substrate noise coupling in RFICs as part of a large SoC.
Characterization Of Substrate Noise Coupling Its Impacts And Remedies In Rf And Mixed Signal Ics
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Author : Ahmed Helmy
language : en
Publisher:
Release Date : 2006
Characterization Of Substrate Noise Coupling Its Impacts And Remedies In Rf And Mixed Signal Ics written by Ahmed Helmy and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006 with Radio frequency integrated circuits categories.
Abstract: Substrate noise coupling in integrated circuits is the process by which interference signals generated by high speed digital blocks cause parasitic currents to flow in the silicon substrate and couple devices in various parts of the circuits on this common substrate. In RFIC the switching noise couples to the sensitive analog circuits through the substrate causing degradation in performance and yield hit. Overcoming substrate coupling is a key issue in successful "system on chip" integration. In this thesis a substrate aware design flow is built, calibrated to silicon and used as part of the design flow to uncover substrate coupling problems in RFICs in the design phase. The flow is used to develop the first comprehensive RF substrate noise isolation design guide to be used by RF designers during the design phase. This will allow designers to optimize the design to maximize noise isolation and protect sensitive blocks from being degraded by substrate noise coupling. Several effects of substrate coupling on circuit performance will be identified and remedies will be given based on the design guide. Three case studies are designed to analyze the substrate coupling problem in RFICs. The case studies are designed to attack the problem from the device, circuit and system levels. On the device level a special emphasis is given to designing on chip inductors as an important device in RFIC. An accurate model is developed for a broadband fit of the inductor scattering parameters. This model is shown to be scalable and is proven to be accurate across various frequency bands and geometries. A special emphasis is put on the design for manufacturing effects that affect the design robustness. A circuit level case study is developed and results are compared to simulations and measurements to highlight the need for such a flow before tapping out to ensure a yielding part. The system level problem studied is a GSM receiver where the research results are directly applied to it as a demonstration vehicle to debug and resolve a system level substrate noise coupling problem that otherwise caused a product to be on the edge of malfunction.
Substrate Noise Coupling In Analog Rf Circuits
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Author : Stephane Bronckers
language : en
Publisher: Artech House
Release Date : 2010
Substrate Noise Coupling In Analog Rf Circuits written by Stephane Bronckers and has been published by Artech House this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010 with Technology & Engineering categories.
This book presents case studies to illustrate that careful modeling of the assembly characteristics and layout details is required to bring simulations and measurements into agreement. Engineers learn how to use a proper combination of isolation structures and circuit techniques to make analog/RF circuits more immune to substrate noise. Topics include substrate noise propagation, passive isolation structures, noise couple in active devices, measuring the coupling mechanisms in analog/RF circuits, prediction of the impact of substrate noise on analog/RF circuits, and noise coupling in analog/RF systems.
Analysis And Solutions For Switching Noise Coupling In Mixed Signal Ics
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Author : X. Aragones
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-03-09
Analysis And Solutions For Switching Noise Coupling In Mixed Signal Ics written by X. Aragones and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-03-09 with Technology & Engineering categories.
Modern microelectronic design is characterized by the integration of full systems on a single die. These systems often include large high performance digital circuitry, high resolution analog parts, high driving I/O, and maybe RF sections. Designers of such systems are constantly faced with the challenge to achieve compatibility in electrical characteristics of every section: some circuitry presents fast transients and large consumption spikes, whereas others require quiet environments to achieve resolutions well beyond millivolts. Coupling between those sections is usually unavoidable, since the entire system shares the same silicon substrate bulk and the same package. Understanding the way coupling is produced, and knowing methods to isolate coupled circuitry, and how to apply every method, is then mandatory knowledge for every IC designer. Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs is an in-depth look at coupling through the common silicon substrate, and noise at the power supply lines. It explains the elementary knowledge needed to understand these phenomena and presents a review of previous works and new research results. The aim is to provide an understanding of the reasons for these particular ways of coupling, review and suggest solutions to noise coupling, and provide criteria to apply noise reduction. Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs is an ideal book, both as introductory material to noise-coupling problems in mixed-signal ICs, and for more advanced designers facing this problem.
Substrate Noise Coupling In Mixed Signal Asics
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Author : Stéphane Donnay
language : en
Publisher: Springer Science & Business Media
Release Date : 2006-05-31
Substrate Noise Coupling In Mixed Signal Asics written by Stéphane Donnay and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-05-31 with Technology & Engineering categories.
This book is the first in a series of three dedicated to advanced topics in Mixed-Signal IC design methodologies. It is one of the results achieved by the Mixed-Signal Design Cluster, an initiative launched in 1998 as part of the TARDIS project, funded by the European Commission within the ESPRIT-IV Framework. This initiative aims to promote the development of new design and test methodologies for Mixed-Signal ICs, and to accelerate their adoption by industrial users. As Microelectronics evolves, Mixed-Signal techniques are gaining a significant importance due to the wide spread of applications where an analog front-end is needed to drive a complex digital-processing subsystem. In this sense, Analog and Mixed-Signal circuits are recognized as a bottleneck for the market acceptance of Systems-On-Chip, because of the inherent difficulties involved in the design and test of these circuits. Specially, problems arising from the use of a common substrate for analog and digital components are a main limiting factor. The Mixed-Signal Cluster has been formed by a group of 11 Research and Development projects, plus a specific action to promote the dissemination of design methodologies, techniques, and supporting tools developed within the Cluster projects. The whole action, ending in July 2002, has been assigned an overall budget of more than 8 million EURO.
Analyse Et Caract Risation Des Couplages Substrat Et De La Connectique Dans Les Circuits 3d
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Author : Fengyuan Sun
language : en
Publisher: Editions Publibook
Release Date : 2016
Analyse Et Caract Risation Des Couplages Substrat Et De La Connectique Dans Les Circuits 3d written by Fengyuan Sun and has been published by Editions Publibook this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016 with categories.
The proposal of doubling the number of transistors on an IC chip (with minimum costs and subtle innovations) every 24 months by Gordon Moore in 1965 (the so-called called Moore's law) has been the most powerful driver for the emphasis of the microelectronics industry in the past 50 years. This law enhances lithography scaling and integration, in 2D, of all functions on a single chip, increasingly through system-on-chip (SOC). On the other hand, the integration of all these functions can be achieved through 3D integrations . Generally speaking, 3D integration consists of 3D IC packaging, 3D IC integration, and 3D Si integration. They are different and mostly the TSV (through-silicon via) separates 3D IC packaging from 3D IC/Si integrations since the latter two uses TSVs, but 3D IC packaging does not. TSV (with a new concept that every chip or interposer could have two surfaces with circuits) is the heart of 3D IC/Si integrations. Continued technology scaling together with the integration of disparate technologies in a single chip means that device performance continues to outstrip interconnect and packaging capabilities, and hence there exist many difficult engineering challenges, most notably in power management, noise isolation, and intra and inter-chip communication. 3D Si integration is the right way to go and compete with Moore's law (more than Moore versus more Moore). However, it is still a long way to go. In this book, Fengyuan SUN proposes new substrate network extraction techniques. Using this latter, the substrate coupling and loss in IC's can be analyzed. He implements some Green/TLM (Transmission Line Matrix) algorithms in MATLAB. It permits to extract impedances between any number of embedded contacts or/and TSVS. He does investigate models of high aspect ratio TSV, on both analytical and numerical methods electromagnetic simulations. This model enables to extract substrate and TSV impedance, S parameters and parasitic elements, considering the variable resistivity of the substrate. It is full compatible with SPICE-like solvers and should allow an investigation in depth of TSV impact on circuit performance.
Noise Coupling In System On Chip
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Author : Thomas Noulis
language : en
Publisher: CRC Press
Release Date : 2018-01-09
Noise Coupling In System On Chip written by Thomas Noulis and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-01-09 with Technology & Engineering categories.
Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends.
Dissertation Abstracts International
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Author :
language : en
Publisher:
Release Date : 2008
Dissertation Abstracts International written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008 with Dissertations, Academic categories.
System On Chip
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Author : Bashir M. Al-Hashimi
language : en
Publisher: IET
Release Date : 2006-01-31
System On Chip written by Bashir M. Al-Hashimi and has been published by IET this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-01-31 with Computers categories.
This book highlights both the key achievements of electronic systems design targeting SoC implementation style, and the future challenges presented by the continuing scaling of CMOS technology.
Eda For Ic Implementation Circuit Design And Process Technology
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Author : Luciano Lavagno
language : en
Publisher: CRC Press
Release Date : 2018-10-03
Eda For Ic Implementation Circuit Design And Process Technology written by Luciano Lavagno and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-03 with Technology & Engineering categories.
Presenting a comprehensive overview of the design automation algorithms, tools, and methodologies used to design integrated circuits, the Electronic Design Automation for Integrated Circuits Handbook is available in two volumes. The second volume, EDA for IC Implementation, Circuit Design, and Process Technology, thoroughly examines real-time logic to GDSII (a file format used to transfer data of semiconductor physical layout), analog/mixed signal design, physical verification, and technology CAD (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability at the nanoscale, power supply network design and analysis, design modeling, and much more. Save on the complete set.