Cooling Of Microelectronic And Nanoelectronic Equipment Advances And Emerging Research

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Cooling Of Microelectronic And Nanoelectronic Equipment Advances And Emerging Research

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Author : Madhusudan Iyengar
language : en
Publisher: World Scientific
Release Date : 2014-08-25

Cooling Of Microelectronic And Nanoelectronic Equipment Advances And Emerging Research written by Madhusudan Iyengar and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-08-25 with Technology & Engineering categories.

To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.

Encyclopedia Of Thermal Packaging Set 2 Thermal Packaging Tools A 4 Volume Set

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Author :
language : en
Publisher: World Scientific
Release Date : 2014-10-23

Encyclopedia Of Thermal Packaging Set 2 Thermal Packaging Tools A 4 Volume Set written by and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-10-23 with Technology & Engineering categories.

remove This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 2: Thermal Packaging ToolsThe second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order “compact” thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve “correct by design” thermal packaging solutions.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.

Thermoelectric Energy Conversion Devices And Systems

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Author : Kazuaki Yazawa
language : en
Publisher: World Scientific
Release Date : 2021-02-23

Thermoelectric Energy Conversion Devices And Systems written by Kazuaki Yazawa and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-02-23 with Technology & Engineering categories.

This unique compendium emphasizes key factors driving the performance of thermoelectric energy conversion systems. Important design parameters such as heat transfer at the boundaries of the system, material properties, and form factors are carefully analyzed and optimized for performance including the cost-performance trade-off. Numbers of examples are provided on the applications of thermoelectric technologies, e.g., power generation, cooling of electronic components, and waste heat recovery in wearable devices.This must-have volume also includes an interactive modeling software package developed on the nanoHUB (https://nanohub.org/) platform. Professionals, researchers, academics, undergraduate and graduate students will be able to study the impact of material properties and key design parameters on the overall thermoelectric system performance as well as the large scale implementation in the society.

Solder Materials

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Author : Kwang-lung Lin
language : en
Publisher: World Scientific
Release Date : 2018-07-13

Solder Materials written by Kwang-lung Lin and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-07-13 with Technology & Engineering categories.

This book provides a comprehensive overview of important aspects of solder materials including solderability and soldering reaction, physical metallurgy, mechanical properties, electromigration, and reliability of solder joint. The scope of this book covers mainly, but not limited to, the important research achievements of all the subjects having been disclosed and discussed in the literatures. It is a very informative book for those who are interested in learning the material properties of solders, carrying out fundamental research, and in carrying out practical applications. This book is an important resource for the various important subjects relating to solder materials.

Mems Packaging

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Author : Yung-cheng Lee
language : en
Publisher: World Scientific
Release Date : 2018-01-03

Mems Packaging written by Yung-cheng Lee and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-01-03 with Technology & Engineering categories.

MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.

Encyclopedia Of Thermal Packaging Set 3 Thermal Packaging Applications A 3 Volume Set

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Author : Avram Bar-cohen
language : en
Publisher: World Scientific
Release Date : 2018-10-15

Encyclopedia Of Thermal Packaging Set 3 Thermal Packaging Applications A 3 Volume Set written by Avram Bar-cohen and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-15 with Technology & Engineering categories.

remove This Encyclopedia comes in 3 sets. To check out Set 1 and Set 2, please visit Set 1: Thermal Packaging Techniques and Set 2: Thermal Packaging Tools /remove Thermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems — are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) provides a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written volumes presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.Set 3: Thermal Packaging ApplicationsThe third set in the Encyclopedia includes two volumes in the planned focus on Thermal Packaging Applications and a single volume on the use of Phase Change Materials (PCM), a most important Thermal Management Technique, not previously addressed in the Encyclopedia. Set 3 opens with Heat Transfer in Avionic Equipment, authored by Dr Boris Abramzon, offering a comprehensive, in-depth treatment of compact heat exchangers and cold plates for avionics cooling, as well as discussion on recent developments in these heat transfer units that are widely used in the thermal control of military and civilian airborne electronics. Along with a detailed presentation of the relevant thermofluid physics and governing equations, and the supporting mathematical design and optimization techniques, the book offers a practical guide for thermal engineers designing avionics cooling equipment, based on the author's 20+ years of experience as a thermal analyst and a practical design engineer for Avionics and related systems.The Set continues with Thermal Management of RF Systems, which addresses sequentially the history, present practice, and future thermal management strategies for electronically-steered RF systems, in the context of the RF operational requirements, as well as device-, module-, and system-level electronic, thermal, and mechanical considerations. This unique text was written by 3 authors, Dr John D Albrecht, Mr David H Altman, Dr Joseph J Maurer, with extensive US Department of Defense and aerospace industry experience in the design, development, and fielding of RF systems. Their combined efforts have resulted in a text, which is well-grounded in the relevant past, present, and future RF systems and technologies. Thus, this volume will provide the designers of advanced radars and other electronic RF systems with the tools and the knowledge to address the thermal management challenges of today's technologies, as well as of advanced technologies, such as wide bandgap semiconductors, heterogeneously integrated devices, and 3D chipsets and stacks.The third volume in Set 3, Phase Change Materials for Thermal Management of Electronic Components, co-authored by Prof Gennady Ziskind and Dr Yoram Kozak, provides a detailed description of the numerical methods used in PCM analysis and a detailed explanation of the processes that accompany and characterize solid-liquid phase-change in popular basic and advanced geometries. These provide a foundation for an in-depth exploration of specific electronics thermal management applications of Phase Change Materials. This volume is anchored in the unique PCM knowledge and experience of the senior author and placed in the context of the extensive solid-liquid phase-change literature in such diverse fields as material science, mathematical modeling, experimental and numerical methods, and thermofluid science and engineering.Related Link(s)

Cost Analysis Of Electronic Systems Second Edition

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Author : Peter Sandborn
language : en
Publisher: World Scientific
Release Date : 2016-12-15

Cost Analysis Of Electronic Systems Second Edition written by Peter Sandborn and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-12-15 with Technology & Engineering categories.

This book provides an introduction to the cost modeling for electronic systems that is suitable for advanced undergraduate and graduate students in electrical, mechanical and industrial engineering, and professionals involved with electronics technology development and management. This book melds elements of traditional engineering economics with manufacturing process and life-cycle cost management concepts to form a practical foundation for predicting the cost of electronic products and systems. Various manufacturing cost analysis methods are addressed including: process-flow, parametric, cost of ownership, and activity based costing. The effects of learning curves, data uncertainty, test and rework processes, and defects are considered. Aspects of system sustainment and life-cycle cost modeling including reliability (warranty, burn-in), maintenance (sparing and availability), and obsolescence are treated. Finally, total cost of ownership of systems, return on investment, cost-benefit analysis, and real options analysis are addressed.

Electronics Cooling

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Author : S M Sohel Murshed
language : en
Publisher:
Release Date : 2016

Electronics Cooling written by S M Sohel Murshed and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016 with categories.

Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.

Emerging Trends In Nanotechnology

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Author : Zishan Husain Khan
language : en
Publisher: Springer Nature
Release Date : 2021-02-21

Emerging Trends In Nanotechnology written by Zishan Husain Khan and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-02-21 with Technology & Engineering categories.

This book discusses new trends in nanotechnology. It covers a wide range of topics starting from applications of nanomaterials in perovskite solar cells, pharmacy, and dentistry to self-assembled growth of GaN nanostructures on flexible metal foils by laser molecular beam epitaxy. It also includes other interesting topics such as advancement in carbon nanotubes; processing techniques, purification and industrial applications, metal di-chalcogenides for waste water treatment and recent advancement in nanostructured-based electrochemical genosensors for pathogen detection and many more. The book will be of great interest to researchers, professionals and students working in the areas of nanomaterials and nanotechnology.

Nanoelectronic Materials

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Author : Loutfy H. Madkour
language : en
Publisher: Springer
Release Date : 2020-08-15

Nanoelectronic Materials written by Loutfy H. Madkour and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-08-15 with Technology & Engineering categories.

This book presents synthesis techniques for the preparation of low-dimensional nanomaterials including 0D (quantum dots), 1D (nanowires, nanotubes) and 2D (thin films, few layers), as well as their potential applications in nanoelectronic systems. It focuses on the size effects involved in the transition from bulk materials to nanomaterials; the electronic properties of nanoscale devices; and different classes of nanomaterials from microelectronics to nanoelectronics, to molecular electronics. Furthermore, it demonstrates the structural stability, physical, chemical, magnetic, optical, electrical, thermal, electronic and mechanical properties of the nanomaterials. Subsequent chapters address their characterization, fabrication techniques from lab-scale to mass production, and functionality. In turn, the book considers the environmental impact of nanotechnology and novel applications in the mechanical industries, energy harvesting, clean energy, manufacturing materials, electronics, transistors, health and medical therapy. In closing, it addresses the combination of biological systems with nanoelectronics and highlights examples of nanoelectronic–cell interfaces and other advanced medical applications. The book answers the following questions: • What is different at the nanoscale? • What is new about nanoscience? • What are nanomaterials (NMs)? • What are the fundamental issues in nanomaterials? • Where are nanomaterials found? • What nanomaterials exist in nature? • What is the importance of NMs in our lives? • Why so much interest in nanomaterials? • What is at nanoscale in nanomaterials? • What is graphene? • Are pure low-dimensional systems interesting and worth pursuing? • Are nanotechnology products currently available? • What are sensors? • How can Artificial Intelligence (AI) and nanotechnology work together? • What are the recent advances in nanoelectronic materials? • What are the latest applications of NMs?