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Design Of Cost Efficient Interconnect Processing Units


Design Of Cost Efficient Interconnect Processing Units
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Design Of Cost Efficient Interconnect Processing Units


Design Of Cost Efficient Interconnect Processing Units
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Author : Marcello Coppola
language : en
Publisher: CRC Press
Release Date : 2020-10-14

Design Of Cost Efficient Interconnect Processing Units written by Marcello Coppola and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-10-14 with Technology & Engineering categories.


Streamlined Design Solutions Specifically for NoC To solve critical network-on-chip (NoC) architecture and design problems related to structure, performance and modularity, engineers generally rely on guidance from the abundance of literature about better-understood system-level interconnection networks. However, on-chip networks present several distinct challenges that require novel and specialized solutions not found in the tried-and-true system-level techniques. A Balanced Analysis of NoC Architecture As the first detailed description of the commercial Spidergon STNoC architecture, Design of Cost-Efficient Interconnect Processing Units: Spidergon STNoC examines the highly regarded, cost-cutting technology that is set to replace well-known shared bus architectures, such as STBus, for demanding multiprocessor system-on-chip (SoC) applications. Employing a balanced, well-organized structure, simple teaching methods, numerous illustrations, and easy-to-understand examples, the authors explain: how the SoC and NoC technology works why developers designed it the way they did the system-level design methodology and tools used to configure the Spidergon STNoC architecture differences in cost structure between NoCs and system-level networks From professionals in computer sciences, electrical engineering, and other related fields, to semiconductor vendors and investors – all readers will appreciate the encyclopedic treatment of background NoC information ranging from CMPs to the basics of interconnection networks. The text introduces innovative system-level design methodology and tools for efficient design space exploration and topology selection. It also provides a wealth of key theoretical and practical MPSoC and NoC topics, such as technological deep sub-micron effects, homogeneous and heterogeneous processor architectures, multicore SoC, interconnect processing units, generic NoC components, and embeddings of common communication patterns.



Design Of Cost Efficient Interconnect Processing Units


Design Of Cost Efficient Interconnect Processing Units
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Author : Marcello Coppola
language : en
Publisher: CRC Press
Release Date : 2018-10-03

Design Of Cost Efficient Interconnect Processing Units written by Marcello Coppola and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-03 with Technology & Engineering categories.


Streamlined Design Solutions Specifically for NoC To solve critical network-on-chip (NoC) architecture and design problems related to structure, performance and modularity, engineers generally rely on guidance from the abundance of literature about better-understood system-level interconnection networks. However, on-chip networks present several distinct challenges that require novel and specialized solutions not found in the tried-and-true system-level techniques. A Balanced Analysis of NoC Architecture As the first detailed description of the commercial Spidergon STNoC architecture, Design of Cost-Efficient Interconnect Processing Units: Spidergon STNoC examines the highly regarded, cost-cutting technology that is set to replace well-known shared bus architectures, such as STBus, for demanding multiprocessor system-on-chip (SoC) applications. Employing a balanced, well-organized structure, simple teaching methods, numerous illustrations, and easy-to-understand examples, the authors explain: how the SoC and NoC technology works why developers designed it the way they did the system-level design methodology and tools used to configure the Spidergon STNoC architecture differences in cost structure between NoCs and system-level networks From professionals in computer sciences, electrical engineering, and other related fields, to semiconductor vendors and investors – all readers will appreciate the encyclopedic treatment of background NoC information ranging from CMPs to the basics of interconnection networks. The text introduces innovative system-level design methodology and tools for efficient design space exploration and topology selection. It also provides a wealth of key theoretical and practical MPSoC and NoC topics, such as technological deep sub-micron effects, homogeneous and heterogeneous processor architectures, multicore SoC, interconnect processing units, generic NoC components, and embeddings of common communication patterns.



Designing 2d And 3d Network On Chip Architectures


Designing 2d And 3d Network On Chip Architectures
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Author : Konstantinos Tatas
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-10-08

Designing 2d And 3d Network On Chip Architectures written by Konstantinos Tatas and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-10-08 with Technology & Engineering categories.


This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.



On Chip Interconnect With Aelite


On Chip Interconnect With Aelite
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Author : Andreas Hansson
language : en
Publisher: Springer Science & Business Media
Release Date : 2010-10-20

On Chip Interconnect With Aelite written by Andreas Hansson and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-10-20 with Technology & Engineering categories.


The book provides a comprehensive description and implementation methodology for the Philips/NXP Aethereal/aelite Network-on-Chip (NoC). The presentation offers a systems perspective, starting from the system requirements and deriving and describing the resulting hardware architectures, embedded software, and accompanying design flow. Readers get an in depth view of the interconnect requirements, not centered only on performance and scalability, but also the multi-faceted, application-driven requirements, in particular composability and predictability. The book shows how these qualitative requirements are implemented in a state-of-the-art on-chip interconnect, and presents the realistic, quantitative costs.



Multiprocessor System On Chip


Multiprocessor System On Chip
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Author : Michael Hübner
language : en
Publisher: Springer Science & Business Media
Release Date : 2010-11-25

Multiprocessor System On Chip written by Michael Hübner and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-11-25 with Technology & Engineering categories.


The purpose of this book is to evaluate strategies for future system design in multiprocessor system-on-chip (MPSoC) architectures. Both hardware design and integration of new development tools will be discussed. Novel trends in MPSoC design, combined with reconfigurable architectures are a main topic of concern. The main emphasis is on architectures, design-flow, tool-development, applications and system design.



Vlsi 2010 Annual Symposium


Vlsi 2010 Annual Symposium
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Author : Nikolaos Voros
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-09-08

Vlsi 2010 Annual Symposium written by Nikolaos Voros and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-09-08 with Technology & Engineering categories.


VLSI 2010 Annual Symposium will present extended versions of the best papers presented in ISVLSI 2010 conference. The areas covered by the papers will include among others: Emerging Trends in VLSI, Nanoelectronics, Molecular, Biological and Quantum Computing. MEMS, VLSI Circuits and Systems, Field-programmable and Reconfigurable Systems, System Level Design, System-on-a-Chip Design, Application-Specific Low Power, VLSI System Design, System Issues in Complexity, Low Power, Heat Dissipation, Power Awareness in VLSI Design, Test and Verification, Mixed-Signal Design and Analysis, Electrical/Packaging Co-Design, Physical Design, Intellectual property creating and sharing.



Routing Algorithms In Networks On Chip


Routing Algorithms In Networks On Chip
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Author : Maurizio Palesi
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-10-22

Routing Algorithms In Networks On Chip written by Maurizio Palesi and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-10-22 with Technology & Engineering categories.


This book provides a single-source reference to routing algorithms for Networks-on-Chip (NoCs), as well as in-depth discussions of advanced solutions applied to current and next generation, many core NoC-based Systems-on-Chip (SoCs). After a basic introduction to the NoC design paradigm and architectures, routing algorithms for NoC architectures are presented and discussed at all abstraction levels, from the algorithmic level to actual implementation. Coverage emphasizes the role played by the routing algorithm and is organized around key problems affecting current and next generation, many-core SoCs. A selection of routing algorithms is included, specifically designed to address key issues faced by designers in the ultra-deep sub-micron (UDSM) era, including performance improvement, power, energy, and thermal issues, fault tolerance and reliability.



On Chip Networks


On Chip Networks
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Author : Natalie Enright
language : en
Publisher: Springer Nature
Release Date : 2022-11-10

On Chip Networks written by Natalie Enright and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-11-10 with Technology & Engineering categories.


With the ability to integrate a large number of cores on a single chip, research into on-chip networks to facilitate communication becomes increasingly important. On-chip networks seek to provide a scalable and high-bandwidth communication substrate for multi-core and many-core architectures. High bandwidth and low latency within the on-chip network must be achieved while fitting within tight area and power budgets. In this lecture, we examine various fundamental aspects of on-chip network design and provide the reader with an overview of the current state-of-the-art research in this field. Table of Contents: Introduction / Interface with System Architecture / Topology / Routing / Flow Control / Router Microarchitecture / Conclusions



Multi Core Embedded Systems


Multi Core Embedded Systems
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Author : Georgios Kornaros
language : en
Publisher: CRC Press
Release Date : 2018-10-08

Multi Core Embedded Systems written by Georgios Kornaros and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-08 with Computers categories.


Details a real-world product that applies a cutting-edge multi-core architecture Increasingly demanding modern applications—such as those used in telecommunications networking and real-time processing of audio, video, and multimedia streams—require multiple processors to achieve computational performance at the rate of a few giga-operations per second. This necessity for speed and manageable power consumption makes it likely that the next generation of embedded processing systems will include hundreds of cores, while being increasingly programmable, blending processors and configurable hardware in a power-efficient manner. Multi-Core Embedded Systems presents a variety of perspectives that elucidate the technical challenges associated with such increased integration of homogeneous (processors) and heterogeneous multiple cores. It offers an analysis that industry engineers and professionals will need to understand the physical details of both software and hardware in embedded architectures, as well as their limitations and potential for future growth. Discusses the available programming models spread across different abstraction levels The book begins with an overview of the evolution of multiprocessor architectures for embedded applications and discusses techniques for autonomous power management of system-level parameters. It addresses the use of existing open-source (and free) tools originating from several application domains—such as traffic modeling, graph theory, parallel computing and network simulation. In addition, the authors cover other important topics associated with multi-core embedded systems, such as: Architectures and interconnects Embedded design methodologies Mapping of applications



Artificial Intelligence For Digitising Industry Applications


Artificial Intelligence For Digitising Industry Applications
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Author : Ovidiu Vermesan
language : en
Publisher: CRC Press
Release Date : 2022-09-01

Artificial Intelligence For Digitising Industry Applications written by Ovidiu Vermesan and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-09-01 with Medical categories.


This book provides in-depth insights into use cases implementing artificial intelligence (AI) applications at the edge. It covers new ideas, concepts, research, and innovation to enable the development and deployment of AI, the industrial internet of things (IIoT), edge computing, and digital twin technologies in industrial environments. The work is based on the research results and activities of the AI4DI project, including an overview of industrial use cases, research, technological innovation, validation, and deployment. This book’s sections build on the research, development, and innovative ideas elaborated for applications in five industries: automotive, semiconductor, industrial machinery, food and beverage, and transportation. The articles included under each of these five industrial sectors discuss AI-based methods, techniques, models, algorithms, and supporting technologies, such as IIoT, edge computing, digital twins, collaborative robots, silicon-born AI circuit concepts, neuromorphic architectures, and augmented intelligence, that are anticipating the development of Industry 5.0. Automotive applications cover use cases addressing AI-based solutions for inbound logistics and assembly process optimisation, autonomous reconfigurable battery systems, virtual AI training platforms for robot learning, autonomous mobile robotic agents, and predictive maintenance for machines on the level of a digital twin. AI-based technologies and applications in the semiconductor manufacturing industry address use cases related to AI-based failure modes and effects analysis assistants, neural networks for predicting critical 3D dimensions in MEMS inertial sensors, machine vision systems developed in the wafer inspection production line, semiconductor wafer fault classifications, automatic inspection of scanning electron microscope cross-section images for technology verification, anomaly detection on wire bond process trace data, and optical inspection. The use cases presented for machinery and industrial equipment industry applications cover topics related to wood machinery, with the perception of the surrounding environment and intelligent robot applications. AI, IIoT, and robotics solutions are highlighted for the food and beverage industry, presenting use cases addressing novel AI-based environmental monitoring; autonomous environment-aware, quality control systems for Champagne production; and production process optimisation and predictive maintenance for soybeans manufacturing. For the transportation sector, the use cases presented cover the mobility-as-a-service development of AI-based fleet management for supporting multimodal transport. This book highlights the significant technological challenges that AI application developments in industrial sectors are facing, presenting several research challenges and open issues that should guide future development for evolution towards an environment-friendly Industry 5.0. The challenges presented for AI-based applications in industrial environments include issues related to complexity, multidisciplinary and heterogeneity, convergence of AI with other technologies, energy consumption and efficiency, knowledge acquisition, reasoning with limited data, fusion of heterogeneous data, availability of reliable data sets, verification, validation, and testing for decision-making processes.