Development Of Liquid Crystalline Polymer Lcp Surface Mount Packages For Millimeter Wave Applications
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Development Of Liquid Crystalline Polymer Lcp Surface Mount Packages For Millimeter Wave Applications
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Author : Mark Patrick McGrath
language : en
Publisher:
Release Date : 2008
Development Of Liquid Crystalline Polymer Lcp Surface Mount Packages For Millimeter Wave Applications written by Mark Patrick McGrath and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008 with categories.
Development Of Liquid Crystalline Polymer Lcp Surface Mount Packages For Ka Band Applications
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Author : Kunia Aihara
language : en
Publisher:
Release Date : 2008
Development Of Liquid Crystalline Polymer Lcp Surface Mount Packages For Ka Band Applications written by Kunia Aihara and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008 with categories.
Microwaves Millimeter Wave And Terahertz Liquid Crystals
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Author : Anyong Qing
language : en
Publisher: Springer Nature
Release Date : 2024-03-05
Microwaves Millimeter Wave And Terahertz Liquid Crystals written by Anyong Qing and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-03-05 with Technology & Engineering categories.
This book is the first ever monograph on nematic liquid crystals for microwaves, millimeter waves and terahertz waves. It presents the first hand independent studies on nematic liquid crystals for microwaves, millimeter waves and terahertz waves. This book opens with an introduction to generic liquid crystals and a retrospective review about nematic liquid crystals in microwaves, millimeter waves and terahertz waves. Attention is then focused on the latest in-house progress on microwave, millimeter wave and terahertz nematic liquid crystals. Synthesis and characterization of novel nematic liquid crystals are first presented, followed by indigenous technologies to manufacture functional nematic liquid crystal devices for microwaves, millimeter waves and terahertz waves. A few self-developed representative advanced functional devices are shown to demonstrate the promising perspective of liquid crystals for not only microwaves, millimeter waves and terahertz waves but also many other non-display applications. The presented studies will attract scientists, engineers and students from various disciplines, such as materials, chemical, electrical, biological, and biomedical engineering. The book is intended for undergraduates, graduates, researchers, professionals and industrial practitioners who are interested in developing novel liquid crystals and further extending liquid crystals beyond display.
Rf And Microwave Microelectronics Packaging
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Author : Ken Kuang
language : en
Publisher: Springer Science & Business Media
Release Date : 2009-12-01
Rf And Microwave Microelectronics Packaging written by Ken Kuang and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-12-01 with Technology & Engineering categories.
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
Advanced Millimeter Wave Technologies
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Author : Duixian Liu
language : en
Publisher: John Wiley & Sons
Release Date : 2009-03-03
Advanced Millimeter Wave Technologies written by Duixian Liu and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-03-03 with Technology & Engineering categories.
This book explains one of the hottest topics in wireless and electronic devices community, namely the wireless communication at mmWave frequencies, especially at the 60 GHz ISM band. It provides the reader with knowledge and techniques for mmWave antenna design, evaluation, antenna and chip packaging. Addresses practical engineering issues such as RF material evaluation and selection, antenna and packaging requirements, manufacturing tolerances, antenna and system interconnections, and antenna One of the first books to discuss the emerging research and application areas, particularly chip packages with integrated antennas, wafer scale mmWave phased arrays and imaging Contains a good number of case studies to aid understanding Provides the antenna and packaging technologies for the latest and emerging applications with the emphases on antenna integrations for practical applications such as wireless USB, wireless video, phase array, automobile collision avoidance radar, and imaging
Development Of Liquid Crystalline Polymer Lcp Packaging For High Power Rf Millimeter Wave Applications
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Author : Cheng Chen
language : en
Publisher:
Release Date : 2011
Development Of Liquid Crystalline Polymer Lcp Packaging For High Power Rf Millimeter Wave Applications written by Cheng Chen and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011 with categories.
This research project presents the design and development of a high frequency surface mount package (SMT) for high power microwave/millimeter-wave applications using liquid crystalline polymer (LCP). As microwave frequencies, the demand for greater power output is rapidly increasing due to many RF system requirements such as higher data rate, larger cell base station coverage. A package with GaAs 4-Watt amplifier is demonstrated to be able to handle ~10 Watt DC power dissipation. Two methods are used to measure the package thermal resistances. Both temperature results are below the allowable 150°C maximum temperature. The electrical feed-through of the package provides signal path traveling from the device to the printed circuit board (PCB) has been demonstrated individually and using commercial product. At Ka-band feed-through of the package show theoretical insertion loss of less than -0.5dB and actual measurement of -1.5dB. Return loss is less than -10dB all the way up to 46GHz. The sparse via experiment indicates that with 24.4% via number reduction, thermal and electrical results still remain acceptable. Lastly, to utilize the package spacing, two types of class-A amplifiers are designed and measured using the proposed LCP package. The single transistor amplifier has smaller size as it is only consist of the input and output matching networks. The measured and simulation small-signal gain only has 0.27dB difference while the power output differs by 1.01dB.
Lcp For Microwave Packages And Modules
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Author : Anh-Vu H. Pham
language : en
Publisher: Cambridge University Press
Release Date : 2012-06-21
Lcp For Microwave Packages And Modules written by Anh-Vu H. Pham and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-06-21 with Science categories.
A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP) at package, component and system levels, providing a detailed look at everything you need to know to get up-to-speed on the subject, including successful design details, techniques and potential pitfalls.
Passive Rf Component Technology
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Author : Guo'an Wang
language : en
Publisher: Artech House
Release Date : 2012
Passive Rf Component Technology written by Guo'an Wang and has been published by Artech House this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012 with Technology & Engineering categories.
Focusing on novel materials and techniques, this pioneering volume provides you with a solid understanding of the design and fabrication of smart RF passive components. You find comprehensive details on LCP, metal materials, ferrite materials, nano materials, high aspect ratio enabled materials, green materials for RFID, and silicon micromachining techniques. Moreover, this practical book offers expert guidance on how to apply these materials and techniques to design a wide range of cutting-edge RF passive components, from MEMS switch based tunable passives and 3D passives, to metamaterial-based passives and on-chip passives. Supported with over 145 illustrations, this forward-looking resource summarizes the growing trend of smart RF passive component design and serves as a guide to the performance improving and cost-down solutions this technology offers the next generation of wireless communications.
Electrical Performance Of Electronic Packaging
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Author :
language : en
Publisher:
Release Date : 2004
Electrical Performance Of Electronic Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with Electronic packaging categories.
Microwave Journal
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Author :
language : en
Publisher:
Release Date : 2006
Microwave Journal written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006 with Microwaves categories.