Efficient Calculation Of Time Domain Waveform Sensitivities In Asymptotic Waveform Evaluation
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Efficient Calculation Of Time Domain Waveform Sensitivities In Asymptotic Waveform Evaluation
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Author : Ashok Balivada
language : en
Publisher:
Release Date : 1991
Efficient Calculation Of Time Domain Waveform Sensitivities In Asymptotic Waveform Evaluation written by Ashok Balivada and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1991 with Electric waves categories.
Masters Theses In The Pure And Applied Sciences
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Author : Wade H. Shafer
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Masters Theses In The Pure And Applied Sciences written by Wade H. Shafer and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Science categories.
Masters Theses in the Pure and Applied Sciences was first conceived, published, and disseminated by the Center for Information and Numerical Data Analysis and Synthesis (CINDAS) * at Purdue University in 1 957, starting its coverage of theses with the academic year 1955. Beginning with Volume 13, the printing and dissemination phases of the activity were transferred to University Microfilms/Xerox of Ann Arbor, Michigan, with the thought that such an arrangement would be more beneficial to the academic and general scientific and technical community. After five years of this joint undertaking we had concluded that it was in the interest of all con cerned if the printing and distribution of the volumes were handled by an interna tional publishing house to assure improved service and broader dissemination. Hence, starting with Volume 18, Masters Theses in the Pure and Applied Sciences has been disseminated on a worldwide basis by Plenum Publishing Cor poration of New York, and in the same year the coverage was broadened to include Canadian universities. All back issues can also be ordered from Plenum. We have reported in Volume 36 (thesis year 1991) a total of 11,024 thesis titles from 23 Canadian and 161 United States universities. We are sure that this broader base for these titles reported will greatly enhance the value of this important annual reference work. While Volume 36 reports theses submitted in 1991, on occasion, certain univer sities do report theses submitted in previous years but not reported at the time.
Digital Timing Macromodeling For Vlsi Design Verification
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Author : Jeong-Taek Kong
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Digital Timing Macromodeling For Vlsi Design Verification written by Jeong-Taek Kong and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
Digital Timing Macromodeling for VLSI Design Verification first of all provides an extensive history of the development of simulation techniques. It presents detailed discussion of the various techniques implemented in circuit, timing, fast-timing, switch-level timing, switch-level, and gate-level simulation. It also discusses mixed-mode simulation and interconnection analysis methods. The review in Chapter 2 gives an understanding of the advantages and disadvantages of the many techniques applied in modern digital macromodels. The book also presents a wide variety of techniques for performing nonlinear macromodeling of digital MOS subcircuits which address a large number of shortcomings in existing digital MOS macromodels. Specifically, the techniques address the device model detail, transistor coupling capacitance, effective channel length modulation, series transistor reduction, effective transconductance, input terminal dependence, gate parasitic capacitance, the body effect, the impact of parasitic RC-interconnects, and the effect of transmission gates. The techniques address major sources of errors in existing macromodeling techniques, which must be addressed if macromodeling is to be accepted in commercial CAD tools by chip designers. The techniques presented in Chapters 4-6 can be implemented in other macromodels, and are demonstrated using the macromodel presented in Chapter 3. The new techniques are validated over an extremely wide range of operating conditions: much wider than has been presented for previous macromodels, thus demonstrating the wide range of applicability of these techniques.
Masters Theses In The Pure And Applied Sciences
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Author : W. H. Shafer
language : en
Publisher: Springer Science & Business Media
Release Date : 1993
Masters Theses In The Pure And Applied Sciences written by W. H. Shafer and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993 with Education categories.
Volume 36 reports (for thesis year 1991) a total of 11,024 thesis titles from 23 Canadian and 161 US universities. The organization of the volume, as in past years, consists of thesis titles arranged by discipline, and by university within each discipline. The titles are contributed by any and all a
On Chip Inductance In High Speed Integrated Circuits
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Author : Yehea I. Ismail
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
On Chip Inductance In High Speed Integrated Circuits written by Yehea I. Ismail and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
The appropriate interconnect model has changed several times over the past two decades due to the application of aggressive technology scaling. New, more accurate interconnect models are required to manage the changing physical characteristics of integrated circuits. Currently, RC models are used to analyze high resistance nets while capacitive models are used for less resistive interconnect. However, on-chip inductance is becoming more important with integrated circuits operating at higher frequencies, since the inductive impedance is proportional to the frequency. The operating frequencies of integrated circuits have increased dramatically over the past decade and are expected to maintain the same rate of increase over the next decade, approaching 10 GHz by the year 2012. Also, wide wires are frequently encountered in important global nets, such as clock distribution networks and in upper metal layers, and performance requirements are pushing the introduction of new materials for low resistance interconnect, such as copper interconnect already used in many commercial CMOS technologies. On-Chip Inductance in High Speed Integrated Circuits deals with the design and analysis of integrated circuits with a specific focus on on-chip inductance effects. It has been described throughout this book that inductance can have a tangible effect on current high speed integrated circuits. For example, neglecting inductance and using an RC interconnect model in a production 0.25 mum CMOS technology can cause large errors (over 35%) in estimates of the propagation delay of on-chip interconnect. It has also been shown that including inductance in the repeater insertion design process as compared to using an RC model improves the overall repeater solution in terms of area, power, and delay with average savings of 40.8%, 15.6%, and 6.7%, respectively. On-Chip Inductance in High Speed Integrated Circuitsis full of design and analysis techniques for RLC interconnect. These techniques are compared to techniques traditionally used for RC interconnect design to emphasize the effect of inductance. emOn-Chip Inductance in High Speed Integrated Circuits will be of interest to researchers in the area of high frequency interconnect, noise, and high performance integrated circuit design.
Advanced Symbolic Analysis For Vlsi Systems
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Author : Guoyong Shi
language : en
Publisher: Springer
Release Date : 2014-06-19
Advanced Symbolic Analysis For Vlsi Systems written by Guoyong Shi and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-06-19 with Technology & Engineering categories.
This book provides comprehensive coverage of the recent advances in symbolic analysis techniques for design automation of nanometer VLSI systems. The presentation is organized in parts of fundamentals, basic implementation methods and applications for VLSI design. Topics emphasized include statistical timing and crosstalk analysis, statistical and parallel analysis, performance bound analysis and behavioral modeling for analog integrated circuits. Among the recent advances, the Binary Decision Diagram (BDD) based approaches are studied in depth. The BDD-based hierarchical symbolic analysis approaches, have essentially broken the analog circuit size barrier.
Modeling And Simulation Of High Speed Vlsi Interconnects
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Author : Michel S. Nakhla
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-06-28
Modeling And Simulation Of High Speed Vlsi Interconnects written by Michel S. Nakhla and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-06-28 with Technology & Engineering categories.
Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area. Modeling and Simulation of High Speed VLSI Interconnects serves as an excellent reference, providing insight into some of the most important issues in the field.
Modeling And Design Of Electromagnetic Compatibility For High Speed Printed Circuit Boards And Packaging
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Author : Xing-Chang Wei
language : en
Publisher: CRC Press
Release Date : 2017-09-19
Modeling And Design Of Electromagnetic Compatibility For High Speed Printed Circuit Boards And Packaging written by Xing-Chang Wei and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-09-19 with Computers categories.
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.
A Top Down Constraint Driven Design Methodology For Analog Integrated Circuits
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Author : Henry Chang
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-06-28
A Top Down Constraint Driven Design Methodology For Analog Integrated Circuits written by Henry Chang and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-06-28 with Technology & Engineering categories.
Analog circuit design is often the bottleneck when designing mixed analog-digital systems. A Top-Down, Constraint-Driven Design Methodology for Analog Integrated Circuits presents a new methodology based on a top-down, constraint-driven design paradigm that provides a solution to this problem. This methodology has two principal advantages: (1) it provides a high probability for the first silicon which meets all specifications, and (2) it shortens the design cycle. A Top-Down, Constraint-Driven Design Methodology for Analog Integrated Circuits is part of an ongoing research effort at the University of California at Berkeley in the Electrical Engineering and Computer Sciences Department. Many faculty and students, past and present, are working on this design methodology and its supporting tools. The principal goals are: (1) developing the design methodology, (2) developing and applying new tools, and (3) `proving' the methodology by undertaking `industrial strength' design examples. The work presented here is neither a beginning nor an end in the development of a complete top-down, constraint-driven design methodology, but rather a step in its development. This work is divided into three parts. Chapter 2 presents the design methodology along with foundation material. Chapters 3-8 describe supporting concepts for the methodology, from behavioral simulation and modeling to circuit module generators. Finally, Chapters 9-11 illustrate the methodology in detail by presenting the entire design cycle through three large-scale examples. These include the design of a current source D/A converter, a Sigma-Delta A/D converter, and a video driver system. Chapter 12 presents conclusions and current research topics. A Top-Down, Constraint-Driven Design Methodology for Analog Integrated Circuits will be of interest to analog and mixed-signal designers as well as CAD tool developers.
Model Reduction For Circuit Simulation
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Author : Peter Benner
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-03-25
Model Reduction For Circuit Simulation written by Peter Benner and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-03-25 with Technology & Engineering categories.
Simulation based on mathematical models plays a major role in computer aided design of integrated circuits (ICs). Decreasing structure sizes, increasing packing densities and driving frequencies require the use of refined mathematical models, and to take into account secondary, parasitic effects. This leads to very high dimensional problems which nowadays require simulation times too large for the short time-to-market demands in industry. Modern Model Order Reduction (MOR) techniques present a way out of this dilemma in providing surrogate models which keep the main characteristics of the device while requiring a significantly lower simulation time than the full model. With Model Reduction for Circuit Simulation we survey the state of the art in the challenging research field of MOR for ICs, and also address its future research directions. Special emphasis is taken on aspects stemming from miniturisations to the nano scale. Contributions cover complexity reduction using e.g., balanced truncation, Krylov-techniques or POD approaches. For semiconductor applications a focus is on generalising current techniques to differential-algebraic equations, on including design parameters, on preserving stability, and on including nonlinearity by means of piecewise linearisations along solution trajectories (TPWL) and interpolation techniques for nonlinear parts. Furthermore the influence of interconnects and power grids on the physical properties of the device is considered, and also top-down system design approaches in which detailed block descriptions are combined with behavioral models. Further topics consider MOR and the combination of approaches from optimisation and statistics, and the inclusion of PDE models with emphasis on MOR for the resulting partial differential algebraic systems. The methods which currently are being developed have also relevance in other application areas such as mechanical multibody systems, and systems arising in chemistry and to biology. The current number of books in the area of MOR for ICs is very limited, so that this volume helps to fill a gap in providing the state of the art material, and to stimulate further research in this area of MOR. Model Reduction for Circuit Simulation also reflects and documents the vivid interaction between three active research projects in this area, namely the EU-Marie Curie Action ToK project O-MOORE-NICE (members in Belgium, The Netherlands and Germany), the EU-Marie Curie Action RTN-project COMSON (members in The Netherlands, Italy, Germany, and Romania), and the German federal project System reduction in nano-electronics (SyreNe).