Electrical Thermal Modeling And Simulation For Three Dimensional Integrated Systems
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Electrical Thermal Modeling And Simulation For Three Dimensional Integrated Systems
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Author : Jianyong Xie
language : en
Publisher:
Release Date : 2013
Electrical Thermal Modeling And Simulation For Three Dimensional Integrated Systems written by Jianyong Xie and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013 with Interconnects (Integrated circuit technology) categories.
The continuous miniaturization of electronic systems using the three-dimensional (3D) integration technique has brought in new challenges for the computer-aided design and modeling of 3D integrated circuits (ICs) and systems. The major challenges for the modeling and analysis of 3D integrated systems mainly stem from four aspects: (a) the interaction between the electrical and thermal domains in an integrated system, (b) the increasing modeling complexity arising from 3D systems requires the development of multiscale techniques for the modeling and analysis of DC voltage drop, thermal gradients, and electromagnetic behaviors, (c) efficient modeling of microfluidic cooling, and (d) the demand of performing fast thermal simulation with varying design parameters. Addressing these challenges for the electrical/thermal modeling and analysis of 3D systems necessitates the development of novel numerical modeling methods. This dissertation mainly focuses on developing efficient electrical and thermal numerical modeling and co-simulation methods for 3D integrated systems. The developed numerical methods can be classified into three categories. The first category aims to investigate the interaction between electrical and thermal characteristics for power delivery networks (PDNs) in steady state and the thermal effect on characteristics of through-silicon via (TSV) arrays at high frequencies. The steady-state electrical-thermal interaction for PDNs is addressed by developing a voltage drop-thermal co-simulation method while the thermal effect on TSV characteristics is studied by proposing a thermal-electrical analysis approach for TSV arrays. The second category of numerical methods focuses on developing multiscale modeling approaches for the voltage drop and thermal analysis. A multiscale modeling method based on the finite-element non-conformal domain decomposition technique has been developed for the voltage drop and thermal analysis of 3D systems. The proposed method allows the modeling of a 3D multiscale system using independent mesh grids in sub-domains. As a result, the system unknowns can be greatly reduced. In addition, to improve the simulation efficiency, the cascadic multigrid solving approach has been adopted for the voltage drop-thermal co-simulation with a large number of unknowns. The focus of the last category is to develop fast thermal simulation methods using compact models and model order reduction (MOR). To overcome the computational cost using the computational fluid dynamics simulation, a finite-volume compact thermal model has been developed for the microchannel-based fluidic cooling. This compact thermal model enables the fast thermal simulation of 3D ICs with a large number of microchannels for early-stage design. In addition, a system-level thermal modeling method using domain decomposition and model order reduction is developed for both the steady-state and transient thermal analysis. The proposed approach can efficiently support thermal modeling with varying design parameters without using parameterized MOR techniques.
Thermal And Electro Thermal System Simulation
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Author : Márta Rencz
language : en
Publisher: MDPI
Release Date : 2019-11-18
Thermal And Electro Thermal System Simulation written by Márta Rencz and has been published by MDPI this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-11-18 with Technology & Engineering categories.
With increasing power levels and power densities in electronics systems, thermal issues are becoming more and more critical. The elevated temperatures result in changing electrical system parameters, changing the operation of devices, and sometimes even the destruction of devices. To prevent this, the thermal behavior has to be considered in the design phase. This can be done with thermal end electro-thermal design and simulation tools. This Special Issue of Energies, edited by two well-known experts of the field, Prof. Marta Rencz, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects twelve papers carefully selected for the representation of the latest results in thermal and electro-thermal system simulation. These contributions present a good survey of the latest results in one of the most topical areas in the field of electronics: The thermal and electro-thermal simulation of electronic components and systems. Several papers of this issue are extended versions of papers presented at the THERMINIC 2018 Workshop, held in Stockholm in the fall of 2018. The papers presented here deal with modeling and simulation of state-of-the-art applications that are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. Contributions covered the thermal simulation of electronic packages, electro-thermal advanced modeling in power electronics, multi-physics modeling and simulation of LEDs, and the characterization of interface materials, among other subjects.
Thermal Modeling Of Three Dimensional Integrated Circuits Considering The Thermal Removal Capability Of Different Tsvs
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Author : Hua Ding
language : en
Publisher:
Release Date : 2011
Thermal Modeling Of Three Dimensional Integrated Circuits Considering The Thermal Removal Capability Of Different Tsvs written by Hua Ding and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011 with Integrated circuits categories.
Design And Modeling For 3d Ics And Interposers
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Author : Madhavan Swaminathan
language : en
Publisher: World Scientific
Release Date : 2013-11-05
Design And Modeling For 3d Ics And Interposers written by Madhavan Swaminathan and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-05 with Technology & Engineering categories.
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.
Three Dimensional System Integration
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Author : Antonis Papanikolaou
language : en
Publisher: Springer Science & Business Media
Release Date : 2010-12-07
Three Dimensional System Integration written by Antonis Papanikolaou and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-12-07 with Architecture categories.
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.
Modelling And Simulation Of Integrated Systems In Engineering
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Author : D J Murray-Smith
language : en
Publisher: Elsevier
Release Date : 2012-05-30
Modelling And Simulation Of Integrated Systems In Engineering written by D J Murray-Smith and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-05-30 with Computers categories.
This book places particular emphasis on issues of model quality and ideas of model testing and validation. Mathematical and computer-based models provide a foundation for explaining complex behaviour, decision-making, engineering design and for real-time simulators for research and training. Many engineering design techniques depend on suitable models, assessment of the adequacy of a given model for an intended application is therefore critically important. Generic model structures and dependable libraries of sub-models that can be applied repeatedly are increasingly important. Applications are drawn from the fields of mechanical, aeronautical and control engineering, and involve non-linear lumped-parameter models described by ordinary differential equations. Focuses on issues of model quality and the suitability of a given model for a specific application Multidisciplinary problems within engineering feature strongly in the applications The development and testing of nonlinear dynamic models is given very strong emphasis
Thermal Analysis For Multiprocessor Systems Of Three Dimensional Integrated Circuits
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Author : 呂良盈
language : en
Publisher:
Release Date : 2018
Thermal Analysis For Multiprocessor Systems Of Three Dimensional Integrated Circuits written by 呂良盈 and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018 with categories.
Design Energy Simulation For Architects
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Author : Kjell Anderson
language : en
Publisher: Routledge
Release Date : 2014-01-23
Design Energy Simulation For Architects written by Kjell Anderson and has been published by Routledge this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-01-23 with Architecture categories.
Leading architectural firms are now using in-house design simulation to help make more sustainable design decisions. Taking advantage of these new tools requires understanding of what can be done with simulation, how to do it, and how to interpret the results. This software-agnostic book, which is intended for you to use as a professional architect, shows you how to reduce the energy use of all buildings using simulation for shading, daylighting, airflow, and energy modeling. Written by a practicing architect who specializes in design simulation, the book includes 30 case studies of net-zero buildings, as well as of projects with less lofty goals, to demonstrate how energy simulation has helped designers make early decisions. Within each case study, author Kjell Anderson mentions the software used, how the simulation was set up, and how the project team used the simulation to make design decisions. Chapters and case studies are written so that you learn general concepts without being tied to particular software. Each chapter builds on the theory from previous chapters, includes a summary of concept-level hand calculations (if applicable), and gives comprehensive explanations with graphic examples. Additional topics include simulation basics, comfort, climate analysis, a discussion on how simulation is integrated into some firms, and an overview of some popular design simulation software.
Thermal And Electro Thermal System Simulation 2020
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Author : Márta Rencz
language : en
Publisher: MDPI
Release Date : 2021-01-12
Thermal And Electro Thermal System Simulation 2020 written by Márta Rencz and has been published by MDPI this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-01-12 with Technology & Engineering categories.
This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
Observations Sur L Expos De La Contestation Actuelle De S M Le Roi De Prusse Avec La Ville De Danzig
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Author :
language : en
Publisher:
Release Date : 1783
Observations Sur L Expos De La Contestation Actuelle De S M Le Roi De Prusse Avec La Ville De Danzig written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1783 with categories.