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Design And Modeling For 3d Ics And Interposers

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Design And Modeling For 3d Ics And Interposers

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Author : Madhavan Swaminathan
language : en
Publisher: World Scientific
Release Date : 2013-11-05

Design And Modeling For 3d Ics And Interposers written by Madhavan Swaminathan and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-05 with Technology & Engineering categories.

3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

Design And Modeling For 3d Ics And Interposers

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Author : Madhavan Swaminathan
language : en
Publisher: World Scientific
Release Date : 2013-11-05

Electronic Design Automation For Ic Implementation Circuit Design And Process Technology

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Author : Luciano Lavagno
language : en
Publisher: CRC Press
Release Date : 2017-02-03

Electronic Design Automation For Ic Implementation Circuit Design And Process Technology written by Luciano Lavagno and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-02-03 with Technology & Engineering categories.

The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.

Electronic Packaging Science And Technology

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Author : King-Ning Tu
language : en
Publisher: John Wiley & Sons
Release Date : 2021-12-14

Electronic Packaging Science And Technology written by King-Ning Tu and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-12-14 with Science categories.

Must-have reference on electronic packaging technology! The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology.

Machine Learning Applications In Electronic Design Automation

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Author : Haoxing Ren
language : en
Publisher: Springer Nature
Release Date : 2023-01-01

Machine Learning Applications In Electronic Design Automation written by Haoxing Ren and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-01-01 with Technology & Engineering categories.

This book serves as a single-source reference to key machine learning (ML) applications and methods in digital and analog design and verification. Experts from academia and industry cover a wide range of the latest research on ML applications in electronic design automation (EDA), including analysis and optimization of digital design, analysis and optimization of analog design, as well as functional verification, FPGA and system level designs, design for manufacturing (DFM), and design space exploration. The authors also cover key ML methods such as classical ML, deep learning models such as convolutional neural networks (CNNs), graph neural networks (GNNs), generative adversarial networks (GANs) and optimization methods such as reinforcement learning (RL) and Bayesian optimization (BO). All of these topics are valuable to chip designers and EDA developers and researchers working in digital and analog designs and verification.

Mems Packaging

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Author : Yung-cheng Lee
language : en
Publisher: World Scientific
Release Date : 2018-01-03

Mems Packaging written by Yung-cheng Lee and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-01-03 with Technology & Engineering categories.

MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.

Solder Materials

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Author : Kwang-lung Lin
language : en
Publisher: World Scientific
Release Date : 2018-07-13

Solder Materials written by Kwang-lung Lin and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-07-13 with Technology & Engineering categories.

This book provides a comprehensive overview of important aspects of solder materials including solderability and soldering reaction, physical metallurgy, mechanical properties, electromigration, and reliability of solder joint. The scope of this book covers mainly, but not limited to, the important research achievements of all the subjects having been disclosed and discussed in the literatures. It is a very informative book for those who are interested in learning the material properties of solders, carrying out fundamental research, and in carrying out practical applications. This book is an important resource for the various important subjects relating to solder materials.

Semiconductor Radiation Detectors

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Author : Salim Reza
language : en
Publisher: CRC Press
Release Date : 2017-10-23

Semiconductor Radiation Detectors written by Salim Reza and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-10-23 with Technology & Engineering categories.

The aim of this book is to educate the reader on radiation detectors, from sensor to read-out electronics to application. Relatively new detector materials, such as CdZTe and Cr compensated GaAs, are introduced, along with emerging applications of radiation detectors. This X-ray technology has practical applications in medical, industrial, and security applications. It identifies materials based on their molecular composition, not densities as the traditional transmission equipment does. With chapters written by an international selection of authors from both academia and industry, the book covers a wide range of topics on radiation detectors, which will satisfy the needs of both beginners and experts in the field.

Cost Analysis Of Electronic Systems Second Edition

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Author : Peter Sandborn
language : en
Publisher: World Scientific
Release Date : 2016-12-15

Cost Analysis Of Electronic Systems Second Edition written by Peter Sandborn and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-12-15 with Technology & Engineering categories.

This book provides an introduction to the cost modeling for electronic systems that is suitable for advanced undergraduate and graduate students in electrical, mechanical and industrial engineering, and professionals involved with electronics technology development and management. This book melds elements of traditional engineering economics with manufacturing process and life-cycle cost management concepts to form a practical foundation for predicting the cost of electronic products and systems. Various manufacturing cost analysis methods are addressed including: process-flow, parametric, cost of ownership, and activity based costing. The effects of learning curves, data uncertainty, test and rework processes, and defects are considered. Aspects of system sustainment and life-cycle cost modeling including reliability (warranty, burn-in), maintenance (sparing and availability), and obsolescence are treated. Finally, total cost of ownership of systems, return on investment, cost-benefit analysis, and real options analysis are addressed.

Cooling Of Microelectronic And Nanoelectronic Equipment Advances And Emerging Research

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Author : Madhusudan Iyengar
language : en
Publisher: World Scientific
Release Date : 2014-08-25

Cooling Of Microelectronic And Nanoelectronic Equipment Advances And Emerging Research written by Madhusudan Iyengar and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-08-25 with Technology & Engineering categories.

To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.

Design And Modeling For 3d Ics And Interposers

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