Extreme Temperature And Harsh Environment Electronics Second Edition
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Extreme Temperature And Harsh Environment Electronics
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Author : Vinod Kumar Khanna
language : en
Publisher:
Release Date : 2023
Extreme Temperature And Harsh Environment Electronics written by Vinod Kumar Khanna and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023 with TECHNOLOGY & ENGINEERING categories.
Electronic devices and circuits are employed by a range of industries in unfriendly conditions, such as exposure to extreme temperatures, humidity, or radiation. This second edition describes the diverse measures needed to make electronics capable of coping with such situations and exploiting any new phenomena that take place under these specific conditions. The book explains the need for operating electronics beyond conventional limits in applications such as aerospace and automotive engineering. It explores GaAs, SiC, GaN and diamond electronics, superconductive electronics, superconductor-based power delivery; moisture-proof, chemical-corrosion-resistant, radiation hardened and vibration-tolerant electronics; it also covers the prevention of electromagnetic interference, the operation of sensors in hostile conditions, and jamming and hacking mitigation techniques. The book provides up-to-date coverage of the topics for students, academics and industrial researchers as well as professional experts.
Extreme Temperature And Harsh Environment Electronics Second Edition
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Author : Vinod Kumar Khanna
language : en
Publisher: Institute of Physics Publishing
Release Date : 2023-07-12
Extreme Temperature And Harsh Environment Electronics Second Edition written by Vinod Kumar Khanna and has been published by Institute of Physics Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-07-12 with Technology & Engineering categories.
This second edition describes the various materials, devices, and technologies required to make electronics capable of operating in harsh conditions, such as exposure to extreme temperatures, humidity, or radiation. Implantable medical electronics, vibration-tolerant electronics, space electronics, electromagnetic interference prevention, and methods for hostile electronic jamming and hacking mitigation are also discussed.
Extreme Temperature And Harsh Environment Electronics
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Author : Vinod Kumar Khanna
language : en
Publisher: IOP ebooks
Release Date : 2023-07-12
Extreme Temperature And Harsh Environment Electronics written by Vinod Kumar Khanna and has been published by IOP ebooks this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-07-12 with categories.
This second edition describes the various materials, devices, and technologies required to make electronics capable of operating in harsh conditions, such as exposure to extreme temperatures, humidity, or radiation. Implantable medical electronics, vibration-tolerant electronics, space electronics, electromagnetic interference prevention, and methods for hostile electronic jamming and hacking mitigation are also discussed.
Extreme Environment Electronics
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Author : John D. Cressler
language : en
Publisher: CRC Press
Release Date : 2017-12-19
Extreme Environment Electronics written by John D. Cressler and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.
Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.
Harsh Environment Electronics
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Author : Ahmed Sharif
language : en
Publisher: John Wiley & Sons
Release Date : 2019-03-19
Harsh Environment Electronics written by Ahmed Sharif and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-03-19 with Technology & Engineering categories.
Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.
Fiber Optics Aviation Integration Second Edition
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Author : Gp Capt K S Mathur (Retd.)
language : en
Publisher: Blue Rose Publishers
Release Date : 2022-08-02
Fiber Optics Aviation Integration Second Edition written by Gp Capt K S Mathur (Retd.) and has been published by Blue Rose Publishers this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-08-02 with Education categories.
This is the first book in our country describing the utilization of fiber optics technology in aviation. As of today, almost all new generation aircraft are installed with some fiber optics systems and/or fiber optics sensors. This book gives all the latest advances taking place in aviation as far as fiber optics technology is concerned. Especially with This book titled “Fiber Optics & Aviation: Integration” (SECOND EDITION), the concept of maintenance of all aircraft in India will have to be upgraded and changed as discussed in the book, and also this book gives comprehensive coverage of the topics covered in the book. As of today, no IIT, university/engineering college of aviation branch (Aeronautical Engineering) syllabus has this latest technology included in their subject, hence this is the right time to include this subject as a compulsory subject for students so that they are fully aware of this new technology incorporated in all new-generation aircraft. The same recommendation is also given by the Institution of Engineers (India) in their IEI Epitome April 2022 on Page Number 3 for the first edition of the book. practitioners and Students may use this book “Fiber Optics & Aviation: Integration” (SECOND EDITION) as a postscript to my earlier written book “Fiber Optics Fundamentals and Advances in Optical Communications” for better and intended understanding.
Silicon Carbide Microsystems For Harsh Environments
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Author : Muthu Wijesundara
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-05-17
Silicon Carbide Microsystems For Harsh Environments written by Muthu Wijesundara and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-05-17 with Technology & Engineering categories.
Silicon Carbide Microsystems for Harsh Environments reviews state-of-the-art Silicon Carbide (SiC) technologies that, when combined, create microsystems capable of surviving in harsh environments, technological readiness of the system components, key issues when integrating these components into systems, and other hurdles in harsh environment operation. The authors use the SiC technology platform suite the model platform for developing harsh environment microsystems and then detail the current status of the specific individual technologies (electronics, MEMS, packaging). Additionally, methods towards system level integration of components and key challenges are evaluated and discussed based on the current state of SiC materials processing and device technology. Issues such as temperature mismatch, process compatibility and temperature stability of individual components and how these issues manifest when building the system receive thorough investigation. The material covered not only reviews the state-of-the-art MEMS devices, provides a framework for the joining of electronics and MEMS along with packaging into usable harsh-environment-ready sensor modules.
High Temperature Electronics
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Author : F. Patrick McCluskey
language : en
Publisher: CRC Press
Release Date : 2018-05-04
High Temperature Electronics written by F. Patrick McCluskey and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-05-04 with Technology & Engineering categories.
The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Evolvable Systems From Biology To Hardware
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Author : Lishan Kang
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-08-28
Evolvable Systems From Biology To Hardware written by Lishan Kang and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-08-28 with Computers categories.
This book constitutes the refereed proceedings of the 7th International Conference on Evolvable Systems, ICES 2007, held in Wuhan, China, in September 2007. The 41 revised full papers collected in this volume are organized in topical sections on digital hardware evolution, analog hardware evolution, bio-inspired systems, mechanical hardware evolution, evolutionary design, evolutionary algorithms in hardware design, and hardware implementation of evolutionary algorithms.
Handbook Of Lead Free Solder Technology For Microelectronic Assemblies
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Author : Karl J. Puttlitz
language : en
Publisher: CRC Press
Release Date : 2004-02-27
Handbook Of Lead Free Solder Technology For Microelectronic Assemblies written by Karl J. Puttlitz and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-02-27 with Technology & Engineering categories.
This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.