Flexible Compact And High Power Compatible Packaging Of Microwave And Millimeter Wave Electronics
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Flexible Compact And High Power Compatible Packaging Of Microwave And Millimeter Wave Electronics
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Author : Xenofon Konstantinou
language : en
Publisher:
Release Date : 2022
Flexible Compact And High Power Compatible Packaging Of Microwave And Millimeter Wave Electronics written by Xenofon Konstantinou and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022 with Electronic dissertations categories.
This dissertation demonstrates packaging strategies for microwave and millimeter-wave (mm-wave) system integration, realized via additive manufacturing (AM), and specifically aerosol jet printing (AJP), that are mm-wave-capable, flexible, and compatible with high-power applications. These strategies build upon the concept of chip-first packaging that has been previously demonstrated via AJP. Such packaging approaches address the limitations of conventional systems-on-package (SoP)/systems-in-package (SiP) strategies and aim for heterogeneous integration and high functional density. The final SiP/SoP strategy demonstrated in this dissertation achieves improved performance comparing to previously demonstrated packages and interconnects via AM, and additionally demonstrates more material flexibility, improved interconnect reliability, incorporation of diamond platforms as heatsinks for high-power operation, and high-power performance. The first step in the dissertation is to explore the high-power and temperature capabilities of diamond via basic high-power RF devices. Then, the compatibility of diamond and AJP is investigated by realizing RF components printed on diamond dielectric substrates. Thereafter, the state of the art in additively manufactured interconnects and components is advanced via the demonstration of compact resonant structures at mm-wave, ultra-wideband mm-wave interconnects on non-planar structures, as well as components at near-THz frequencies, all manufactured fully via AJP. Then, AJP-enabled SiP/SoP packaging strategies for mm-wave system integration are laid out and then used for the realization of RF front-end modules. Finally, these strategies are adapted to incorporate diamond platforms, with the final packages demonstrating high RF power performance.
Microwave And Millimeter Wave Electronic Packaging
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Author : Rick Sturdivant
language : en
Publisher:
Release Date : 2014
Microwave And Millimeter Wave Electronic Packaging written by Rick Sturdivant and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014 with Microelectronic packaging categories.
Rf And Microwave Microelectronics Packaging
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Author : Ken Kuang
language : en
Publisher: Springer Science & Business Media
Release Date : 2009-12-01
Rf And Microwave Microelectronics Packaging written by Ken Kuang and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-12-01 with Technology & Engineering categories.
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
Rf And Microwave Microelectronics Packaging Ii
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Author : Ken Kuang
language : en
Publisher: Springer
Release Date : 2017-03-09
Rf And Microwave Microelectronics Packaging Ii written by Ken Kuang and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-03-09 with Technology & Engineering categories.
This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
High Performance Packaging For Monolithic Microwave And Millimeter Wave Integrated Circuits
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Author : K. A. Shalkhauser
language : en
Publisher:
Release Date : 1992
High Performance Packaging For Monolithic Microwave And Millimeter Wave Integrated Circuits written by K. A. Shalkhauser and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1992 with categories.
Advanced Millimeter Wave Technologies
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Author : Duixian Liu
language : en
Publisher: John Wiley & Sons
Release Date : 2009-03-03
Advanced Millimeter Wave Technologies written by Duixian Liu and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-03-03 with Technology & Engineering categories.
This book explains one of the hottest topics in wireless and electronic devices community, namely the wireless communication at mmWave frequencies, especially at the 60 GHz ISM band. It provides the reader with knowledge and techniques for mmWave antenna design, evaluation, antenna and chip packaging. Addresses practical engineering issues such as RF material evaluation and selection, antenna and packaging requirements, manufacturing tolerances, antenna and system interconnections, and antenna One of the first books to discuss the emerging research and application areas, particularly chip packages with integrated antennas, wafer scale mmWave phased arrays and imaging Contains a good number of case studies to aid understanding Provides the antenna and packaging technologies for the latest and emerging applications with the emphases on antenna integrations for practical applications such as wireless USB, wireless video, phase array, automobile collision avoidance radar, and imaging
Electronic And Photonic Packaging Electrical Systems And Photonic Design And Nanotechnology
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Author :
language : en
Publisher:
Release Date : 2002
Electronic And Photonic Packaging Electrical Systems And Photonic Design And Nanotechnology written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Electronic packaging categories.
Advanced Microwave Circuits And Systems
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Author : Vitaliy Zhurbenko
language : en
Publisher: BoD – Books on Demand
Release Date : 2010-04-01
Advanced Microwave Circuits And Systems written by Vitaliy Zhurbenko and has been published by BoD – Books on Demand this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-04-01 with Technology & Engineering categories.
This book is based on recent research work conducted by the authors dealing with the design and development of active and passive microwave components, integrated circuits and systems. It is divided into seven parts. In the first part comprising the first two chapters, alternative concepts and equations for multiport network analysis and characterization are provided. A thru-only de-embedding technique for accurate on-wafer characterization is introduced. The second part of the book corresponds to the analysis and design of ultra-wideband low- noise amplifiers (LNA).
Microwave Journal
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Author :
language : en
Publisher:
Release Date : 1994
Microwave Journal written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with Microwaves categories.
Microwave And Millimeter Wave Electronic Packaging
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Author : Rick Sturdivant
language : en
Publisher: Artech House
Release Date : 2013-12-01
Microwave And Millimeter Wave Electronic Packaging written by Rick Sturdivant and has been published by Artech House this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-12-01 with Technology & Engineering categories.
Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. This resource presents you with the electronic packaging issues unique to microwave and millimeter-wave frequencies and reviews lower frequency packaging techniques so they can be adapted to higher frequency designs. You are provided with 30 practical examples throughout the book, as well as three free downloadable software analysis programs.