Rf And Microwave Microelectronics Packaging Ii
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Rf And Microwave Microelectronics Packaging Ii
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Author : Ken Kuang
language : en
Publisher: Springer
Release Date : 2017-03-09
Rf And Microwave Microelectronics Packaging Ii written by Ken Kuang and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-03-09 with Technology & Engineering categories.
This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
Rf And Microwave Microelectronics Packaging
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Author : Ken Kuang
language : en
Publisher: Springer Science & Business Media
Release Date : 2009-12-01
Rf And Microwave Microelectronics Packaging written by Ken Kuang and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-12-01 with Technology & Engineering categories.
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
Rf Microwave Hybrids
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Author : Richard Brown
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-05-08
Rf Microwave Hybrids written by Richard Brown and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-05-08 with Technology & Engineering categories.
In 1991 this author published a monograph[l] based on his experience teaching microwave hybrid materials and processing technology at the annual ISHM (now the International Microelectronics and Packaging Society, IMAPS) symposia. Since that time, the course has been presented at that venue and on-site at a number of industrial and government organizations. The course has been continually revised to reflect the many evolutionary changes in materials and processes. Microwave technology has existed for almost 175 years. It was only after the invention of the klystron, just before World War II, that microwave design and manufacture moved from a few visionaries to the growth the industry sees today. Over the last decade alone there have been exploding applications for all types of high frequency electronics in the miltary, automotive, wireless, computer, telecommunications and medical industries. These have placed demands, unimaginable a decade ago, on designs, materials, processes and equipment to meet the ever expanding requirements for increasingly reliable, smaller, faster and lower cost circuits.
Systems Level Packaging For Millimeter Wave Transceivers
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Author : Mladen Božanić
language : en
Publisher: Springer
Release Date : 2019-03-26
Systems Level Packaging For Millimeter Wave Transceivers written by Mladen Božanić and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-03-26 with Technology & Engineering categories.
This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.
Microwave And Millimeter Wave Electronic Packaging
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Author : Rick Sturdivant
language : en
Publisher: Artech House
Release Date : 2013-12-01
Microwave And Millimeter Wave Electronic Packaging written by Rick Sturdivant and has been published by Artech House this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-12-01 with Technology & Engineering categories.
Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. This resource presents you with the electronic packaging issues unique to microwave and millimeter-wave frequencies and reviews lower frequency packaging techniques so they can be adapted to higher frequency designs. You are provided with 30 practical examples throughout the book, as well as three free downloadable software analysis programs.
Millimeter Wave Integrated Circuits
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Author : Mladen Božanić
language : en
Publisher: Springer Nature
Release Date : 2020-03-16
Millimeter Wave Integrated Circuits written by Mladen Božanić and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-03-16 with Technology & Engineering categories.
This peer-reviewed book explores the methodologies that are used for effective research, design and innovation in the vast field of millimeter-wave circuits, and describes how these have to be modified to fit the uniqueness of high-frequency nanoelectronics design. Each chapter focuses on a specific research challenge related to either small form factors or higher operating frequencies. The book first examines nanodevice scaling and the emerging electronic design automation tools that can be used in millimeter-wave research, as well as the singular challenges of combining deep-submicron and millimeter-wave design. It also demonstrates the importance of considering, in the millimeter-wave context, system-level design leading to differing packaging options. Further, it presents integrated circuit design methodologies for all major transceiver blocks typically employed at millimeter-wave frequencies, as these methodologies are normally fundamentally different from the traditional design methodologies used in analogue and lower-frequency electronics. Lastly, the book discusses the methodologies of millimeter-wave research and design for extreme or harsh environments, rebooting electronics, the additional opportunities for terahertz research, and the main differences between the approaches taken in millimeter-wave research and terahertz research.
Switchmode Rf And Microwave Power Amplifiers
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Author : Andrei Grebennikov
language : en
Publisher: Academic Press
Release Date : 2012-06-19
Switchmode Rf And Microwave Power Amplifiers written by Andrei Grebennikov and has been published by Academic Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-06-19 with Science categories.
Annotation Written by leading experts, this is a broad and in-depth reference on RF and microwave switch mode power amplifiers. It combines theoretical analysis with practical implementation, including the use of computer-aided design examples.
Advanced Electronic Packaging
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Author : Richard K. Ulrich
language : en
Publisher: John Wiley & Sons
Release Date : 2006-02-24
Advanced Electronic Packaging written by Richard K. Ulrich and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-02-24 with Technology & Engineering categories.
As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
Fundamentals Of Microsystems Packaging
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Author : Tummala
language : en
Publisher: McGraw Hill Professional
Release Date : 2001-05-08
Fundamentals Of Microsystems Packaging written by Tummala and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001-05-08 with Technology & Engineering categories.
"LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the fields leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. Youll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologieswafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing"
Rf And Microwave Integrated Circuit Development
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Author : Patrice Gamand
language : en
Publisher: Wiley
Release Date : 2016-01-19
Rf And Microwave Integrated Circuit Development written by Patrice Gamand and has been published by Wiley this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-01-19 with Technology & Engineering categories.
RF and Microwave Integrated Circuit Development bridges the gap between existing literature, which focus mainly on the ‘front-end’ part of a product development (system, architecture, design techniques), by providing the reader with an insight into the ‘back-end’ part of product development. In addition, the authors provide practical answers and solutions regarding the choice of technology, the packaging solutions and the effects on the performance on the circuit and to the industrial testing strategy. It will also discuss future trends and challenges and includes case studies to illustrate examples. • Offers an overview of the challenges in RF/microwave product design • Provides practical answers to packaging issues and evaluates its effect on the performance of the circuit • Includes industrial testing strategies • Examines relevant RF MIC technologies and the factors which affect the choice of technology for a particular application, e.g. technical performance and cost • Discusses future trends and challenges, and includes case studies to illustrate examples An invaluable resource for IC designers, production and test engineers, RF/microwave engineers, graduate students in microwave circuit and system areas, design engineers in industry designing RF and microwave ICs for consumer, industrial, military and space applications.