Rf And Microwave Microelectronics Packaging Ii
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Rf And Microwave Microelectronics Packaging Ii
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Author : Ken Kuang
language : en
Publisher: Springer
Release Date : 2017-03-09
Rf And Microwave Microelectronics Packaging Ii written by Ken Kuang and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-03-09 with Technology & Engineering categories.
This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
Rf And Microwave Microelectronics Packaging
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Author : Ken Kuang
language : en
Publisher: Springer Science & Business Media
Release Date : 2009-12-01
Rf And Microwave Microelectronics Packaging written by Ken Kuang and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-12-01 with Technology & Engineering categories.
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
Systems Level Packaging For Millimeter Wave Transceivers
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Author : Mladen Božanić
language : en
Publisher: Springer
Release Date : 2019-03-26
Systems Level Packaging For Millimeter Wave Transceivers written by Mladen Božanić and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-03-26 with Technology & Engineering categories.
This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.
Millimeter Wave Integrated Circuits
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Author : Mladen Božanić
language : en
Publisher: Springer Nature
Release Date : 2020-03-16
Millimeter Wave Integrated Circuits written by Mladen Božanić and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-03-16 with Technology & Engineering categories.
This peer-reviewed book explores the methodologies that are used for effective research, design and innovation in the vast field of millimeter-wave circuits, and describes how these have to be modified to fit the uniqueness of high-frequency nanoelectronics design. Each chapter focuses on a specific research challenge related to either small form factors or higher operating frequencies. The book first examines nanodevice scaling and the emerging electronic design automation tools that can be used in millimeter-wave research, as well as the singular challenges of combining deep-submicron and millimeter-wave design. It also demonstrates the importance of considering, in the millimeter-wave context, system-level design leading to differing packaging options. Further, it presents integrated circuit design methodologies for all major transceiver blocks typically employed at millimeter-wave frequencies, as these methodologies are normally fundamentally different from the traditional design methodologies used in analogue and lower-frequency electronics. Lastly, the book discusses the methodologies of millimeter-wave research and design for extreme or harsh environments, rebooting electronics, the additional opportunities for terahertz research, and the main differences between the approaches taken in millimeter-wave research and terahertz research.
Microwaves Millimeter Wave And Terahertz Liquid Crystals
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Author : Anyong Qing
language : en
Publisher: Springer Nature
Release Date : 2024-03-05
Microwaves Millimeter Wave And Terahertz Liquid Crystals written by Anyong Qing and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-03-05 with Technology & Engineering categories.
This book is the first ever monograph on nematic liquid crystals for microwaves, millimeter waves and terahertz waves. It presents the first hand independent studies on nematic liquid crystals for microwaves, millimeter waves and terahertz waves. This book opens with an introduction to generic liquid crystals and a retrospective review about nematic liquid crystals in microwaves, millimeter waves and terahertz waves. Attention is then focused on the latest in-house progress on microwave, millimeter wave and terahertz nematic liquid crystals. Synthesis and characterization of novel nematic liquid crystals are first presented, followed by indigenous technologies to manufacture functional nematic liquid crystal devices for microwaves, millimeter waves and terahertz waves. A few self-developed representative advanced functional devices are shown to demonstrate the promising perspective of liquid crystals for not only microwaves, millimeter waves and terahertz waves but also many other non-display applications. The presented studies will attract scientists, engineers and students from various disciplines, such as materials, chemical, electrical, biological, and biomedical engineering. The book is intended for undergraduates, graduates, researchers, professionals and industrial practitioners who are interested in developing novel liquid crystals and further extending liquid crystals beyond display.
Lcp For Microwave Packages And Modules
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Author : Anh-Vu H. Pham
language : en
Publisher: Cambridge University Press
Release Date : 2012-06-21
Lcp For Microwave Packages And Modules written by Anh-Vu H. Pham and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-06-21 with Science categories.
A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP) at package, component and system levels, providing a detailed look at everything you need to know to get up-to-speed on the subject, including successful design details, techniques and potential pitfalls.
Handbook Of Rf Microwave And Millimeter Wave Components
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Author : Leonid A. Belov
language : en
Publisher: Artech House
Release Date : 2012
Handbook Of Rf Microwave And Millimeter Wave Components written by Leonid A. Belov and has been published by Artech House this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012 with Technology & Engineering categories.
This unique and comprehensive resource offers you a detailed treatment of the operations principles, key parameters, and specific characteristics of active and passive RF, microwave, and millimeter-wave components. The book covers both linear and nonlinear components that are used in a wide range of application areas, from communications and information sciences, to avionics, space, and military engineering. This practical book presents descriptions and clear examples and of the best materials and products used in the field, including laminates, prepregs, substrates; microstrip, coaxial and waveguide transmission lines; fixed and rotating connectors; matching and adjusting elements; frequency filters; phase shifters; and ferrite gates and circulators. Moreover, the book offers you in-depth discussions on microwave switches and matrices, including MEMS technology, solid state and vacuum amplifiers, mixers, modulators and demodulators, and oscillation sources. You also find coverage of the stable frequency synthesizer structure and sources of modulated or noisy signals. Greatly adding to the usefulness of this volume is the inclusion of more than 700 Internet addresses of manufacturers from across the globe.
Antenna In Package Technology And Applications
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Author : Duixian Liu
language : en
Publisher: John Wiley & Sons
Release Date : 2020-03-10
Antenna In Package Technology And Applications written by Duixian Liu and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-03-10 with Technology & Engineering categories.
A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
Smart Sensors And Mems
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Author : S Nihtianov
language : en
Publisher: Woodhead Publishing
Release Date : 2018-02-27
Smart Sensors And Mems written by S Nihtianov and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-02-27 with Technology & Engineering categories.
Smart Sensors and MEMS: Intelligent Devices and Microsystems for Industrial Applications, Second Edition highlights new, important developments in the field, including the latest on magnetic sensors, temperature sensors and microreaction chambers. The book outlines the industrial applications for smart sensors, covering direct interface circuits for sensors, capacitive sensors for displacement measurement in the sub-nanometer range, integrated inductive displacement sensors for harsh industrial environments, advanced silicon radiation detectors in the vacuum ultraviolet (VUV) and extreme ultraviolet (EUV) spectral range, among other topics. New sections include discussions on magnetic and temperature sensors and the industrial applications of smart micro-electro-mechanical systems (MEMS). The book is an invaluable reference for academics, materials scientists and electrical engineers working in the microelectronics, sensors and micromechanics industry. In addition, engineers looking for industrial sensing, monitoring and automation solutions will find this a comprehensive source of information. - Contains new chapters that address key applications, such as magnetic sensors, microreaction chambers and temperature sensors - Provides an in-depth information on a wide array of industrial applications for smart sensors and smart MEMS - Presents the only book to discuss both smart sensors and MEMS for industrial applications
Hermeticity Testing Of Mems And Microelectronic Packages
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Author : Suzanne Costello
language : en
Publisher: Artech House
Release Date : 2013-10-01
Hermeticity Testing Of Mems And Microelectronic Packages written by Suzanne Costello and has been published by Artech House this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-10-01 with Technology & Engineering categories.
Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required. This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book includes up-to-date and applicable test methods for today’s package types. The authors cover the history and development of packaging, along with a view to understanding initial hermeticity testing requirements and the subsequent limitations of these methods when applied to new package types.