Systems Level Packaging For Millimeter Wave Transceivers
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Systems Level Packaging For Millimeter Wave Transceivers
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Author : Mladen Božanić
language : en
Publisher: Springer
Release Date : 2019-03-26
Systems Level Packaging For Millimeter Wave Transceivers written by Mladen Božanić and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-03-26 with Technology & Engineering categories.
This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.
Microwave And Millimeter Wave Electronic Packaging
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Author : Rick Sturdivant
language : en
Publisher: Artech House
Release Date : 2013-12-01
Microwave And Millimeter Wave Electronic Packaging written by Rick Sturdivant and has been published by Artech House this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-12-01 with Technology & Engineering categories.
Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. This resource presents you with the electronic packaging issues unique to microwave and millimeter-wave frequencies and reviews lower frequency packaging techniques so they can be adapted to higher frequency designs. You are provided with 30 practical examples throughout the book, as well as three free downloadable software analysis programs.
Millimeter Wave Packaging And Module Technology Developments In Japan
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Author :
language : en
Publisher:
Release Date : 1910
Millimeter Wave Packaging And Module Technology Developments In Japan written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1910 with categories.
This paper presents an overview of recent trends in millimeter-wave packaging and module technology development in Japan. For commercial millimeter-wave applications such as wireless radio links, wireless LANs, automotive radars and so on, packaging and module technologies with high performance and productivity are required. Ceramic-base packages up to W-band, flip-chip bonding and packaging of CPW MMICs for low cost and high reproducible assembling, and extremely compact multi-layer HTCC transmitter/receiver MCMs for 60GHz band communications, have been developed.
Flexible Compact And High Power Compatible Packaging Of Microwave And Millimeter Wave Electronics
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Author : Xenofon Konstantinou
language : en
Publisher:
Release Date : 2022
Flexible Compact And High Power Compatible Packaging Of Microwave And Millimeter Wave Electronics written by Xenofon Konstantinou and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022 with Electronic dissertations categories.
This dissertation demonstrates packaging strategies for microwave and millimeter-wave (mm-wave) system integration, realized via additive manufacturing (AM), and specifically aerosol jet printing (AJP), that are mm-wave-capable, flexible, and compatible with high-power applications. These strategies build upon the concept of chip-first packaging that has been previously demonstrated via AJP. Such packaging approaches address the limitations of conventional systems-on-package (SoP)/systems-in-package (SiP) strategies and aim for heterogeneous integration and high functional density. The final SiP/SoP strategy demonstrated in this dissertation achieves improved performance comparing to previously demonstrated packages and interconnects via AM, and additionally demonstrates more material flexibility, improved interconnect reliability, incorporation of diamond platforms as heatsinks for high-power operation, and high-power performance. The first step in the dissertation is to explore the high-power and temperature capabilities of diamond via basic high-power RF devices. Then, the compatibility of diamond and AJP is investigated by realizing RF components printed on diamond dielectric substrates. Thereafter, the state of the art in additively manufactured interconnects and components is advanced via the demonstration of compact resonant structures at mm-wave, ultra-wideband mm-wave interconnects on non-planar structures, as well as components at near-THz frequencies, all manufactured fully via AJP. Then, AJP-enabled SiP/SoP packaging strategies for mm-wave system integration are laid out and then used for the realization of RF front-end modules. Finally, these strategies are adapted to incorporate diamond platforms, with the final packages demonstrating high RF power performance.
Millimeter Wave Integrated Circuits
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Author : Mladen Božanić
language : en
Publisher: Springer Nature
Release Date : 2020-03-16
Millimeter Wave Integrated Circuits written by Mladen Božanić and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-03-16 with Technology & Engineering categories.
This peer-reviewed book explores the methodologies that are used for effective research, design and innovation in the vast field of millimeter-wave circuits, and describes how these have to be modified to fit the uniqueness of high-frequency nanoelectronics design. Each chapter focuses on a specific research challenge related to either small form factors or higher operating frequencies. The book first examines nanodevice scaling and the emerging electronic design automation tools that can be used in millimeter-wave research, as well as the singular challenges of combining deep-submicron and millimeter-wave design. It also demonstrates the importance of considering, in the millimeter-wave context, system-level design leading to differing packaging options. Further, it presents integrated circuit design methodologies for all major transceiver blocks typically employed at millimeter-wave frequencies, as these methodologies are normally fundamentally different from the traditional design methodologies used in analogue and lower-frequency electronics. Lastly, the book discusses the methodologies of millimeter-wave research and design for extreme or harsh environments, rebooting electronics, the additional opportunities for terahertz research, and the main differences between the approaches taken in millimeter-wave research and terahertz research.
Millimeter Wave Integrated Technologies In The Era Of The Fourth Industrial Revolution
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Author : Wynand Lambrechts
language : en
Publisher: Springer Nature
Release Date : 2020-06-20
Millimeter Wave Integrated Technologies In The Era Of The Fourth Industrial Revolution written by Wynand Lambrechts and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-06-20 with Technology & Engineering categories.
This peer-reviewed book explores the technologies driving broadband internet connectivity in the fourth industrial revolution (Industry 4.0). It particularly focuses on potential solutions to introduce these technologies in emerging markets and rural areas, regions that typically form part of the digital divide and often have under-developed telecommunications infrastructures, a lack of skilled workers, and geographical restrictions that limit broadband connectivity. Research shows that ubiquitous internet access boosts socio-economic growth through innovations in science and technology, with the common goal of bringing positive change to the lives of individuals. Fifth-generation (5G) networks based on millimeter-wave (mm-wave) frequency information transfer have the potential to provide future-proof, affordable and sustainable broadband connectivity in areas where previous-generation mobile networks were unable to do so. This book discusses the principles of various technologies that enable electronic circuits to operate at mm-wave frequencies. It examines the importance of identifying, describing, and analyzing technology from a purely technological standpoint, but also acknowledges and investigates the challenges and limitations of introducing such technologies in emerging markets. Presenting recent research, the book spearheads participation in Industry 4.0 in these areas.
Mobile Communication Networks 5g And A Vision Of 6g
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Author : Mladen Božanić
language : en
Publisher: Springer Nature
Release Date : 2021-02-15
Mobile Communication Networks 5g And A Vision Of 6g written by Mladen Božanić and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-02-15 with Technology & Engineering categories.
This book contributes to the body of scholarly knowledge by exploring the main ideas of wireless networks of past, present, and future, trends in the field of networking, the capabilities of 5G and technologies that are potential enablers of 6G, potential 6G applications and requirements, as well as unique challenges and opportunities that 6G research is going to offer over the next decade. It covers research topics such as communication via millimeter-waves, terahertz waves and visible light to enable faster speeds, as well as research into achieving other basic requirements of 6G networks. These include low end-to-end latency, high energy efficiency, coverage that is ubiquitous and always-on, integration of terrestrial wireless with non-terrestrial networks, network management that is made more effective by connected intelligence with machine learning capabilities, as well as support for the evolution of old service classes and support for new ones.
Substrate Integrated Millimeter Wave Antennas For Next Generation Communication And Radar Systems
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Author : Zhi Ning Chen
language : en
Publisher: John Wiley & Sons
Release Date : 2021-04-29
Substrate Integrated Millimeter Wave Antennas For Next Generation Communication And Radar Systems written by Zhi Ning Chen and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-04-29 with Technology & Engineering categories.
Substrate-Integrated Millimeter-Wave Antennas for Next-Generation Communication and Radar Systems The first and only comprehensive text on substrate-integrated mmW antenna technology, state-of-the-art antenna design, and emerging wireless applications Substrate-Integrated Millimeter-Wave Antennas for Next-Generation Communication and Radar Systems elaborates the most important topics related to revolutionary millimeter-wave (mmW) technology. Following a clear description of fundamental concepts including substrate-integrated waveguides and loss analysis, the text treats key design methods, prototyping techniques, and experimental setup and testing. The authors also highlight applications of mmW antennas in 5G wireless communication and next-generation radar systems. Readers are prepared to put techniques into practice through practical discussions of how to set up testing for impedance matching, radiation patterns, gain from 24GHz up to 325 GHz, and more. This book will bring readers state-of-the-art designs and recent progress in substrate-integrated mmW antennas for emerging wireless applications. Substrate-Integrated Millimeter-Wave Antennas for Next-Generation Communication and Radar Systems is the first comprehensive text on the topic, allowing readers to quickly master mmW technology. This book: Introduces basic concepts such as metamaterials Huygens's surface, zero-index structures, and pattern synthesis Describes prototyping in the form of fabrication based on printed-circuit-board, low-temperature-co-fired-ceramic and micromachining Explores applications for next-generation radar and imaging systems such as 24-GHz and 77-GHz vehicular radar systems Elaborates design methods including waveguide-based feeding network, three-dimensional feeding structure, dielectric loaded aperture antenna element, and low-sidelobe synthesis The mmW is one of today’s most important emerging technologies. This book provides graduate students, researchers, and engineers with the knowledge they need to deploy mmW systems and develop new antenna designs with low cost, low loss, and low complexity.
Applications In Electronics Pervading Industry Environment And Society
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Author : Francesco Bellotti
language : en
Publisher: Springer Nature
Release Date : 2024-01-12
Applications In Electronics Pervading Industry Environment And Society written by Francesco Bellotti and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-01-12 with Technology & Engineering categories.
This book provides a thorough overview of cutting-edge research on electronics applications relevant to industry, the environment, and society at large. It covers a broad spectrum of application domains, from automotive to space and from health to security, while devoting special attention to the use of embedded devices and sensors for imaging, communication, and control. The book is based on the 2023 ApplePies Conference, held in Genoa, Italy, in September 2023, which brought together researchers and stakeholders to consider the most significant current trends in the field of applied electronics and to debate visions for the future. Areas addressed by the conference included information communication technology; biotechnology and biomedical imaging; space; secure, clean, and efficient energy; the environment; and smart, green, and integrated transport. As electronics technology continues to develop apace, constantly meeting previously unthinkable targets, further attention needs to be directed toward the electronics applications and the development of systems that facilitate human activities. This book, written by industrial and academic professionals, represents a valuable contribution in this endeavor.
Low Temperature Co Fired Ceramics For System In Package Applications At 122 Ghz
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Author : Bhutani, Akanksha
language : en
Publisher: KIT Scientific Publishing
Release Date : 2019-10-17
Low Temperature Co Fired Ceramics For System In Package Applications At 122 Ghz written by Bhutani, Akanksha and has been published by KIT Scientific Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-10-17 with Technology & Engineering categories.