Foldable Flex And Thinned Silicon Multichip Packaging Technology
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Foldable Flex And Thinned Silicon Multichip Packaging Technology
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Author : John W. Balde
language : en
Publisher: Springer Science & Business Media
Release Date : 2003-01-31
Foldable Flex And Thinned Silicon Multichip Packaging Technology written by John W. Balde and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003-01-31 with Computers categories.
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means. Much of the work in this field has not been widely disseminated other than by papers presented at conferences and workshops. This book is organized to report on the developments in this technology, but with special additional material and emphasis. The intent is to do more than report on present state of the art. It is intended as an advocacy book, pointing out the reasons for 3-D assemblies, the reasons for Silicon-in-a-Package multichip modules, and the commercial availability of the techniques. The contributing authors, all leaders in this technical field, explore the needs, reveal the state of development and production, and point to changes in technology that can bring this technology into wider use for more complex applications. It is an advocacy book in this respect - advocacy for the use of a technology that is already mature, and advocacy for exploring ways to make it even more capable for the future. It will also do more than discuss the present; it will point out the deficiencies of the constructions, the needed availability of good flex material, the use of newer flex materials, such as LCP, and the implications from the use of the Integrated Mesh Power Systems to enhance the capability for future designs. Lastly it will discuss the serious problem of heat removal if multiple microprocessors are included.
Foldable Flex And Thinned Silicon Multichip Packaging Technology
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Author : John W. Balde
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27
Foldable Flex And Thinned Silicon Multichip Packaging Technology written by John W. Balde and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Technology & Engineering categories.
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.
Silicon
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Author : Paul Siffert
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-03-09
Silicon written by Paul Siffert and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-03-09 with Technology & Engineering categories.
Silicon. The evolution and development of humanity are commonly charac terized by the key words Stone Age, Bronze Age, and Iron Age; that is, characterized by materials. Curse or benefit to mankind? The discovery and utilization of semiconductors, particularly of silicon, revolutionized our liv ing conditions, society, social life, and maxims in a few years, even more than what happened during all the material-specified periods before. Per haps, one day, our descendants will call the period at whose beginning we live the Silicon Age. However, to be correct, the present period is character ized of the discovery and development of a whole bunch of new materials and their utilization. These materials are new alloys, ceramics, the plastics and synthetics produced by organic chemistry, composites, biomaterials, and the materials of microelectronics, nanotechnology, and space science. The materi als of microelectronics are silicon, other elemental semiconductors, compound semiconductors, and organic semiconductors. With regard to the interdepen dences of these materials and their utilization, silicon plays a central role as one of the base materials for electronics. Have we lived in the Silicon Age for only half a century and already jumped into a new age of synthetic organic materials for electronics? We do not know. The first intensive work on silicon started more than 50 years ago. One of the European semiconductor laboratories was installed by the industry in a centuries-old, little countryside castle in Pretzfeld, in the north-east of Bavaria, Germany.
Integrated Circuit Packaging Assembly And Interconnections
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Author : William Greig
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-04-24
Integrated Circuit Packaging Assembly And Interconnections written by William Greig and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-04-24 with Technology & Engineering categories.
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.
Optical Interconnects
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Author : Ray T. Chen
language : en
Publisher: Springer Nature
Release Date : 2022-05-31
Optical Interconnects written by Ray T. Chen and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-05-31 with Technology & Engineering categories.
This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical interconnects, many stumbling blocks need to be addressed such as thin-film transmitter and detector, thermal management, process compatibility, reliability, cost effective fabrication process, and easy integration. The material presented eventually will relieve such concerns and make the integration of optical interconnection highly feasible. The hybrid integration of the optical interconnection layer and electrical layers is ongoing.
Materials For Advanced Packaging
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Author : Daniel Lu
language : en
Publisher: Springer Science & Business Media
Release Date : 2008-12-17
Materials For Advanced Packaging written by Daniel Lu and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-12-17 with Technology & Engineering categories.
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Proceedings 2002 International Conference On Advanced Packaging And Systems
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Author :
language : en
Publisher:
Release Date : 2002
Proceedings 2002 International Conference On Advanced Packaging And Systems written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Electronic packaging categories.
Proceedings
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Author :
language : en
Publisher:
Release Date : 2004
Proceedings written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with Electronic apparatus and appliances categories.
Proceedings Of Technical Papers
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Author :
language : en
Publisher:
Release Date : 2005
Proceedings Of Technical Papers written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with Integrated circuits categories.
Ambient Intelligence With Microsystems
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Author : Kieran Delaney
language : en
Publisher: Springer Science & Business Media
Release Date : 2008-10-17
Ambient Intelligence With Microsystems written by Kieran Delaney and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-10-17 with Computers categories.
Augmented Materials and Smart Objects investigates the issues required to ensure technology platforms capable of being seamlessly integrated into everyday objects, particularly the requirements for integrated computation and MEMs sensors, System-in-a-package solutions, multi-chip modules, the impact of the trend towards embedded microelectronic electronics sub-systems, novel assembly techniques for autonomous MEMs sensors, as well as practical performance issues that are key to the AmI concept. Also discussed are current requirements for realizing applications-oriented examples of smart objects (e.g. smart textiles, gadgets, integration of smart systems for utility and environmental monitoring, etc); these are based upon heterogeneous systems linking networks of sensors attached to (or physically embedded in) objects with information management systems enabling collections of smart objects to collaborate to provide proactive services to the user. Finally, Augmented Materials and Smart Objects describes and discusses a number of vision statements strongly relevant to the future development of distributed embedded sensor and actuator platforms for smart objects, and ultimately Ambient Intelligence. The framework for this is the concept of Augmented Materials; these are materials with fully embedded distributed information systems, designed to measure all relevant physical properties and provide a full knowledge representation of the material; in effect, the material would "know" itself, and its current status.