Home eBooks Download › foldable flex and thinned silicon multichip packaging technology

Foldable Flex And Thinned Silicon Multichip Packaging Technology

Download Foldable Flex And Thinned Silicon Multichip Packaging Technology PDF/ePub or read online books in Mobi eBooks. Click Download or Read Online button to get Foldable Flex And Thinned Silicon Multichip Packaging Technology book now. This website allows unlimited access to, at the time of writing, more than 1.5 million titles, including hundreds of thousands of titles in various foreign languages. If the content not found or just blank you must refresh this page

Foldable Flex And Thinned Silicon Multichip Packaging Technology

DOWNLOAD

Author : John W. Balde
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27

Foldable Flex And Thinned Silicon Multichip Packaging Technology written by John W. Balde and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Technology & Engineering categories.

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

Silicon

DOWNLOAD

Author : Paul Siffert
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-03-09

Silicon written by Paul Siffert and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-03-09 with Technology & Engineering categories.

With topics ranging from epitaxy through lattice defects and doping to quantum computation, this book provides a personalized survey of the development and use of silicon, the basis for the revolutionary changes in our lives sometimes called "The Silicon Age." Beginning with the very first developments more than 50 years ago, this reports on all aspects of silicon and silicon technology up to its use in exciting new technologies, including a glance at possible future developments.

Integrated Circuit Packaging Assembly And Interconnections

DOWNLOAD

Author : William Greig
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-04-24

Integrated Circuit Packaging Assembly And Interconnections written by William Greig and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-04-24 with Technology & Engineering categories.

Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.

Optical Interconnects

DOWNLOAD

Author : Ray T. Chen
language : en
Publisher: Springer Nature
Release Date : 2022-05-31

Optical Interconnects written by Ray T. Chen and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-05-31 with Technology & Engineering categories.

This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical interconnects, many stumbling blocks need to be addressed such as thin-film transmitter and detector, thermal management, process compatibility, reliability, cost effective fabrication process, and easy integration. The material presented eventually will relieve such concerns and make the integration of optical interconnection highly feasible. The hybrid integration of the optical interconnection layer and electrical layers is ongoing.

Materials For Advanced Packaging

DOWNLOAD

Author : Daniel Lu
language : en
Publisher: Springer Science & Business Media
Release Date : 2008-12-17

Materials For Advanced Packaging written by Daniel Lu and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-12-17 with Technology & Engineering categories.

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.