From Yield Analysis To Design For Manufacturability
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From Yield Analysis To Design For Manufacturability
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Author : Neil Harrison
language : en
Publisher:
Release Date : 2004
From Yield Analysis To Design For Manufacturability written by Neil Harrison and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with categories.
Design For Manufacturability And Statistical Design
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Author : Michael Orshansky
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-10-28
Design For Manufacturability And Statistical Design written by Michael Orshansky and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-10-28 with Technology & Engineering categories.
Design for Manufacturability and Statistical Design: A Comprehensive Approach presents a comprehensive overview of methods that need to be mastered in understanding state-of-the-art design for manufacturability and statistical design methodologies. Broadly, design for manufacturability is a set of techniques that attempt to fix the systematic sources of variability, such as those due to photolithography and CMP. Statistical design, on the other hand, deals with the random sources of variability. Both paradigms operate within a common framework, and their joint comprehensive treatment is one of the objectives of this book and an important differentation.
Design For Manufacturability And Yield For Nano Scale Cmos
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Author : Charles Chiang
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-06-15
Design For Manufacturability And Yield For Nano Scale Cmos written by Charles Chiang and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-06-15 with Technology & Engineering categories.
This book walks the reader through all the aspects of manufacturability and yield in a nano-CMOS process. It covers all CAD/CAE aspects of a SOC design flow and addresses a new topic (DFM/DFY) critical at 90 nm and beyond. This book is a must read book the serious practicing IC designer and an excellent primer for any graduate student intent on having a career in IC design or in EDA tool development.
Design For Manufacturability
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Author : Artur Balasinski
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-10-05
Design For Manufacturability written by Artur Balasinski and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-10-05 with Technology & Engineering categories.
This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes. It is a valuable guide for layout designers, packaging engineers and quality engineers, covering DfM development from 1D to 4D, involving IC design flow setup, best practices, links to manufacturing and product definition, for process technologies down to 22 nm node, and product families including memories, logic, system-on-chip and system-in-package.
Vlsi Design For Manufacturing Yield Enhancement
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Author : Stephen W. Director
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Vlsi Design For Manufacturing Yield Enhancement written by Stephen W. Director and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
One of the keys to success in the IC industry is getting a new product to market in a timely fashion and being able to produce that product with sufficient yield to be profitable. There are two ways to increase yield: by improving the control of the manufacturing process and by designing the process and the circuits in such a way as to minimize the effect of the inherent variations of the process on performance. The latter is typically referred to as "design for manufacture" or "statistical design". As device sizes continue to shrink, the effects of the inherent fluctuations in the IC fabrication process will have an even more obvious effect on circuit performance. And design for manufacture will increase in importance. We have been working in the area of statistically based computer aided design for more than 13 years. During the last decade we have been working with each other, and individually with our students, to develop methods and CAD tools that can be used to improve yield during the design and manufacturing phases of IC realization. This effort has resulted in a large number of publications that have appeared in a variety of journals and conference proceedings. Thus our motivation in writing this book is to put, in one place, a description of our approach to IC yield enhancement. While the work that is contained in this book has appeared in the open literature, we have attempted to use a consistent notation throughout this book.
Design For Manufacturability And Yield
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Author : Andrzej J. Strojwas
language : en
Publisher:
Release Date : 1989
Design For Manufacturability And Yield written by Andrzej J. Strojwas and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989 with categories.
Nano Cmos Design For Manufacturability
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Author : Ban P. Wong
language : en
Publisher: John Wiley & Sons
Release Date : 2008-12-29
Nano Cmos Design For Manufacturability written by Ban P. Wong and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-12-29 with Technology & Engineering categories.
Discover innovative tools that pave the way from circuit and physical design to fabrication processing Nano-CMOS Design for Manufacturability examines the challenges that design engineers face in the nano-scaled era, such as exacerbated effects and the proven design for manufacturability (DFM) methodology in the midst of increasing variability and design process interactions. In addition to discussing the difficulties brought on by the continued dimensional scaling in conformance with Moore's law, the authors also tackle complex issues in the design process to overcome the difficulties, including the use of a functional first silicon to support a predictable product ramp. Moreover, they introduce several emerging concepts, including stress proximity effects, contour-based extraction, and design process interactions. This book is the sequel to Nano-CMOS Circuit and Physical Design, taking design to technology nodes beyond 65nm geometries. It is divided into three parts: Part One, Newly Exacerbated Effects, introduces the newly exacerbated effects that require designers' attention, beginning with a discussion of the lithography aspects of DFM, followed by the impact of layout on transistor performance Part Two, Design Solutions, examines how to mitigate the impact of process effects, discussing the methodology needed to make sub-wavelength patterning technology work in manufacturing, as well as design solutions to deal with signal, power integrity, WELL, stress proximity effects, and process variability Part Three, The Road to DFM, describes new tools needed to support DFM efforts, including an auto-correction tool capable of fixing the layout of cells with multiple optimization goals, followed by a look ahead into the future of DFM Throughout the book, real-world examples simplify complex concepts, helping readers see how they can successfully handle projects on Nano-CMOS nodes. It provides a bridge that allows engineers to go from physical and circuit design to fabrication processing and, in short, make designs that are not only functional, but that also meet power and performance goals within the design schedule.
Vlsi Design For Manufacturing Yield Enhancement
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Author : Stephen W. Director
language : en
Publisher: Springer
Release Date : 1989-11-30
Vlsi Design For Manufacturing Yield Enhancement written by Stephen W. Director and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989-11-30 with Technology & Engineering categories.
One of the keys to success in the IC industry is getting a new product to market in a timely fashion and being able to produce that product with sufficient yield to be profitable. There are two ways to increase yield: by improving the control of the manufacturing process and by designing the process and the circuits in such a way as to minimize the effect of the inherent variations of the process on performance. The latter is typically referred to as "design for manufacture" or "statistical design". As device sizes continue to shrink, the effects of the inherent fluctuations in the IC fabrication process will have an even more obvious effect on circuit performance. And design for manufacture will increase in importance. We have been working in the area of statistically based computer aided design for more than 13 years. During the last decade we have been working with each other, and individually with our students, to develop methods and CAD tools that can be used to improve yield during the design and manufacturing phases of IC realization. This effort has resulted in a large number of publications that have appeared in a variety of journals and conference proceedings. Thus our motivation in writing this book is to put, in one place, a description of our approach to IC yield enhancement. While the work that is contained in this book has appeared in the open literature, we have attempted to use a consistent notation throughout this book.
Applications Of Design For Manufacturing And Assembly
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Author : Ancuta Carmen Păcurar
language : en
Publisher: BoD – Books on Demand
Release Date : 2019-01-03
Applications Of Design For Manufacturing And Assembly written by Ancuta Carmen Păcurar and has been published by BoD – Books on Demand this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-01-03 with Technology & Engineering categories.
The book entitled Application of Design for Manufacturing and Assembly aims to present applicable research in the field of design, manufacturing, and assembly realized by researchers affiliated to well-known institutes. The book has a profound interdisciplinary character and is addressed to researchers, engineers, PhD students, graduate and undergraduate students, teachers, and other readers interested in assembly applications. I am confident that readers will find interesting information and challenging topics of high academic and scientific level within this book. The book presents case studies focused on new design for special parts using the principles of Design for Manufacturing and Assembly (DFMA), strategies that minimize the defects in design and manufacturing applications, special devices produced to replace human activity, multiple criteria analysis to evaluate engineering solutions, and the advantages of using the additive manufacturing technology to design the next generation of complex parts, in different engineering fields.
Design For Manufacturability Through Design Process Integration
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Author : Alfred Kwok-Kit Wong
language : en
Publisher: SPIE-International Society for Optical Engineering
Release Date : 2007
Design For Manufacturability Through Design Process Integration written by Alfred Kwok-Kit Wong and has been published by SPIE-International Society for Optical Engineering this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007 with Business & Economics categories.
Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.