Fundamentals Of Packaging Technology
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Fundamentals Of Packaging Technology
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Author : W. Soroka
language : en
Publisher: Ingram
Release Date : 2009
Fundamentals Of Packaging Technology written by W. Soroka and has been published by Ingram this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009 with Containers categories.
Fundamentals Of Packaging Technology
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Author : Institute of Packaging Professionals
language : en
Publisher:
Release Date : 2014
Fundamentals Of Packaging Technology written by Institute of Packaging Professionals and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014 with Containers categories.
Fundamentals Of Packaging Technology
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Author : S. NATARAJAN
language : en
Publisher: PHI Learning Pvt. Ltd.
Release Date : 2014-10-21
Fundamentals Of Packaging Technology written by S. NATARAJAN and has been published by PHI Learning Pvt. Ltd. this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-10-21 with Technology & Engineering categories.
In the current market scenario, packaging provides the most important first point of contact by which a company presents its products to consumers. Though packaging has to perform functions such as product protection and preservation, it is now being accepted as a value addition process. This compact textbook is designed primarily for the undergraduate students of printing technology and mechanical engineering. The text introduces the concepts and techniques relevant to packaging of industrial, pharmaceutical and food products. It covers the package design concepts with emphasis on graphics and colours, as innovation in packaging is taking place at a rapid pace due to the competition among brands for shelf appeal and space. Besides, it also discusses importance of glass as a packaging material, label types and their design, bulk packaging and test procedures on package to evaluate its worthiness in distribution and storage. In the second edition, the book has been updated wherever necessary. Chapter 7 on “Plastics and Speciality Packaging” has been completely overhauled and split to introduce a new chapter on “Package Finishing and Security (Chapter 8). Thus, in contrast to eight chapters of the previous edition, the book now comprises total nine chapters. Besides undergraduate students, this book will also be useful for diploma students of packaging, researchers and professionals in printing and packaging field. Key Features • A Case Study lends a practical orientation towards the subject of study. • Review questions, arranged in a graded manner, sharpen the analytical skills of the students. • Solved problems reinforce the understanding of the subject.
Fundamentals Of Packaging Technology
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Author : Walter Soroka
language : en
Publisher:
Release Date : 1999
Fundamentals Of Packaging Technology written by Walter Soroka and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999 with Art categories.
Fundamentals Of Packaging Technology
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Author : Walter Soroka
language : en
Publisher:
Release Date : 1996
Fundamentals Of Packaging Technology written by Walter Soroka and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with Electronic packaging categories.
Fundamentals Of Packaging Technology
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Author : Walter Soroka
language : en
Publisher:
Release Date : 1995
Fundamentals Of Packaging Technology written by Walter Soroka and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995 with categories.
Packaging Technology
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Author : Anne Emblem
language : en
Publisher: Elsevier
Release Date : 2012-10-29
Packaging Technology written by Anne Emblem and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-10-29 with Technology & Engineering categories.
Packaging is a complex and wide-ranging subject. Comprehensive in scope and authoritative in its coverage, Packaging technology provides the ideal introduction and reference for both students and experienced packaging professionals. Part one provides a context for the book, discussing fundamental issues relating to packaging such as its role in society and its diverse functions, the packaging supply chain and legislative, environmental and marketing issues. Part two reviews the principal packaging materials such as glass, metal, plastics, paper and paper board. It also discusses closures, adhesives and labels. The final part of the book discusses packaging processes, from design and printing to packaging machinery and line operations, as well as hazard and risk management in packaging. With its distinguished editors and expert contributors, Packaging technology is a standard text for the packaging industry. The book is designed both to meet the needs of those studying for the Diploma in Packaging Technology and to act as a comprehensive reference for packaging professionals. Provides the ideal introduction and reference for both students and experienced packaging professionals Examines fundamental issues relating to packaging, such as its role in society, its diverse functions, the packaging supply chain and legislative, environmental and marketing issues Reviews the principal packaging materials such as glass, metal, plastics, paper and paper board
Introduction To Microsystem Packaging Technology
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Author : Yufeng Jin
language : en
Publisher: CRC Press
Release Date : 2017-12-19
Introduction To Microsystem Packaging Technology written by Yufeng Jin and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.
The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.
Fundamentals Of Food Packaging Technology
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Author : Torres
language : en
Publisher: Wiley-Blackwell
Release Date : 2012-05-06
Fundamentals Of Food Packaging Technology written by Torres and has been published by Wiley-Blackwell this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-05-06 with categories.
Fundamentals Of Microsystems Packaging
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Author : Rao Tummala
language : en
Publisher: McGraw Hill Professional
Release Date : 2001-05-08
Fundamentals Of Microsystems Packaging written by Rao Tummala and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001-05-08 with Technology & Engineering categories.
LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing