Handbook Of Electronic Package Design
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Handbook Of Electronics Packaging Design And Engineering
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Author : Bernard S. Matisoff
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Handbook Of Electronics Packaging Design And Engineering written by Bernard S. Matisoff and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Social Science categories.
The Handbook of Electronics Packaging Design and Engineering has been writ ten as a reference source for use in the packaging design of electronics equip ment. It is designed to provide a single convenient source for the solution of re curring design problems. The primary consideration of any design is that the end product meet or exceed the applicable product specifications. The judicious use of uniform design practices will realize the following economies and equipment improvements: • Economics of design. Uniform design practices will result in less engineering and design times and lower costs. They will also reduce the number of changes that may be required due to poor reliability, maintainability, or producibility. • Improved design. Better designs with increased reliability, maintainability, and producibility will result from the use of uniform design practices. • Production economies. Uniform designs employing standard available tools, materials, and parts will result in the cost control of manufacturing. The Handbook is intended primarily for the serious student of electronics packaging and for those engineers and designers actively engaged in this vital and interesting profession. It attempts to present electronics packaging as it is today. It can be used as a training text for instructional purposes and as a reference source for the practicing designer and engineer.
Handbook Of Electronic Package Design
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Author : Michael Pecht
language : en
Publisher: CRC Press
Release Date : 1991-08-16
Handbook Of Electronic Package Design written by Michael Pecht and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 1991-08-16 with Technology & Engineering categories.
Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
Handbook Of Electronic Package Design
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Author : Michael Pecht
language : en
Publisher:
Release Date : 2018
Handbook Of Electronic Package Design written by Michael Pecht and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018 with Electronic packaging categories.
Handbook Of Electronic Package Design
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Author : Michael Pecht
language : en
Publisher: CRC Press
Release Date : 2018-10-24
Handbook Of Electronic Package Design written by Michael Pecht and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-24 with Technology & Engineering categories.
Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
The Electronic Packaging Handbook
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Author : Glenn R. Blackwell
language : en
Publisher: CRC Press
Release Date : 2017-12-19
The Electronic Packaging Handbook written by Glenn R. Blackwell and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.
The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
The Electronic Design Automation Handbook
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Author : Dirk Jansen
language : en
Publisher: Springer Science & Business Media
Release Date : 2003-07-31
The Electronic Design Automation Handbook written by Dirk Jansen and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003-07-31 with Computers categories.
The Electronic Design Automation Handbook carefully details design tools and techniques for high performance ASIC-design. It shows the best practices for creating reusable designs in an SoC design methodology. The Electronic Design Automation Handbook was developed by colleagues from the Universities of Applied Sciences, Germany, who are engaged in the design of integrated electronics in education and research and which form the MPC Group of the Universities of Applied Sciences of Baden-Württemberg /Germany. MPC works as network of partners to industry and is able, due to the wide varying experiences of the institutes involved, to cover the entire range of the modern day circuit design. Each year more than 600 students are educated in the laboratories of MPC-members. Our personal experience from student and industry-projects ensures authenticity. The practical and theoretical experience from our projects has been used in the basis of this handbook.
Mechanical Analysis Of Electronic Packaging Systems
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Author : Mckeown
language : en
Publisher: CRC Press
Release Date : 1999-04-06
Mechanical Analysis Of Electronic Packaging Systems written by Mckeown and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999-04-06 with Technology & Engineering categories.
"Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."
Electronic Packaging And Interconnection Handbook
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Author : Charles A. Harper
language : en
Publisher: McGraw-Hill Companies
Release Date : 1997
Electronic Packaging And Interconnection Handbook written by Charles A. Harper and has been published by McGraw-Hill Companies this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Technology & Engineering categories.
Charles A. Harper's 2nd edition on designing and manufacturing all the major types of electronic systems is now double the size of the 1st edition. It draws upon the expertise of a dozen experts to make sense of this highly interdisciplinary field
Microelectronics Packaging Handbook
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Author : Rao Tummala
language : en
Publisher: Springer Science & Business Media
Release Date : 1997-01-31
Microelectronics Packaging Handbook written by Rao Tummala and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997-01-31 with Computers categories.
Provides the advances in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. This book discusses packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry.
The Electronic Packaging Handbook
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Author : Glenn R. Blackwell
language : en
Publisher: CRC Press
Release Date : 2017-12-19
The Electronic Packaging Handbook written by Glenn R. Blackwell and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.
The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.