Handbook Of Thick And Thin Film Hybrid Microelectronics
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Handbook Of Thick And Thin Film Hybrid Microelectronics
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Author : Tapan Gupta
language : en
Publisher: Wiley-Interscience
Release Date : 2003-04-17
Handbook Of Thick And Thin Film Hybrid Microelectronics written by Tapan Gupta and has been published by Wiley-Interscience this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003-04-17 with Technology & Engineering categories.
"This handbook is meant to be an introduction to the design, layout , and fabrication of hybrid microelectronic circuits for electrical engineering students as well as a reference book for practitioners in this discipline. ... The text has grown out of notes prepared for a one-semester graduate level course in the Electrical Engineering Department of Tufts university." -- preface.
Electronic Materials Handbook
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Author :
language : en
Publisher: ASM International
Release Date : 1989-11-01
Electronic Materials Handbook written by and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989-11-01 with Technology & Engineering categories.
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
The Electronics Handbook
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Author : Jerry C. Whitaker
language : en
Publisher: CRC Press
Release Date : 2018-10-03
The Electronics Handbook written by Jerry C. Whitaker and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-03 with Technology & Engineering categories.
During the ten years since the appearance of the groundbreaking, bestselling first edition of The Electronics Handbook, the field has grown and changed tremendously. With a focus on fundamental theory and practical applications, the first edition guided novice and veteran engineers along the cutting edge in the design, production, installation, operation, and maintenance of electronic devices and systems. Completely updated and expanded to reflect recent advances, this second edition continues the tradition. The Electronics Handbook, Second Edition provides a comprehensive reference to the key concepts, models, and equations necessary to analyze, design, and predict the behavior of complex electrical devices, circuits, instruments, and systems. With 23 sections that encompass the entire electronics field, from classical devices and circuits to emerging technologies and applications, The Electronics Handbook, Second Edition not only covers the engineering aspects, but also includes sections on reliability, safety, and engineering management. The book features an individual table of contents at the beginning of each chapter, which enables engineers from industry, government, and academia to navigate easily to the vital information they need. This is truly the most comprehensive, easy-to-use reference on electronics available.
Mass Spectrometry Handbook
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Author : Mike S. Lee
language : en
Publisher: John Wiley & Sons
Release Date : 2012-04-16
Mass Spectrometry Handbook written by Mike S. Lee and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-04-16 with Science categories.
Due to its enormous sensitivity and ease of use, mass spectrometry has grown into the analytical tool of choice in most industries and areas of research. This unique reference provides an extensive library of methods used in mass spectrometry, covering applications of mass spectrometry in fields as diverse as drug discovery, environmental science, forensic science, clinical analysis, polymers, oil composition, doping, cellular research, semiconductor, ceramics, metals and alloys, and homeland security. The book provides the reader with a protocol for the technique described (including sampling methods) and explains why to use a particular method and not others. Essential for MS specialists working in industrial, environmental, and clinical fields.
Copper Interconnect Technology
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Author : Tapan Gupta
language : en
Publisher: Springer Science & Business Media
Release Date : 2010-01-22
Copper Interconnect Technology written by Tapan Gupta and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-01-22 with Technology & Engineering categories.
Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.
A Refresher Guide To Thin Film Technology
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Author : Ashok K. Batra
language : en
Publisher: Mahi Publication
Release Date : 2023-12-15
A Refresher Guide To Thin Film Technology written by Ashok K. Batra and has been published by Mahi Publication this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-12-15 with Antiques & Collectibles categories.
Thin films have significantly impacted the present modern era of technology and are considered the backbone of advanced applications in various fields, such as optical devices, environmental applications, telecommunications devices, energy storage, photovoltaic solar cells, integrated circuits, and others. The critical issue for all applications of thin films depends on their morphology and stability. The morphology of thin films strongly depends on the deposition techniques. Hence due to its multidisciplinary nature, a background in thin film technology requires skills such as chemistry, physics, electrical engineering, and materials science and engineering
Handbook Of Rf And Microwave Power Amplifiers
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Author : John L. B. Walker
language : en
Publisher: Cambridge University Press
Release Date : 2012
Handbook Of Rf And Microwave Power Amplifiers written by John L. B. Walker and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012 with Technology & Engineering categories.
This is a one-stop guide for circuit designers and system/device engineers, covering everything from CAD to reliability.
Passive Rf And Microwave Integrated Circuits
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Author : Leo Maloratsky
language : en
Publisher: Elsevier
Release Date : 2003-12-01
Passive Rf And Microwave Integrated Circuits written by Leo Maloratsky and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003-12-01 with Technology & Engineering categories.
The growth in RF and wireless/mobile computing devices that operate at microwave frequencies has resulted in explosive demand for integrated circuits capable of operating at such frequencies in order to accomplish functions like frequency division, phase shifting, attenuation, and isolators and circulators for antennas. This book is an introduction to such ICs, combining theory and practical applications of those devices. In addition to this combined theory and application approach, the author discusses the critical importance of differing fabrication materials on the performance of ICs at different frequencies. This is an area often overlooked when choosing ICs for RF and microwave applications, yet it can be a crucial factor in how an IC performs in a given application. - Gives reader a solid background in an increasingly important area of circuit design - Emphasis on combination of theoretical discussions with practical application examples - In-depth discussion of critical, but often overlooked topic of different fabrication material performances at varying frequencies
Optical Wideband Transmission Systems
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Author : Clemens Baack
language : en
Publisher: CRC Press
Release Date : 2018-01-18
Optical Wideband Transmission Systems written by Clemens Baack and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-01-18 with Technology & Engineering categories.
This book is concerned with high bit rate systems, which are predestined particularly for the long-distance trunk lines that will be used in future communications networks.
The Electronic Packaging Handbook
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Author : Glenn R. Blackwell
language : en
Publisher: CRC Press
Release Date : 2017-12-19
The Electronic Packaging Handbook written by Glenn R. Blackwell and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.
The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.