Heterogeneous Integration Of Materials For Passive Components And Smart Systems Volume 969
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Heterogeneous Integration Of Materials For Passive Components And Smart Systems Volume 969
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Author : Juan C. Nino
language : en
Publisher:
Release Date : 2007-05-30
Heterogeneous Integration Of Materials For Passive Components And Smart Systems Volume 969 written by Juan C. Nino and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-05-30 with Technology & Engineering categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2007, discusses advances, the current status, and future challenges in the broad area of materials integration for passive components and smart systems.
Solid State Ionics 2006 Volume 972
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Author : E. Traversa
language : en
Publisher:
Release Date : 2007-04-02
Solid State Ionics 2006 Volume 972 written by E. Traversa and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-04-02 with Science categories.
Solid-state ionics is at the foundation for the development of environmentally friendly devices such as batteries and fuel cells for energy storage and conversion, and chemical sensors for pollution monitoring and control. The progress of such devices is crucial for sustainable development. Further insight into the study of fundamentals of ion transport and interfacial phenomena in advanced materials, including ceramics, glasses, polymers, composites and hybrids will allow better design, fabrication and performance of devices for their extensive use. This book is intended to help promote the fundamental understanding of ionic (including protonic) and electronic transport in solids, especially of interfacial transport, including the developing field of nanostructured materials. Contributions encompass fundamental materials R&D, characterization and materials for batteries, sensors, membranes, and fuel cells. Special emphasis is given to the development of high-temperature proton conductors and their application in solid-oxide fuel cells and hydrogen permeation membranes.
Advanced Electronic Packaging Volume 968
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Author : Vasudeva P. Atluri
language : en
Publisher:
Release Date : 2007-04-09
Advanced Electronic Packaging Volume 968 written by Vasudeva P. Atluri and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-04-09 with Technology & Engineering categories.
Microelectronic packaging architecture evolutions are being driven by silicon technology advancements and new form factors, used models and emerging technologies. High-performance mobile computer and communication systems will require higher I/O counts, greater density, lower cost, lighter weight and improved performance in the electronic package. The book focuses on silicon technology dimension scaling and performance improvement, Pb-free or 'green' assembly, and system-in-package (SIP) technologies. It explores the key thermomechanical failure modes and mitigating solutions associated with integration of silicon with weak interlayer dielectrics during the assembly process, under bump metallurgy integrity with lead-free assembly, and the impact of stress on die-cracking and transistor performance in 3D thin-die stacking. The interaction of these failures with silicon and assembly materials, processes and design features is covered and includes: system in package; advanced packaging/nanotechnology in packaging; physical behavior and mechanical behavior in packaging; electromigration and thermal behavior in packaging and thin films and adhesives in packaging.
Materials Research At High Pressure Volume 987
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Author : Materials Research Society. Meeting
language : en
Publisher:
Release Date : 2007-04-03
Materials Research At High Pressure Volume 987 written by Materials Research Society. Meeting and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-04-03 with Technology & Engineering categories.
High-pressure materials research has been revolutionized in the past few years due to technological breakthroughs in the diamond anvil cell (DAC), shock wave compression, and first-principles molecular dynamic simulation (MD) methods. Pressure-induced chemistry and high-pressure synthesis of superhard materials were topics of the successful Symposium DD, High-Pressure Materials Research, held at the 1997 MRS Fall Meeting in Boston. Since then, a plethora of discoveries have been made, including new materials synthesized under high pressure, geophysical-geochemical material conversion and ionization prior to polymerization of molecular solids. Additionally, new experimental and computational techniques, such as in situ studies of materials properties and transformations using laser heating are increasingly providing a deeper insight and a few surprises for the behavior and properties of matter at elevated pressure conditions. This book provides a timely report on progress in the field. Topics include: synthesis and characterization; disordered systems; dense molecular materials; and properties under extreme conditions.
Enabling Technologies For 3 D Integration Volume 970
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Author : Christopher A. Bower
language : en
Publisher:
Release Date : 2007-03-30
Enabling Technologies For 3 D Integration Volume 970 written by Christopher A. Bower and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-03-30 with Computers categories.
An emerging technology or device architecture called 3-D IC integration is based on the system performance gains that can be achieved by stacking and vertically interconnecting distinct device chips. The 3-D concept of replacing long 2-D interconnects with shorter vertical (3-D) interconnects has the potential to alleviate the well-known interconnect (RC) delay problem facing the semiconductor industry. Additional benefits of the 3-D concept for the IC maker include reduced die size and the ability to use distinct technologies (analog, logic, RF, etc...) on separate vertically interconnected layers. The 3-D concept, therefore, allows the integration of otherwise incompatible technologies, and offers significant advantages in performance, functionality, and form factor. Topics in this book include: fabrication of 3-D ICs; modeling, simulation and scaling of 3-D integrated devices; applications of 3-D integration; through wafer interconnects for 3-D packaging and interposer applications; bonding technology for 3-D integration; and enabling processes for 3-D integration.
Group Iv Semiconductor Nanostructures 2006 Volume 958
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Author : Leonid Tsybeskov
language : en
Publisher:
Release Date : 2007-03-28
Group Iv Semiconductor Nanostructures 2006 Volume 958 written by Leonid Tsybeskov and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-03-28 with Technology & Engineering categories.
This book focuses on advances in materials science and device applications of nanostructures composed of Si, Ge, diamond, SiGe and SiCGe. Continuous progress in the development of reproducibly grown quantum dots, wires and wells has produced a new class of functional materials and devices with characteristic dimensions less than 50nm. The broad spectrum of these devices ranges from commercially offered high-mobility transistors using strained Si to exploratory SiGe nanostructures for integrated optical interconnects and THz lasers. This book brings together researchers from chemistry, physics, biology, materials science and engineering to share and discuss both the challenges and progress towards a new generation of Si(SiGe, SiCGe)-based novel functional structures and devices. Topics include: light emission and photonic devices; Ge, SiGe and diamond nanostructures; strains, Si/Ge films and layers and Si nanocrystals.
Actinides 2006 Basic Science Applications And Technology
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Author : Materials Research Society. Meeting
language : en
Publisher:
Release Date : 2007
Actinides 2006 Basic Science Applications And Technology written by Materials Research Society. Meeting and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007 with Science categories.
Advanced Intermetallic Based Alloys
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Author : Jörg Wiezorek
language : en
Publisher:
Release Date : 2007
Advanced Intermetallic Based Alloys written by Jörg Wiezorek and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007 with Science categories.
Solid State Ionics
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Author :
language : en
Publisher:
Release Date : 2006
Solid State Ionics written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006 with Ions categories.
Zinc Oxide And Related Materials Volume 957
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Author : Jürgen H. Christen
language : en
Publisher:
Release Date : 2007-04-05
Zinc Oxide And Related Materials Volume 957 written by Jürgen H. Christen and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-04-05 with Technology & Engineering categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. The topics covered in this volume, first published in 2007, include devices, defects, spintronics and magnetism, growth, optical properties and nanostructures, and doping and processing TFTs.