Hybrid Microcircuit Technology Handbook
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Hybrid Microcircuit Technology Handbook
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Author : James J. Licari
language : en
Publisher: William Andrew
Release Date : 1988
Hybrid Microcircuit Technology Handbook written by James J. Licari and has been published by William Andrew this book supported file pdf, txt, epub, kindle and other format this book has been release on 1988 with Technology & Engineering categories.
The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will be of value to materials and process engineers, chemists, and electrical engineers who design and test hybrid circuits.
Hybrid Microcircuit Technology Handbook
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Author : James J. Licari
language : en
Publisher: Elsevier
Release Date : 1998-12-31
Hybrid Microcircuit Technology Handbook written by James J. Licari and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998-12-31 with Technology & Engineering categories.
The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will be of value to materials and process engineers, chemists, and electrical engineers who design and test hybrid circuits.
Hybrid Microcircuit Technology Handbook Materials Processes Design Testing And Production
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Author : J.L. Licari
language : it
Publisher:
Release Date :
Hybrid Microcircuit Technology Handbook Materials Processes Design Testing And Production written by J.L. Licari and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on with categories.
Ceramic Interconnect Technology Handbook
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Author : Fred D. Barlow, III
language : en
Publisher: CRC Press
Release Date : 2018-10-03
Ceramic Interconnect Technology Handbook written by Fred D. Barlow, III and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-03 with Technology & Engineering categories.
Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
Handbook Of Hydrothermal Technology
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Author : K. Byrappa
language : en
Publisher: Cambridge University Press
Release Date : 2008-12-10
Handbook Of Hydrothermal Technology written by K. Byrappa and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-12-10 with Science categories.
Quartz, zeolites, gemstones, perovskite type oxides, ferrite, carbon allotropes, complex coordinated compounds and many moreùall products now being produced using hydrothermal technology. Handbook of Hydrothermal Technology brings together the latest techniques in this rapidly advancing field in one exceptionally useful, long-needed volume. The handbook provides a single source for understanding how aqueous solvents or mineralizers work under temperature and pressure to dissolve and recrystallize normally insoluble materials, and decompose or recycle any waste material. The result, as the authors show in the book, is technologically the most efficient method in crystal growth, materials processing, and waste treatment. The book gives scientists and technologists an overview of the entire subject including: ò Evolution of the technology from geology to widespread industrial use. ò Descriptions of equipment used in the process and how it works. ò Problems involved with the growth of crystals, processing of technological materials, environmental and safety issues. ò Analysis of the direction of today's technology. In addition, readers get a close look at the hydrothermal synthesis of zeolites, fluorides, sulfides, tungstates, and molybdates, as well as native elements and simple oxides. Delving into the commercial production of various types, the authors clarify the effects of temperature, pressure, solvents, and various other chemical components on the hydrothermal processes.
Handbook Of Thin Film Deposition Techniques Principles Methods Equipment And Applications Second Editon
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Author : Krishna Seshan
language : en
Publisher: CRC Press
Release Date : 2002-02-01
Handbook Of Thin Film Deposition Techniques Principles Methods Equipment And Applications Second Editon written by Krishna Seshan and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002-02-01 with Science categories.
The Handbook of Thin Film Deposition Techniques: Principles, Methods, Equipment and Applications, Second Edition explores the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition tec
Semiconductor Industrial Hygiene Handbook
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Author : David G. Baldwin
language : en
Publisher: William Andrew
Release Date : 1995-12-31
Semiconductor Industrial Hygiene Handbook written by David G. Baldwin and has been published by William Andrew this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995-12-31 with Science categories.
This book provides a comprehensive review of the primary industrial hygiene topics relevant to semiconductor processing: chemical and physical agents, and ventilation systems. The book also has excellent chapters on newer industrial hygiene concerns that are not specific to the semiconductor industry: ergonomics, indoor air quality, personal protective equipment, plan review, and records retention. While much of the information in these chapters can be applied to all industries, the focus and orientation is specific to issues in the semiconductor industry.
Adhesives Technology For Electronic Applications
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Author : James J. Licari
language : en
Publisher: William Andrew
Release Date : 2011-06-24
Adhesives Technology For Electronic Applications written by James J. Licari and has been published by William Andrew this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-06-24 with Technology & Engineering categories.
Approx.512 pagesApprox.512 pages
Integrated Circuit Packaging Assembly And Interconnections
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Author : William Greig
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-04-24
Integrated Circuit Packaging Assembly And Interconnections written by William Greig and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-04-24 with Technology & Engineering categories.
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.
Power Electronic Modules
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Author : William W. Sheng
language : en
Publisher: CRC Press
Release Date : 2004-09-29
Power Electronic Modules written by William W. Sheng and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-09-29 with Technology & Engineering categories.
Designing and building power semiconductor modules requires a broad, interdisciplinary base of knowledge and experience, ranging from semiconductor materials and technologies, thermal management, and soldering to environmental constraints, inspection techniques, and statistical process control. This diversity poses a significant challenge to engine