Iii V And Iv Iv Materials And Processing Challenges For Highly Integrated Microelectronics And Optoelectronics Volume 535
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Iii V And Iv Iv Materials And Processing Challenges For Highly Integrated Microelectronics And Optoelectronics Volume 535
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Author : S. A. Ringel
language : en
Publisher:
Release Date : 1999-08-11
Iii V And Iv Iv Materials And Processing Challenges For Highly Integrated Microelectronics And Optoelectronics Volume 535 written by S. A. Ringel and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999-08-11 with Technology & Engineering categories.
This book contains the proceedings of two symposia - 'Integration of Dissimilar Materials in Micro- and Optoelectronics' and 'III-V and SiGe Group IV Device/IC Processing Challenges for Commercial Applications'. The publication stems from the desire to achieve new levels of device functionality and higher levels of performance via integration of devices based on dissimilar semiconductors, where the constraint of lattice-matching on the breadth of attainable devices can be reduced. It covers fundamental topics germane to integration of a wide range of dissimilar materials spanning wide-bandgap III-V nitrides, III-V/Si integration, II-VI and II-VI/III-V compounds, heterovalent structures, oxides, photonic bandgap structures and others. Topics such as compliancy, dislocation control, selective area growth, bonding methodologies, etc. are featured. It also addresses processing issues in the manufacturing of III-V and Si-based heterostructures for commercial products. Here, the success enjoyed by silicon germanium technology is contrasted by the promise of silicon-carbon alloys which have opportunities and challenges for the new generation of process developers.
Materials Reliability In Microelectronics
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Author :
language : en
Publisher:
Release Date : 1999
Materials Reliability In Microelectronics written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999 with Microelectronics categories.
Index Of Conference Proceedings
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Author : British Library. Document Supply Centre
language : en
Publisher:
Release Date : 1999
Index Of Conference Proceedings written by British Library. Document Supply Centre and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999 with Conference proceedings categories.
Directory Of Published Proceedings
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Author :
language : en
Publisher:
Release Date : 2002
Directory Of Published Proceedings written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Engineering categories.
Books In Print 2004 2005
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Author : Ed Bowker Staff
language : en
Publisher: R. R. Bowker
Release Date : 2004
Books In Print 2004 2005 written by Ed Bowker Staff and has been published by R. R. Bowker this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with Reference categories.
Archiv Der Ns Presse
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Author :
language : en
Publisher:
Release Date : 1938
Archiv Der Ns Presse written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1938 with categories.
Books In Series
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Author :
language : en
Publisher:
Release Date : 1985
Books In Series written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1985 with Monographic series categories.
Vols. for 1980- issued in three parts: Series, Authors, and Titles.
Wafer Bonding
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Author : Marin Alexe
language : en
Publisher: Springer Science & Business Media
Release Date : 2004-05-14
Wafer Bonding written by Marin Alexe and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-05-14 with Science categories.
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Bibliographic Guide To Conference Publications
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Author : New York Public Library. Research Libraries
language : en
Publisher:
Release Date : 1976
Bibliographic Guide To Conference Publications written by New York Public Library. Research Libraries and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1976 with Congresses and conventions categories.
Vols. for 1975- include publications cataloged by the Research Libraries of the New York Public Library with additional entries from the Library of Congress MARC tapes.
Forthcoming Books
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Author : Rose Arny
language : en
Publisher:
Release Date : 1997
Forthcoming Books written by Rose Arny and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with American literature categories.