Influence Of Temperature On Microelectronics And System Reliability
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Influence Of Temperature On Microelectronics And System Reliability
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Author : Pradeep Lall
language : en
Publisher: CRC Press
Release Date : 2020-07-09
Influence Of Temperature On Microelectronics And System Reliability written by Pradeep Lall and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-07-09 with Technology & Engineering categories.
This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
Influence Of Temperature On Microelectronics And System Reliability
DOWNLOAD
Author : Pradeep Lall
language : en
Publisher: CRC Press
Release Date : 2020-07-09
Influence Of Temperature On Microelectronics And System Reliability written by Pradeep Lall and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-07-09 with Technology & Engineering categories.
This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
Reliability Technology
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Author : Norman Pascoe
language : en
Publisher: John Wiley & Sons
Release Date : 2011-04-25
Reliability Technology written by Norman Pascoe and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-04-25 with Technology & Engineering categories.
A unique book that describes the practical processes necessary to achieve failure free equipment performance, for quality and reliability engineers, design, manufacturing process and environmental test engineers. This book studies the essential requirements for successful product life cycle management. It identifies key contributors to failure in product life cycle management and particular emphasis is placed upon the importance of thorough Manufacturing Process Capability reviews for both in-house and outsourced manufacturing strategies. The readers? attention is also drawn to the many hazards to which a new product is exposed from the commencement of manufacture through to end of life disposal. Revolutionary in focus, as it describes how to achieve failure free performance rather than how to predict an acceptable performance failure rate (reliability technology rather than reliability engineering) Author has over 40 years experience in the field, and the text is based on classroom tested notes from the reliability technology course he taught at Massachusetts Institute of Technology (MIT), USA Contains graphical interpretations of mathematical models together with diagrams, tables of physical constants, case studies and unique worked examples
Reliability Yield And Stress Burn In
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Author : Way Kuo
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27
Reliability Yield And Stress Burn In written by Way Kuo and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Technology & Engineering categories.
The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: • the economic impact of employing the microelectronics fabricated by in dustry, • a study of the relationship between reliability and yield, • the progression toward miniaturization and higher reliability, and • the correctness and complexity of new system designs, which include a very significant portion of software.
Practical Reliability Engineering
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Author : Patrick O'Connor
language : en
Publisher: John Wiley & Sons
Release Date : 2012-01-30
Practical Reliability Engineering written by Patrick O'Connor and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-01-30 with Technology & Engineering categories.
With emphasis on practical aspects of engineering, this bestseller has gained worldwide recognition through progressive editions as the essential reliability textbook. This fifth edition retains the unique balanced mixture of reliability theory and applications, thoroughly updated with the latest industry best practices. Practical Reliability Engineering fulfils the requirements of the Certified Reliability Engineer curriculum of the American Society for Quality (ASQ). Each chapter is supported by practice questions, and a solutions manual is available to course tutors via the companion website. Enhanced coverage of mathematics of reliability, physics of failure, graphical and software methods of failure data analysis, reliability prediction and modelling, design for reliability and safety as well as management and economics of reliability programmes ensures continued relevance to all quality assurance and reliability courses. Notable additions include: New chapters on applications of Monte Carlo simulation methods and reliability demonstration methods. Software applications of statistical methods, including probability plotting and a wider use of common software tools. More detailed descriptions of reliability prediction methods. Comprehensive treatment of accelerated test data analysis and warranty data analysis. Revised and expanded end-of-chapter tutorial sections to advance students’ practical knowledge. The fifth edition will appeal to a wide range of readers from college students to seasoned engineering professionals involved in the design, development, manufacture and maintenance of reliable engineering products and systems. www.wiley.com/go/oconnor_reliability5
Parts Selection And Management
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Author : Michael Pecht
language : en
Publisher: John Wiley & Sons
Release Date : 2005-03-11
Parts Selection And Management written by Michael Pecht and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005-03-11 with Technology & Engineering categories.
Increase profitability and reduce risk through effective parts selection and management Corporations recognize that technology can be the key to fueling product design and development. But just as crucial-if not more-to a company's success are the decisions about when, what, and how a technology will be used. Few companies have failed because the right technology was not available; many have failed when a technology was not effectively selected and managed. Parts Selection and Management is a guide to increasing company profitability and reducing the time-to-profit through the efficient management of the process of parts selection and management. Taking an "eyes-on, hands-off" approach to parts selection, this guidebook addresses risk-assessment, decision-making steps, and subsequent management activities. The book covers everything from methodologies for parts selection and management, product requirements and specifications, and manufacturer assessment procedures to ways to track part changes through the supply chain, reliability assessment, and environmental, legislative, and legal issues. Written by a seasoned professional, teacher, and author in the field, the book enables companies to: * Employ effective risk assessment and mitigation techniques * Make an informed company-wide decision about parts selection and management * Choose parts to fit the functionality of the product and other constraints * Maximize system supportability by preparing for parts obsolescence * Improve supply-chain interactions and communications with customers and regulatory agencies to minimize time-to-profit Shedding light on a neglected but essential aspect of product development, Parts Selection and Management will give your organization the tools you need to avoid the risks associated with product use while promoting flexibility, innovation, and creativity in your product development.
Reliability Engineering
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Author : Kailash C. Kapur
language : en
Publisher: John Wiley & Sons
Release Date : 2014-03-21
Reliability Engineering written by Kailash C. Kapur and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-03-21 with Technology & Engineering categories.
An Integrated Approach to Product Development Reliability Engineering presents an integrated approach to the design, engineering, and management of reliability activities throughout the life cycle of a product, including concept, research and development, design, manufacturing, assembly, sales, and service. Containing illustrative guides that include worked problems, numerical examples, homework problems, a solutions manual, and class-tested materials, it demonstrates to product development and manufacturing professionals how to distribute key reliability practices throughout an organization. The authors explain how to integrate reliability methods and techniques in the Six Sigma process and Design for Six Sigma (DFSS). They also discuss relationships between warranty and reliability, as well as legal and liability issues. Other topics covered include: Reliability engineering in the 21st Century Probability life distributions for reliability analysis Process control and process capability Failure modes, mechanisms, and effects analysis Health monitoring and prognostics Reliability tests and reliability estimation Reliability Engineering provides a comprehensive list of references on the topics covered in each chapter. It is an invaluable resource for those interested in gaining fundamental knowledge of the practical aspects of reliability in design, manufacturing, and testing. In addition, it is useful for implementation and management of reliability programs.
Photovoltaic Pv System Delivery As Reliable Energy Infrastructure
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Author : John R. Balfour
language : en
Publisher: John Wiley & Sons
Release Date : 2024-04-01
Photovoltaic Pv System Delivery As Reliable Energy Infrastructure written by John R. Balfour and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-04-01 with Science categories.
PHOTOVOLTAIC (PV) SYSTEM DELIVERY AS RELIABLE ENERGY INFRASTRUCTURE A practical guide to improving photovoltaic power plant lifecycle performance and output Photovoltaic (PV) System Delivery as Reliable Energy Infrastructure introduces a Preemptive Analytical Maintenance (PAM) for photovoltaic systems engineering, and the RepoweringTM planning approach, as a structured integrated system delivery process. A team of veteran photovoltaics professionals delivers a robust discussion of the lessons learned from mature industries—including PV, aerospace, utilities, rail, marine, and automotive—as applied to the photovoltaic industry. The book offers real-world “technical and fiscal” examples of the impact of photovoltaics to all stakeholders during the concept, specification, operations, maintenance, and RepoweringTM phases. In each chapter, readers will learn to develop RAMS specifications, reliability data collection, and tasks while becoming familiar with the inherent benefits of how these affect the cost of design and development, maintenance, spares, and systems operation. The authors also explain when and how to consider and implement RepoweringTM, plant upgrades and the considerations from concept through retirement and disposal of the plant. Readers will also find: A thorough introduction to Preemptive Analytical Maintenance (PAM), including systems engineering, lifecycle planning, risk management, risk assessment, risk reduction, as compared to the historic utility models, An in-depth treatment of the modern photovoltaic industry, including economic factors and the present endlessly evolving state of technology, Constructive discussions and application of systems engineering, including RAMS and System Engineering practices and solutions, Extensive explorations and application of data collection, curation, and analysis for PV systems, including advanced sensor technologies. Perfect for all new through to experienced photovoltaic design and specification engineers, photovoltaic plant owners, operators, PV asset managers and all interested stakeholders. Photovoltaic (PV) System Delivery as Reliable Energy Infrastructure will also earn a place in the libraries of utilities, engineering, procurements, construction professionals and students.
The Rf And Microwave Handbook 3 Volume Set
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Author : Mike Golio
language : en
Publisher: CRC Press
Release Date : 2018-10-08
The Rf And Microwave Handbook 3 Volume Set written by Mike Golio and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-08 with Technology & Engineering categories.
By 1990 the wireless revolution had begun. In late 2000, Mike Golio gave the world a significant tool to use in this revolution: The RF and Microwave Handbook. Since then, wireless technology spread across the globe with unprecedented speed, fueled by 3G and 4G mobile technology and the proliferation of wireless LANs. Updated to reflect this tremendous growth, the second edition of this widely embraced, bestselling handbook divides its coverage conveniently into a set of three books, each focused on a particular aspect of the technology. Six new chapters cover WiMAX, broadband cable, bit error ratio (BER) testing, high-power PAs (power amplifiers), heterojunction bipolar transistors (HBTs), as well as an overview of microwave engineering. Over 100 contributors, with diverse backgrounds in academic, industrial, government, manufacturing, design, and research reflect the breadth and depth of the field. This eclectic mix of contributors ensures that the coverage balances fundamental technical issues with the important business and marketing constraints that define commercial RF and microwave engineering. Focused chapters filled with formulas, charts, graphs, diagrams, and tables make the information easy to locate and apply to practical cases. The new format, three tightly focused volumes, provides not only increased information but also ease of use. You can find the information you need quickly, without wading through material you don’t immediately need, giving you access to the caliber of data you have come to expect in a much more user-friendly format.
Encapsulation Technologies For Electronic Applications
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Author : Haleh Ardebili
language : en
Publisher: William Andrew
Release Date : 2018-10-23
Encapsulation Technologies For Electronic Applications written by Haleh Ardebili and has been published by William Andrew this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-23 with Technology & Engineering categories.
Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics Includes coverage of environmentally friendly 'green encapsulants' Presents coverage of faults and defects, and how to analyze and avoid them