Influence Of Temperature On Microelectronics And System Reliability
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Influence Of Temperature On Microelectronics And System Reliability
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Author : Pradeep Lall
language : en
Publisher: CRC Press
Release Date : 2020-07-09
Influence Of Temperature On Microelectronics And System Reliability written by Pradeep Lall and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-07-09 with Technology & Engineering categories.
This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
Influence Of Temperature On Microelectronics And System Reliability
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Author : Pradeep Lall
language : en
Publisher: CRC Press
Release Date : 1997-04-24
Influence Of Temperature On Microelectronics And System Reliability written by Pradeep Lall and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997-04-24 with Technology & Engineering categories.
This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The final chapter overviews existing guidelines for thermal derating of microelectronic devices, which presently involve lowering the junction temperature. The reader then learns how to use physics-of-failure models presented in the previous chapters for various failure processes, to evaluate the sensitivity of device life to variations in manufacturing defects, device architecture, temperature, and non-temperature stresses.
Influence Of Temperature On Microelectronics And System Reliability
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Author : Pradeep Lall
language : en
Publisher:
Release Date : 2019
Influence Of Temperature On Microelectronics And System Reliability written by Pradeep Lall and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019 with Electronic apparatus and appliances categories.
This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs.The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture.The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
Rf And Microwave Applications And Systems
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Author : Mike Golio
language : en
Publisher: CRC Press
Release Date : 2018-10-03
Rf And Microwave Applications And Systems written by Mike Golio and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-03 with Technology & Engineering categories.
This volume, RF and Microwave Applications and Systems, includes a wide range of articles that discuss RF and microwave systems used for communication and radar and heating applications. Commercial, avionics, medical, and military applications are addressed. An overview of commercial communications systems is provided. Past, current, and emerging cellular systems, navigation systems, and satellite-based systems are discussed. Specific voice and data commercial systems are investigated more thoroughly in individual chapters that follow. Detailed discussions of military electronics, avionics, and radar (both military and automotive) are provided in separate chapters. A chapter focusing on FR/microwave energy used for therapeutic medicine is also provided. Systems considerations including thermal, mechanical, reliability, power management, and safety are discussed in separate chapters. Engineering processes are also explored in articles about corporate initiatives, cost modeling, and design reviews. The book closes with a discussion of the underlying physics of electromagnetic propagation and interference. In addition to new chapters on WiMAX and broadband cable, nearly every existing chapter features extensive updates and several were completely rewritten to reflect the massive changes areas such as radio navigation and electronic warfare.
Extreme Environment Electronics
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Author : John D. Cressler
language : en
Publisher: CRC Press
Release Date : 2017-12-19
Extreme Environment Electronics written by John D. Cressler and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.
Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.
Applied Reliability Engineering And Risk Analysis
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Author : Ilia B. Frenkel
language : en
Publisher: John Wiley & Sons
Release Date : 2013-08-22
Applied Reliability Engineering And Risk Analysis written by Ilia B. Frenkel and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-08-22 with Technology & Engineering categories.
This complete resource on the theory and applications of reliability engineering, probabilistic models and risk analysis consolidates all the latest research, presenting the most up-to-date developments in this field. With comprehensive coverage of the theoretical and practical issues of both classic and modern topics, it also provides a unique commemoration to the centennial of the birth of Boris Gnedenko, one of the most prominent reliability scientists of the twentieth century. Key features include: expert treatment of probabilistic models and statistical inference from leading scientists, researchers and practitioners in their respective reliability fields detailed coverage of multi-state system reliability, maintenance models, statistical inference in reliability, systemability, physics of failures and reliability demonstration many examples and engineering case studies to illustrate the theoretical results and their practical applications in industry Applied Reliability Engineering and Risk Analysis is one of the first works to treat the important areas of degradation analysis, multi-state system reliability, networks and large-scale systems in one comprehensive volume. It is an essential reference for engineers and scientists involved in reliability analysis, applied probability and statistics, reliability engineering and maintenance, logistics, and quality control. It is also a useful resource for graduate students specialising in reliability analysis and applied probability and statistics. Dedicated to the Centennial of the birth of Boris Gnedenko, renowned Russian mathematician and reliability theorist
Handbook Of Performability Engineering
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Author : Krishna B. Misra
language : en
Publisher: Springer Science & Business Media
Release Date : 2008-08-24
Handbook Of Performability Engineering written by Krishna B. Misra and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-08-24 with Technology & Engineering categories.
Dependability and cost effectiveness are primarily seen as instruments for conducting international trade in the free market environment. These factors cannot be considered in isolation of each other. This handbook considers all aspects of performability engineering. The book provides a holistic view of the entire life cycle of activities of the product, along with the associated cost of environmental preservation at each stage, while maximizing the performance.
Reliability Engineering
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Author : Kailash C. Kapur
language : en
Publisher: John Wiley & Sons
Release Date : 2014-03-21
Reliability Engineering written by Kailash C. Kapur and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-03-21 with Technology & Engineering categories.
An Integrated Approach to Product Development Reliability Engineering presents an integrated approach to the design, engineering, and management of reliability activities throughout the life cycle of a product, including concept, research and development, design, manufacturing, assembly, sales, and service. Containing illustrative guides that include worked problems, numerical examples, homework problems, a solutions manual, and class-tested materials, it demonstrates to product development and manufacturing professionals how to distribute key reliability practices throughout an organization. The authors explain how to integrate reliability methods and techniques in the Six Sigma process and Design for Six Sigma (DFSS). They also discuss relationships between warranty and reliability, as well as legal and liability issues. Other topics covered include: Reliability engineering in the 21st Century Probability life distributions for reliability analysis Process control and process capability Failure modes, mechanisms, and effects analysis Health monitoring and prognostics Reliability tests and reliability estimation Reliability Engineering provides a comprehensive list of references on the topics covered in each chapter. It is an invaluable resource for those interested in gaining fundamental knowledge of the practical aspects of reliability in design, manufacturing, and testing. In addition, it is useful for implementation and management of reliability programs.
Realizing Complex Integrated Systems
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Author : Anthony P. Ambler
language : en
Publisher: CRC Press
Release Date : 2025-02-20
Realizing Complex Integrated Systems written by Anthony P. Ambler and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2025-02-20 with Technology & Engineering categories.
The creation of complex integrated systems is, in itself, complex. It requires immense planning and a large team of people with diverse backgrounds based in dispersed geographical locations (and countries) supposedly working to a coordinated schedule and cost. The systems engineering task is not new, but recent scales most definitely are. The world is now capable of designing and manufacturing systems whose complexity was not considered possible 10 years ago. While many are trained to think in terms of a complete system, where ‘everything’ is designed and produced by a single project team, today such systems involve integrating subsystems and components (which are also complex) that have been developed by other project teams. Inevitably, this introduces additional complexities, involving elements out of the direct control of the project, but which are essential to its overall success. In addition to traditional systems engineering topics of hardware and software design, testability, and manufacturability, there are wider issues to be contemplated: project planning; communication language (an issue for international teams); units of measure (imperial vs. metric) used across members of the team; supply chains (pandemics, military action, and natural disasters); legal issues based on place of production and sale; the ethics associated with target use; and the threat of cyberattack. This book is the first attempt to bring many of these issues together to highlight the complexities that need to be considered in modern system design. It is neither exhaustive nor comprehensive, but it gives pointers to the topics for the reader to follow up on in more detail.
The Rf And Microwave Handbook 3 Volume Set
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Author : Mike Golio
language : en
Publisher: CRC Press
Release Date : 2018-10-08
The Rf And Microwave Handbook 3 Volume Set written by Mike Golio and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-08 with Technology & Engineering categories.
By 1990 the wireless revolution had begun. In late 2000, Mike Golio gave the world a significant tool to use in this revolution: The RF and Microwave Handbook. Since then, wireless technology spread across the globe with unprecedented speed, fueled by 3G and 4G mobile technology and the proliferation of wireless LANs. Updated to reflect this tremendous growth, the second edition of this widely embraced, bestselling handbook divides its coverage conveniently into a set of three books, each focused on a particular aspect of the technology. Six new chapters cover WiMAX, broadband cable, bit error ratio (BER) testing, high-power PAs (power amplifiers), heterojunction bipolar transistors (HBTs), as well as an overview of microwave engineering. Over 100 contributors, with diverse backgrounds in academic, industrial, government, manufacturing, design, and research reflect the breadth and depth of the field. This eclectic mix of contributors ensures that the coverage balances fundamental technical issues with the important business and marketing constraints that define commercial RF and microwave engineering. Focused chapters filled with formulas, charts, graphs, diagrams, and tables make the information easy to locate and apply to practical cases. The new format, three tightly focused volumes, provides not only increased information but also ease of use. You can find the information you need quickly, without wading through material you don’t immediately need, giving you access to the caliber of data you have come to expect in a much more user-friendly format.