Instability In Flow Boiling In Microchannels
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Instability In Flow Boiling In Microchannels
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Author : Sujoy Kumar Saha
language : en
Publisher: Springer
Release Date : 2015-09-14
Instability In Flow Boiling In Microchannels written by Sujoy Kumar Saha and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-09-14 with Science categories.
This Brief addresses the phenomena of instability in flow boiling in microchannels occurring in high heat flux electronic cooling. A companion edition in the SpringerBrief Subseries on Thermal Engineering and Applied Science to “Critical Heat Flux in Flow Boiling in Microchannels,” and "Heat Transfer and Pressure Drop in Flow Boiling in Microchannels,"by the same author team, this volume is idea for professionals, researchers, and graduate students concerned with electronic cooling.
Heat Transfer And Fluid Flow In Minichannels And Microchannels
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Author : Satish Kandlikar
language : en
Publisher: Elsevier
Release Date : 2006
Heat Transfer And Fluid Flow In Minichannels And Microchannels written by Satish Kandlikar and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006 with Science categories.
&Quot;This book explores flow through passages with hydraulic diameters from about 1 [mu]m to 3 mm, covering the range of minichannels and microchannels. Design equations along with solved examples and practice problems are also included to serve the needs of practicing engineers and students in a graduate course."--BOOK JACKET.
Flow Boiling In Microgap Channels
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Author : Tamanna Alam
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-08-26
Flow Boiling In Microgap Channels written by Tamanna Alam and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-08-26 with Science categories.
Flow Boiling in Microgap Channels: Experiment, Visualization and Analysis presents an up-to-date summary of the details of the confined to unconfined flow boiling transition criteria, flow boiling heat transfer and pressure drop characteristics, instability characteristics, two phase flow pattern and flow regime map and the parametric study of microgap dimension. Advantages of flow boiling in microgaps over microchannels are also highlighted. The objective of this Brief is to obtain a better fundamental understanding of the flow boiling processes, compare the performance between microgap and conventional microchannel heat sinks, and evaluate the microgap heat sink for instabilities and hotspot mitigation.
Heat Transfer And Pressure Drop In Flow Boiling In Microchannels
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Author : Sujoy Kumar Saha
language : en
Publisher: Springer
Release Date : 2015-07-08
Heat Transfer And Pressure Drop In Flow Boiling In Microchannels written by Sujoy Kumar Saha and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-07-08 with Science categories.
This Brief addresses the phenomena of heat transfer and pressure drop in flow boiling in micro channels occurring in high heat flux electronic cooling. A companion edition in the Springer Brief Subseries on Thermal Engineering and Applied Science to “Critical Heat Flux in Flow Boiling in Micro channels,” by the same author team, this volume is idea for professionals, researchers and graduate students concerned with electronic cooling.
Critical Heat Flux In Flow Boiling In Microchannels
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Author : Sujoy Kumar Saha
language : en
Publisher: Springer
Release Date : 2015-06-04
Critical Heat Flux In Flow Boiling In Microchannels written by Sujoy Kumar Saha and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-06-04 with Science categories.
This Brief concerns the important problem of critical heat flux in flow boiling in microchannels. A companion edition in the SpringerBrief Subseries on Thermal Engineering and Applied Science to “Heat Transfer and Pressure Drop in Flow Boiling in Microchannels,” by the same author team, this volume is idea for professionals, researchers, and graduate students concerned with electronic cooling.
Enhanced Boiling Heat Transfer
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Author : John R. Thome
language : en
Publisher: CRC Press
Release Date : 1990-01-01
Enhanced Boiling Heat Transfer written by John R. Thome and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 1990-01-01 with Technology & Engineering categories.
This is a comprehensive survey of boiling heat transfer augmentation, one of the most dynamic areas in the field. The text covers fundamental aspects of boiling augmentation and provides an in-depth treatment of enhanced boiling surface applications in industry.
Microchannel Phase Change Transport Phenomena
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Author : Sujoy Kumar Saha
language : en
Publisher: Butterworth-Heinemann
Release Date : 2015-09-27
Microchannel Phase Change Transport Phenomena written by Sujoy Kumar Saha and has been published by Butterworth-Heinemann this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-09-27 with Science categories.
Microchannel Heat transfer is the cooling application of high power density microchips in the CPU system, micropower systems and many other large scale thermal systems requiring effective cooling capacity. This book offers the latest research and recommended models on the microsize cooling system which not only significantly reduces the weight load, but also enhances the capability to remove much greater amount of heat than any of large scale cooling systems. A detailed reference in microchannel phase change (boiling and condensation) including recommended models and correlations for various requirements such as pressure loss, and heat transfer coefficient. Researchers, engineers, designers and students will benefit from the collated, state-of-the-art of the research put together in this book and its systematic, addressing all the relevant issues and providing a good reference for solving problems of critical analysis. - Up-to-date information will help delineate further research direction in the microchannel heat transfer - The latest modeling information and recommendations will help in design method and purpose
Convective Boiling And Condensation
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Author : John G. Collier
language : en
Publisher: Clarendon Press
Release Date : 1994-05-19
Convective Boiling And Condensation written by John G. Collier and has been published by Clarendon Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994-05-19 with categories.
* Third edition of a well-known and well established text both in industry and for teaching * Fully up-to-date and includes extra problems This book is an aid to heat exchanger design written primarily for design and development engineers in the chemical process, power generation, and refrigeration industries. It provides a comprehensive reference on two-phase flows, boiling, and condensation. The text covers all the latest advances like flows over tube bundles and two-phase heat transfer regarding refrigerants and petrochemicals. Another feature of this third edition is many new problems at chapter ends to enhance its use as a teaching text for graduate and post-graduate courses on two-phase flow and heat transfer. - ;This book is written for practising engineers as a comprehensive reference on two-phase flows, boiling, and condensation. It deals with methods for estimating two-phase flow pressure drops and heat transfer rates. It is a well-known reference book in its third edition and is also used as a text for advanced university courses. Both authors write from practical experience as both are professional engineers. -
Flow Boiling In Expanding Microchannels
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Author : Tamanna Alam
language : en
Publisher: Springer
Release Date : 2017-05-24
Flow Boiling In Expanding Microchannels written by Tamanna Alam and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-05-24 with Science categories.
This Brief presents an up to date summary of details of the flow boiling heat transfer, pressure drop and instability characteristics; two phase flow patterns of expanding microchannels. Results obtained from the different expanding microscale geometries are presented for comparison and addition to that, comparison with literatures is also performed. Finally, parametric studies are performed and presented in the brief. The findings from this study could help in understanding the complex microscale flow boiling behavior and aid in the design and implementation of reliable compact heat sinks for practical applications.
Thermal Design Of Electronic Equipment
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Author : Ralph Remsburg
language : en
Publisher: CRC Press
Release Date : 2017-12-19
Thermal Design Of Electronic Equipment written by Ralph Remsburg and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.
In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.