Interconnect Technology And Design For Gigascale Integration
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Interconnect Technology And Design For Gigascale Integration
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Author : Jeffrey A. Davis
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Interconnect Technology And Design For Gigascale Integration written by Jeffrey A. Davis and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
Interconnect Technology and Design for Gigascale Integration is the cumulative effort from academic researchers at Georgia Tech, MIT, and Stanford, as well as from industry researchers at IBM T.J. Watson Research Center, LSI Logic, and SUN microsystems. The material found in this book is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in depth exploration into interconnect-aware computer architectures. This broad swath of topics presented by leaders in the research field is intended to provide a comprehensive perspective on interconnect technology and design issues so that the reader will understand the implications of the semiconductor industry's next substantial milestone - gigascale integration.
Integrated Interconnect Technologies For 3d Nanoelectronic Systems
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Author : Muhannad S. Bakir
language : en
Publisher: Artech House
Release Date : 2008-11-30
Integrated Interconnect Technologies For 3d Nanoelectronic Systems written by Muhannad S. Bakir and has been published by Artech House this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-11-30 with Technology & Engineering categories.
This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.
Copper Interconnect Technology
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Author : Tapan Gupta
language : en
Publisher: Springer Science & Business Media
Release Date : 2010-01-22
Copper Interconnect Technology written by Tapan Gupta and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-01-22 with Technology & Engineering categories.
Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.
Integrated Circuit And System Design Power And Timing Modeling Optimization And Simulation
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Author : Rene van Leuken
language : en
Publisher: Springer
Release Date : 2011-01-16
Integrated Circuit And System Design Power And Timing Modeling Optimization And Simulation written by Rene van Leuken and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-01-16 with Computers categories.
This book constitutes the refereed proceedings of the 20th International Conference on Integrated Circuit and System Design, PATMOS 2010, held in Grenoble, France, in September 2010. The 24 revised full papers presented and the 9 extended abstracts were carefully reviewed and are organized in topical sections on design flows; circuit techniques; low power circuits; self-timed circuits; process variation; high-level modeling of poweraware heterogeneous designs in SystemC-AMS; and minalogic.
Nano Interconnect Materials And Models For Next Generation Integrated Circuit Design
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Author : Sandip Bhattacharya
language : en
Publisher: CRC Press
Release Date : 2023-12-22
Nano Interconnect Materials And Models For Next Generation Integrated Circuit Design written by Sandip Bhattacharya and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-12-22 with Technology & Engineering categories.
Aggressive scaling of device and interconnect dimensions has resulted in many low-dimensional issues in the nanometer regime. This book deals with various new-generation interconnect materials and interconnect modeling, and highlights the significance of novel nano-interconnect materials for 3D integrated circuit design. It provides information about advanced nanomaterials like carbon nanotube (CNT) and graphene nanoribbon (GNR) for the realization of interconnects, interconnect models, and crosstalk noise analysis. Features: • Focuses on materials and nanomaterials utilization in next-generation interconnects based on carbon nanotubes (CNT) and graphene nanoribbons (GNR). • Helps readers realize interconnects, interconnect models, and crosstalk noise analysis. • Describes hybrid CNT- and GNR-based interconnects. • Presents the details of power supply voltage drop analysis in CNT and GNR interconnects. • Overviews pertinent RF performance and stability analysis. This book is aimed at graduate students and researchers in electrical and materials engineering, and nano-/microelectronics.
Transactions On High Performance Embedded Architectures And Compilers Iv
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Author : Per Stenström
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-11-22
Transactions On High Performance Embedded Architectures And Compilers Iv written by Per Stenström and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-11-22 with Computers categories.
Transactions on HiPEAC aims at the timely dissemination of research contributions in computer architecture and compilation methods for high-performance embedded computer systems. Recognizing the convergence of embedded and general-purpose computer systems, this journal publishes original research on systems targeted at specific computing tasks as well as systems with broad application bases. The scope of the journal therefore covers all aspects of computer architecture, code generation and compiler optimization methods of interest to researchers and practitioners designing future embedded systems. This 4th issue contains 21 papers carefully reviewed and selected out of numerous submissions and is divided in four sections. The first section contains five regular papers. The second section consists of the top four papers from the 4th International Conference on High-Performance Embedded Architectures and Compilers, HiPEAC 2009, held in Paphos, Cyprus, in January 2009. The third section contains a set of six papers providing a snap-shot from the Workshop on Software and Hardware Challenges of Manycore Platforms, SHCMP 2008 held in Beijing, China, in June 2008. The fourth section consists of six papers from the 8th IEEE International Symposium on Systems, Architectures, Modeling and Simulation, SAMOS VIII (2008) held in Samos, Greece, in July 2008.
Vlsi Soc Design Methodologies For Soc And Sip
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Author : Christian Piguet
language : en
Publisher: Springer Science & Business Media
Release Date : 2010-04-06
Vlsi Soc Design Methodologies For Soc And Sip written by Christian Piguet and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-04-06 with Computers categories.
This book contains extended and revised versions of the best papers that were p- sented during the 16th edition of the IFIP/IEEE WG10.5 International Conference on Very Large Scale Integration, a global System-on-a-Chip Design & CAD conference. The 16th conference was held at the Grand Hotel of Rhodes Island, Greece (October 13–15, 2008). Previous conferences have taken place in Edinburgh, Trondheim, V- couver, Munich, Grenoble, Tokyo, Gramado, Lisbon, Montpellier, Darmstadt, Perth, Nice and Atlanta. VLSI-SoC 2008 was the 16th in a series of international conferences sponsored by IFIP TC 10 Working Group 10.5 and IEEE CEDA that explores the state of the art and the new developments in the field of VLSI systems and their designs. The purpose of the conference was to provide a forum to exchange ideas and to present industrial and research results in the fields of VLSI/ULSI systems, embedded systems and - croelectronic design and test.
Silicon Photonics
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Author : Lorenzo Pavesi
language : en
Publisher: Springer Science & Business Media
Release Date : 2004-03-04
Silicon Photonics written by Lorenzo Pavesi and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-03-04 with Science categories.
This book gives a fascinating picture of the state-of-the-art in silicon photonics and a perspective on what can be expected in the near future. It is composed of a selected number of reviews authored by world leaders in the field and is written from both academic and industrial viewpoints. An in-depth discussion of the route towards fully integrated silicon photonics is presented. This book will be useful not only to physicists, chemists, materials scientists, and engineers but also to graduate students who are interested in the fields of microphotonics and optoelectronics.
Advanced Nanoscale Ulsi Interconnects Fundamentals And Applications
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Author : Yosi Shacham-Diamand
language : en
Publisher: Springer Science & Business Media
Release Date : 2009-09-19
Advanced Nanoscale Ulsi Interconnects Fundamentals And Applications written by Yosi Shacham-Diamand and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-09-19 with Science categories.
In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.
Nanoelectronic Circuit Design
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Author : Niraj K. Jha
language : en
Publisher: Springer Science & Business Media
Release Date : 2010-12-21
Nanoelectronic Circuit Design written by Niraj K. Jha and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-12-21 with Technology & Engineering categories.
This book is about large-scale electronic circuits design driven by nanotechnology, where nanotechnology is broadly defined as building circuits using nanoscale devices that are either implemented with nanomaterials (e.g., nanotubes or nanowires) or following an unconventional method (e.g., FinFET or III/V compound-based devices). These nanoscale devices have significant potential to revolutionize the fabrication and integration of electronic systems and scale beyond the perceived scaling limitations of traditional CMOS. While innovations in nanotechnology originate at the individual device level, realizing the true impact of electronic systems demands that these device-level capabilities be translated into system-level benefits. This is the first book to focus on nanoscale circuits and their design issues, bridging the existing gap between nanodevice research and nanosystem design.