Interconnection Technology
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Handbook Of Semiconductor Interconnection Technology
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Author : Geraldine Cogin Shwartz
language : en
Publisher: CRC Press
Release Date : 2006-02-22
Handbook Of Semiconductor Interconnection Technology written by Geraldine Cogin Shwartz and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-02-22 with Technology & Engineering categories.
First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and many of the "likely directions" outlined in the first ed
Handbook Of Semiconductor Interconnection Technology Second Edition
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Author : Geraldine C. Schwartz
language : en
Publisher: CRC Press
Release Date : 2006-02-22
Handbook Of Semiconductor Interconnection Technology Second Edition written by Geraldine C. Schwartz and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-02-22 with Technology & Engineering categories.
First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and many of the "likely directions" outlined in the first edition are now standard in modern facilities. Reflecting those advances, this edition delves into the practical aspects of interconnections for manufacturing. It examines the interconnect and fabrication technologies now available, with an examination of future prospects for the field. What's in this Edition: Detailed discussion of electrochemical equipment for plating copper Information on tools used for evaporation, chemical vapor deposition, and plasma processes Emphasis on measurement of mechanical and thermal properties of insulators Methods for characterizing porous dielectric thin films Greater focus on integration issues and properties of titanium, cobalt, and nickel silicides Process schemes based on the increased need for borderless contact gates and source/drain Expanded discussion on choices for low-dielectric insulators Concentration on electroplated copper, especially morphology of plated films and their properties Developments in thin film liners and barriers Expanded material on copper reliability
High Reliability Interconnection Technology
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Author : Pace Incorporated
language : en
Publisher:
Release Date : 2004
High Reliability Interconnection Technology written by Pace Incorporated and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with Electronic apparatus and appliances categories.
Advanced Wirebond Interconnection Technology
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Author : Shankara K. Prasad
language : en
Publisher: Springer Science & Business Media
Release Date : 2006-05-10
Advanced Wirebond Interconnection Technology written by Shankara K. Prasad and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-05-10 with Technology & Engineering categories.
From the reviews: "This book is intended for an assembly production house setting, appropriate for management, designers, chief operators, as well as wirebond production engineers. Operational issues such as specifying and optimizing wire and automatic bonders for a product line are included. The book is very good with "visual" explanations for quick grasping of the issues. In addition, the fundamental metallurgical or mechanical root causes behind material and process choices are presented. The book has a clear prose style and a very readable font and page layout. The figures, although effective, are simply low resolution screen prints from a personal computer and thus have aliasing and fuzziness. This book has excellent overall tutorial and enough description of wire and bonding equipment so the reader could specify and negotiate correctly for with suppliers. The majority of the book dwells on establishing the bonding process for a particular product; determining the "window" of adjustments. The book ends with discussions on establishing quality metrics and reliability assurance tests. Each chapter of the book includes enough tutorial information to allow it to alone with little need to page backwards. A short but good reference section is at the end. If you have not read a wirebonding book, or the one you read 10 years ago was borrowed and never returned, now is the time to buy this book." ( CMPT Newsletter, June 2005)
Interconnection Technology
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Author :
language : en
Publisher:
Release Date : 1987
Interconnection Technology written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1987 with categories.
On Chip Interconnection Technology
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Author :
language : en
Publisher:
Release Date : 1995
On Chip Interconnection Technology written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995 with categories.
Linkages
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Author : National Research Council
language : en
Publisher: National Academies Press
Release Date : 2006-01-19
Linkages written by National Research Council and has been published by National Academies Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-01-19 with Technology & Engineering categories.
Over the past two decades, the Department of Defense has been moving toward commercial-military integration for manufacturing, while at the same time, the printed circuit board industry has been moving steadily offshore. Today, many in DoD, the U.S. Congress, and the federal government lack a clear understanding of the importance of high-quality, trustworthy printed circuit boards (PrCBs) for properly functioning weapons and other defense systems and components. To help develop this understanding, DOD requested the NRC to identify and assess the key issues affecting PrCBs for military use. This report presents a discussion of how to ensure DOD's access to reliable printed circuits; an assessment of its vulnerability to the global printed circuit supply chain; and suggestions about ways to secure the design and manufacture of printed circuits. In addition, this report offers recommendations to help DoD (1) preserve existing systems' capabilities, (2) improve the military's access to currently available PrCBs, and (3) ensure access to future PrCB technology. The recommendations reflect the need to achieve these goals at reasonable cost and in concert with evolving environmental regulations.
Handbook Of Semiconductor Interconnection Technology
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Author : G. C. Schwartz
language : en
Publisher: CRC Press
Release Date : 1997-11-24
Handbook Of Semiconductor Interconnection Technology written by G. C. Schwartz and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997-11-24 with Technology & Engineering categories.
Covering materials, processes, equipment, methodologies, characterization techniques, clean room practices, and ways to control contamination-related defects, this work offers up-to-date information on the application of interconnection technology to semiconductors. It offers an integration of technical, patent and industry literature.
Interconnection Technology Iee Colloquium On
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Author : Institute of Electrical and Electronics Engineers
language : en
Publisher:
Release Date : 1994
Interconnection Technology Iee Colloquium On written by Institute of Electrical and Electronics Engineers and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with categories.
Advances In Interconnection Technology
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Author :
language : en
Publisher:
Release Date : 2000
Advances In Interconnection Technology written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Microelectronics categories.