International Symposium On Advances In Interconnection And Packaging
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International Symposium On Advances In Interconnection And Packaging
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Author :
language : en
Publisher:
Release Date : 1991
International Symposium On Advances In Interconnection And Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1991 with Microelectronic packaging categories.
International Symposium On Advances In Interconnection And Packaging
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Author : James Pazaris
language : en
Publisher:
Release Date : 1991
International Symposium On Advances In Interconnection And Packaging written by James Pazaris and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1991 with Technology & Engineering categories.
International Symposium On Advances In Interconnection And Packaging
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Author :
language : en
Publisher:
Release Date : 1991
International Symposium On Advances In Interconnection And Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1991 with categories.
International Symposium On Advanced Packaging Materials
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Author :
language : en
Publisher:
Release Date : 2005
International Symposium On Advanced Packaging Materials written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with Electronic packaging categories.
Proceedings 3rd International Symposium On Advanced Packaging Materials
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Author :
language : en
Publisher:
Release Date : 1997
Proceedings 3rd International Symposium On Advanced Packaging Materials written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Electronic packaging categories.
Direct Copper Interconnection For Advanced Semiconductor Technology
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Author : Dongkai Shangguan
language : en
Publisher: CRC Press
Release Date : 2024-06-28
Direct Copper Interconnection For Advanced Semiconductor Technology written by Dongkai Shangguan and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-06-28 with Technology & Engineering categories.
In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.
Nanopackaging
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Author : James E. Morris
language : en
Publisher: Springer Science & Business Media
Release Date : 2008-12-30
Nanopackaging written by James E. Morris and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-12-30 with Technology & Engineering categories.
Nanotechnologies are being applied to microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior mechanical, electrical, or thermal properties of carbon nanotubes. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancement. “Nanopackaging” is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of their field, and others with interests in nanotechnology. It will survey the application of nanotechnologies to electronics packaging, as represented by current research across the field.
The Cumulative Book Index
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Author :
language : en
Publisher:
Release Date : 1992
The Cumulative Book Index written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1992 with American literature categories.
A world list of books in the English language.
Semiconductor Advanced Packaging
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Author : John H. Lau
language : en
Publisher: Springer Nature
Release Date : 2021-05-17
Semiconductor Advanced Packaging written by John H. Lau and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-05-17 with Technology & Engineering categories.
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Electronic Packaging And Interconnection Handbook
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Author : Charles A. Harper
language : en
Publisher: McGraw-Hill Professional Publishing
Release Date : 2000
Electronic Packaging And Interconnection Handbook written by Charles A. Harper and has been published by McGraw-Hill Professional Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Technology & Engineering categories.
Covering every aspect of electronic packaging from development and design to manufacturing, facilities, and testing, Electronic Packaging and Interconnection Handbook, Third Edition, continues to be the standard reference in its field. Here, in this single information-packed resource are all the data and guidelines you need for all types and levels of electronic packages, interconnection technologies, and electronic systems. No other book treats all of the subjects covered in this handbook in such an integrated and inter-related manner, a treatment designed to help you achieve a more reliable, more manufacturable, and more cost-effective electronic package. Here's everything you need to know about materials, thermal management, mechanical and thermomechanical stress behavior, wiring and cabling, soldering and solder technology, integrated circuit packaging, surface mount technologies, rigid and flexible printed wiring boards. And with over 60% new material, this third edition brings you thoroughly up to speed on a new generation of packaging technologies: single chip packaging...ball gridarrays...chip scale packaging...low-cost flip chiptechnologies...direct chip attach, and more.