International Symposium On Advances In Interconnection And Packaging Book 1 Microelectronic Interconnects And Packages
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Integrated Circuit Packaging Assembly And Interconnections
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Author : William Greig
language : en
Publisher: Springer
Release Date : 2010-10-29
Integrated Circuit Packaging Assembly And Interconnections written by William Greig and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-10-29 with Technology & Engineering categories.
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.
International Symposium On Advances In Interconnection And Packaging
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Author : International Symposium on Advances in Interconnection and Packaging
language : en
Publisher:
Release Date : 1991
International Symposium On Advances In Interconnection And Packaging written by International Symposium on Advances in Interconnection and Packaging and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1991 with categories.
Proceedings Of The International Symposium On Microelectronics
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Author :
language : en
Publisher:
Release Date : 1996
Proceedings Of The International Symposium On Microelectronics written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with Hybrid integrated circuits categories.
Ceramic Interconnect Technology Handbook
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Author : Fred D. Barlow, III
language : en
Publisher: CRC Press
Release Date : 2018-10-03
Ceramic Interconnect Technology Handbook written by Fred D. Barlow, III and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-03 with Technology & Engineering categories.
Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
American Book Publishing Record
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Author :
language : en
Publisher:
Release Date : 2004
American Book Publishing Record written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with American literature categories.
Applied Computing
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Author :
language : en
Publisher:
Release Date : 1993
Applied Computing written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993 with Application software categories.
Index Of Conference Proceedings
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Author : British Library. Document Supply Centre
language : en
Publisher:
Release Date : 1990-07
Index Of Conference Proceedings written by British Library. Document Supply Centre and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1990-07 with Conference proceedings categories.
The Cumulative Book Index
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Author :
language : en
Publisher:
Release Date : 1992
The Cumulative Book Index written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1992 with American literature categories.
A world list of books in the English language.
Electrical Conductive Adhesives With Nanotechnologies
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Author : Yi (Grace) Li
language : en
Publisher: Springer Science & Business Media
Release Date : 2009-10-08
Electrical Conductive Adhesives With Nanotechnologies written by Yi (Grace) Li and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-10-08 with Technology & Engineering categories.
“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.
Proceedings Of The 1989 International Symposium On Microelectronics October 24 26 1989 Baltimore Convention Center
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Author : International Society for Hybrid Microelectronics
language : en
Publisher:
Release Date : 1989
Proceedings Of The 1989 International Symposium On Microelectronics October 24 26 1989 Baltimore Convention Center written by International Society for Hybrid Microelectronics and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989 with Hybrid integrated circuits categories.