Investigation Of Ultra Thin Folded Flex Assembly For Highly Miniaturised System In A Package Technology Platforms
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Ambient Intelligence With Microsystems
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Author : Kieran Delaney
language : en
Publisher: Springer Science & Business Media
Release Date : 2008-10-17
Ambient Intelligence With Microsystems written by Kieran Delaney and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-10-17 with Computers categories.
Augmented Materials and Smart Objects investigates the issues required to ensure technology platforms capable of being seamlessly integrated into everyday objects, particularly the requirements for integrated computation and MEMs sensors, System-in-a-package solutions, multi-chip modules, the impact of the trend towards embedded microelectronic electronics sub-systems, novel assembly techniques for autonomous MEMs sensors, as well as practical performance issues that are key to the AmI concept. Also discussed are current requirements for realizing applications-oriented examples of smart objects (e.g. smart textiles, gadgets, integration of smart systems for utility and environmental monitoring, etc); these are based upon heterogeneous systems linking networks of sensors attached to (or physically embedded in) objects with information management systems enabling collections of smart objects to collaborate to provide proactive services to the user. Finally, Augmented Materials and Smart Objects describes and discusses a number of vision statements strongly relevant to the future development of distributed embedded sensor and actuator platforms for smart objects, and ultimately Ambient Intelligence. The framework for this is the concept of Augmented Materials; these are materials with fully embedded distributed information systems, designed to measure all relevant physical properties and provide a full knowledge representation of the material; in effect, the material would "know" itself, and its current status.
Investigation Of Ultra Thin Folded Flex Assembly For Highly Miniaturised System In A Package Technology Platforms
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Author : Bivragh Majeed
language : en
Publisher:
Release Date : 2008
Investigation Of Ultra Thin Folded Flex Assembly For Highly Miniaturised System In A Package Technology Platforms written by Bivragh Majeed and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008 with Computer systems categories.
This thesis addresses some of the challenges faced in the implementation of the physical layer of Ambient Electronic Systems (AES). AES will help in realising the information technology dream in which our surroundings will be populated by intelligent micro-nano interactive modules. System-in-a-Package is one of the enabling technologies that can be utilised to realise a physical layer of AES. One of the key challenges of the SiP approach is miniaturisation of different components. The underlying objective of the current work is to investigate the fundamental material and fabrication issues arising from the miniaturisation of different components in a folded flex assembly. Folded flex technology is used to develop a technology platform that can be adapted for future AES. This platform is developed as an investigative tool for performance evaluation of different materials and processes including flexible substrate, silicon die, interconnection mechanism and folded flex assembly. The evaluation yielded distinct results in terms of achieving an effective approach for fabricating thin flexible substrate. A critical thickness was evaluated below which wrinkling would be an issue and thickness reduction advantages are negated by increased handling problems. Silicon die characterisation revealed that the thinning process had little impact on the electrical properties; however, mechanical properties were influenced by the singulation process. A novel analytical model was developed to determine the stress in thinned die, demonstrating that the thinning process induced very little stress. A characterised and reliable flip chip interconnect assembly sequence that provides thin, less than 20 microns, interconnect stand-off heights for different silicon die thicknesses was developed. This was achieved by modifying the shape of the gold stud bump and having a direct contact between the gold stud bump and the copper pad. An electrically functioning and reliable 3-D folded flex module was fabricated, highlighting the assembly challenges, thermo-mechanical stresses and thermal performance of the module.
Handbook Of Flexible And Stretchable Electronics
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Author : Muhammad M. Hussain
language : en
Publisher: CRC Press
Release Date : 2019-11-11
Handbook Of Flexible And Stretchable Electronics written by Muhammad M. Hussain and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-11-11 with Technology & Engineering categories.
Flexibility and stretchability of electronics are crucial for next generation electronic devices that involve skin contact sensing and therapeutic actuation. This handbook provides a complete entrée to the field, from solid-state physics to materials chemistry, processing, devices, performance, and reliability testing, and integrated systems development. This work shows how microelectronics, signal processing, and wireless communications in the same circuitry are impacting electronics, healthcare, and energy applications. Key Features: • Covers the fundamentals to device applications, including solid-state and mechanics, chemistry, materials science, characterization techniques, and fabrication; • Offers a comprehensive base of knowledge for moving forward in this field, from foundational research to technology development; • Focuses on processing, characterization, and circuits and systems integration for device applications; • Addresses the basic physical properties and mechanics, as well as the nuts and bolts of reliability and performance analysis; • Discusses various technology applications, from printed electronics to logic and memory devices, sensors, actuators, displays, and energy storage and harvesting. This handbook will serve as the one-stop knowledge base for readership who are interested in flexible and stretchable electronics.
Technology For Large Space Systems
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Author :
language : en
Publisher:
Release Date : 1990
Technology For Large Space Systems written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1990 with Large space structures (Astronautics) categories.
Popular Science
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Author :
language : en
Publisher:
Release Date : 2002-12
Popular Science written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002-12 with categories.
Popular Science gives our readers the information and tools to improve their technology and their world. The core belief that Popular Science and our readers share: The future is going to be better, and science and technology are the driving forces that will help make it better.
Technology For Large Space Systems A Bibliography With Indexes Supplement 22
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Author :
language : en
Publisher:
Release Date : 1990
Technology For Large Space Systems A Bibliography With Indexes Supplement 22 written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1990 with Large space structures (Astronautics) categories.
Popular Science
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Author :
language : en
Publisher:
Release Date : 2007-05
Popular Science written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-05 with categories.
Popular Science gives our readers the information and tools to improve their technology and their world. The core belief that Popular Science and our readers share: The future is going to be better, and science and technology are the driving forces that will help make it better.
Nasa Sp
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Author :
language : en
Publisher:
Release Date : 1983
Nasa Sp written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1983 with Aeronautics categories.
Popular Mechanics
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Author :
language : en
Publisher:
Release Date : 1964-04
Popular Mechanics written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1964-04 with categories.
Popular Mechanics inspires, instructs and influences readers to help them master the modern world. Whether it’s practical DIY home-improvement tips, gadgets and digital technology, information on the newest cars or the latest breakthroughs in science -- PM is the ultimate guide to our high-tech lifestyle.
Jane S Space Directory
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Author : Jane's Information Group
language : en
Publisher: Ihs Global Incorporated
Release Date : 2003-03
Jane S Space Directory written by Jane's Information Group and has been published by Ihs Global Incorporated this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003-03 with Reference categories.
Developments in the worldwide space business. There is information on past, current and future space programmes and the capabilities of space centres, details of launchers, satellites and support systems, as well as information on the commercial contractors. Also features chronological lists of manned flights as far back as Gargarin.