Investigations On Microstructure And Mechanical Properties Of The Cu Pb Free Solder Joint Interfaces
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Investigations On Microstructure And Mechanical Properties Of The Cu Pb Free Solder Joint Interfaces
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Author : Qingke Zhang
language : en
Publisher: Springer
Release Date : 2015-10-31
Investigations On Microstructure And Mechanical Properties Of The Cu Pb Free Solder Joint Interfaces written by Qingke Zhang and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-10-31 with Science categories.
This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints.
Effect Of Interface Microstructure On The Mechanical Properties Of Pb Free Hybrid Microcircuit Solder Joints
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Author :
language : en
Publisher:
Release Date : 1998
Effect Of Interface Microstructure On The Mechanical Properties Of Pb Free Hybrid Microcircuit Solder Joints written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with categories.
Although Sn-Pb eutectic alloy is widely used as a joining material in the electronics industry, it has well documented environmental and toxicity issues. Sandia National Laboratories is developing alternative solder materials to replace traditional Pb-containing alloys. The alloys are based on the Sn-Ag, Sn-Ag-Bi and Sn-Ag-Bi-Au systems. Prototype hybrid microcircuit (HMC) test vehicles have been developed to evaluate these Pb-free solders, using Au-Pt-Pd thick film metallization. Populated test vehicles with surface mount devices have been designed and fabricated to evaluate the reliability of surface mount solder joints. The test components consist of a variety of dummy chip capacitors and leadless ceramic chip carriers (LCCC's). Intermetallic compound (IMC) layer reaction products that form at the solder/substrate interface have been characterized and their respective growth kinetics quantified. Thicker IMC layers pose a potential reliability problem with solder joint integrity. Since the IMC layer is brittle, the likelihood of mechanical failure of a joint in service is increased. The effect of microstructure and the response of these different materials to wetting, aging and mechanical testing was also investigated. Solid-state reaction data for intermetallic formation and mechanical properties of the solder joints are reported.
Materials Design And Manufacturing For Sustainable Environment
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Author : Elango Natarajan
language : en
Publisher: Springer Nature
Release Date : 2022-09-28
Materials Design And Manufacturing For Sustainable Environment written by Elango Natarajan and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-09-28 with Technology & Engineering categories.
The book presents select proceedings of the International Conference on Materials, Design and Manufacturing (ICMDMSE 2022). The book covers recent trends in design and manufacturing practices relating to sustainability. Various topics covered in this book include materials design for sustainability, material characterization, tribology, finite element methods (FEM), computational fluid dynamics in designing materials, manufacturing techniques inclined to sustainability, additive manufacturing, energy, Industry 4.0, MEMS, green manufacturing, and optimization techniques. This book will be useful for researchers and professionals working in various fields of mechanical engineering.
Fundamentals Of Lead Free Solder Interconnect Technology
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Author : Tae-Kyu Lee
language : en
Publisher: Springer
Release Date : 2014-11-05
Fundamentals Of Lead Free Solder Interconnect Technology written by Tae-Kyu Lee and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-11-05 with Technology & Engineering categories.
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
Recent Progress In Lead Free Solder Technology
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Author : Mohd Arif Anuar Mohd Salleh
language : en
Publisher: Springer Nature
Release Date : 2022-03-01
Recent Progress In Lead Free Solder Technology written by Mohd Arif Anuar Mohd Salleh and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-03-01 with Technology & Engineering categories.
This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.
Lead Free Solders
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Author : Abhijit Kar
language : en
Publisher:
Release Date : 2019
Lead Free Solders written by Abhijit Kar and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019 with categories.
This book provides some of the most advanced research observations and in-depth knowledge behind lead-free soldering. Readers will find a description of different cutting-edge techniques used for improving the reliability of interconnects manufacturing. Some of the most unconventional topics covered in this book include solder joint formation for microelectronic devices at room temperature and the possibility of soldering ceramic materials, which is limited due to the poor wettability of ceramic substrates with commercial solders following classical soldering techniques. We also discuss the possibilities of nanoscale preparation of solder joints for bringing down the processing temperature so that it does not affect the packaging technologies. Readers will find that precise, systematic discussion of solder joint formation and its interfacial characterization has been depicted for each technique used in different chapters. This book is of interest to both fundamental researchers and also to practicing scientists and will prove invaluable to all those working in industry and academia.
Solder Materials
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Author : Lin Kwang-lung
language : en
Publisher: World Scientific
Release Date : 2001-06-21
Solder Materials written by Lin Kwang-lung and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001-06-21 with Technology & Engineering categories.
This book provides a comprehensive overview of important aspects of solder materials including solderability and soldering reaction, physical metallurgy, mechanical properties, electromigration, and reliability of solder joint. The scope of this book covers mainly, but not limited to, the important research achievements of all the subjects having been disclosed and discussed in the literatures. It is a very informative book for those who are interested in learning the material properties of solders, carrying out fundamental research, and in carrying out practical applications. This book is an important resource for the various important subjects relating to solder materials.
Energy Research Abstracts
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Author :
language : en
Publisher:
Release Date : 1989
Energy Research Abstracts written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989 with Power resources categories.
A Guide To Lead Free Solders
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Author : John W. Evans
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-01-05
A Guide To Lead Free Solders written by John W. Evans and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-01-05 with Technology & Engineering categories.
The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. Europe and Asia are moving towards legislation to ban the use of lead in solders and public demand in the US will likely have the same result. Producers of solders and manufacturers who use them will have to invent and employ suitable substitutes and A Guide to Lead-free Solders will show them how to do so.
Lead Free Solders
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Author : K. Subramanian
language : en
Publisher: John Wiley & Sons
Release Date : 2012-03-06
Lead Free Solders written by K. Subramanian and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-03-06 with Technology & Engineering categories.
Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers: Phase diagrams and alloy development Effect of minor alloying additions Composite approaches including nanoscale reinforcements Mechanical issues affecting reliability Reliability under impact loading Thermomechanical fatigue Chemical issues affecting reliability Whisker growth Electromigration Thermomigration Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.