Istfa 2013
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Istfa 2013
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Author : A. S. M. International
language : en
Publisher: ASM International
Release Date : 2013-01-01
Istfa 2013 written by A. S. M. International and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-01-01 with Technology & Engineering categories.
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures.
Istfa 2013
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Author :
language : en
Publisher:
Release Date : 2013
Istfa 2013 written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013 with Electronic apparatus and appliances categories.
Istfa 2018 Proceedings From The 44th International Symposium For Testing And Failure Analysis
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Author :
language : en
Publisher: ASM International
Release Date : 2018-12-01
Istfa 2018 Proceedings From The 44th International Symposium For Testing And Failure Analysis written by and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-12-01 with categories.
The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
Istfa 2019 Proceedings Of The 45th International Symposium For Testing And Failure Analysis
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Author :
language : en
Publisher: ASM International
Release Date : 2019-12-01
Istfa 2019 Proceedings Of The 45th International Symposium For Testing And Failure Analysis written by and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-12-01 with Technology & Engineering categories.
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Istfa 2014
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Author : A. S. M. International
language : en
Publisher: ASM International
Release Date : 2014-11-01
Istfa 2014 written by A. S. M. International and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-11-01 with Technology & Engineering categories.
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Exploring the Many Facets of Failure Analysis.
Microelectronics Fialure Analysis Desk Reference Seventh Edition
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Author : Tejinder Gandhi
language : en
Publisher: ASM International
Release Date : 2019-11-01
Microelectronics Fialure Analysis Desk Reference Seventh Edition written by Tejinder Gandhi and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-11-01 with Technology & Engineering categories.
The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
Istfa 2017 Proceedings From The 43rd International Symposium For Testing And Failure Analysis
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Author :
language : en
Publisher: ASM International
Release Date : 2017-12-01
Istfa 2017 Proceedings From The 43rd International Symposium For Testing And Failure Analysis written by and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-01 with Technology & Engineering categories.
The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
Metrology And Diagnostic Techniques For Nanoelectronics
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Author : Zhiyong Ma
language : en
Publisher: CRC Press
Release Date : 2017-03-27
Metrology And Diagnostic Techniques For Nanoelectronics written by Zhiyong Ma and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-03-27 with Science categories.
Nanoelectronics is changing the way the world communicates, and is transforming our daily lives. Continuing Moore’s law and miniaturization of low-power semiconductor chips with ever-increasing functionality have been relentlessly driving R&D of new devices, materials, and process capabilities to meet performance, power, and cost requirements. This book covers up-to-date advances in research and industry practices in nanometrology, critical for continuing technology scaling and product innovation. It holistically approaches the subject matter and addresses emerging and important topics in semiconductor R&D and manufacturing. It is a complete guide for metrology and diagnostic techniques essential for process technology, electronics packaging, and product development and debugging—a unique approach compared to other books. The authors are from academia, government labs, and industry and have vast experience and expertise in the topics presented. The book is intended for all those involved in IC manufacturing and nanoelectronics and for those studying nanoelectronics process and assembly technologies or working in device testing, characterization, and diagnostic techniques.
3d Microelectronic Packaging
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Author : Yan Li
language : en
Publisher: Springer Nature
Release Date : 2020-11-23
3d Microelectronic Packaging written by Yan Li and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-11-23 with Technology & Engineering categories.
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
Cryptographic Hardware And Embedded Systems Ches 2017
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Author : Wieland Fischer
language : en
Publisher: Springer
Release Date : 2017-09-18
Cryptographic Hardware And Embedded Systems Ches 2017 written by Wieland Fischer and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-09-18 with Computers categories.
This book constitutes the proceedings of the 19th International Conference on Cryptographic Hardware and Embedded Systems, CHES 2017, held in Taipei, Taiwan, in September 2017. The 33 full papers presented in this volume were carefully reviewed and selected from 130 submissions. The annual CHES conference highlights new results in the design and analysis of cryptographic hardware and soft- ware implementations. The workshop builds a valuable bridge between the research and cryptographic engineering communities and attracts participants from industry, academia, and government organizations.