Microelectronics Fialure Analysis Desk Reference Seventh Edition
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Microelectronics Failure Analysis
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Author : Tejinder Gandhi
language : en
Publisher:
Release Date : 2019
Microelectronics Failure Analysis written by Tejinder Gandhi and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019 with Electronic apparatus and appliances categories.
Microelectronics Fialure Analysis Desk Reference Seventh Edition
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Author : Tejinder Gandhi
language : en
Publisher: ASM International
Release Date : 2019-11-01
Microelectronics Fialure Analysis Desk Reference Seventh Edition written by Tejinder Gandhi and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-11-01 with Technology & Engineering categories.
The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
Microelectronics Failure Analysis
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Author : EDFAS Desk Reference Committee
language : en
Publisher: ASM International
Release Date : 2011
Microelectronics Failure Analysis written by EDFAS Desk Reference Committee and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011 with Technology & Engineering categories.
Includes bibliographical references and index.
Reliability Of Organic Compounds In Microelectronics And Optoelectronics
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Author : Willem Dirk van Driel
language : en
Publisher: Springer Nature
Release Date : 2022-01-31
Reliability Of Organic Compounds In Microelectronics And Optoelectronics written by Willem Dirk van Driel and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-01-31 with Technology & Engineering categories.
This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems.
Advanced Driver Assistance Systems And Autonomous Vehicles
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Author : Yan Li
language : en
Publisher: Springer Nature
Release Date : 2022-10-28
Advanced Driver Assistance Systems And Autonomous Vehicles written by Yan Li and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-10-28 with Technology & Engineering categories.
This book provides a comprehensive reference for both academia and industry on the fundamentals, technology details, and applications of Advanced Driver-Assistance Systems (ADAS) and autonomous driving, an emerging and rapidly growing area. The book written by experts covers the most recent research results and industry progress in the following areas: ADAS system design and test methodologies, advanced materials, modern automotive technologies, artificial intelligence, reliability concerns, and failure analysis in ADAS. Numerous images, tables, and didactic schematics are included throughout. This essential book equips readers with an in-depth understanding of all aspects of ADAS, providing insights into key areas for future research and development. • Provides comprehensive coverage of the state-of-the-art in ADAS • Covers advanced materials, deep learning, quality and reliability concerns, and fault isolation and failure analysis • Discusses ADAS system design and test methodologies, novel automotive technologies • Features contributions from both academic and industry authors, for a complete view of this important technology
3d Microelectronic Packaging
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Author : Yan Li
language : en
Publisher: Springer Nature
Release Date : 2020-11-23
3d Microelectronic Packaging written by Yan Li and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-11-23 with Technology & Engineering categories.
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
Systems Failure Analysis
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Author : Joseph Berk
language : en
Publisher: ASM International
Release Date : 2009-01-01
Systems Failure Analysis written by Joseph Berk and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-01-01 with Technology & Engineering categories.
Solid State Lighting Reliability
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Author : W.D. van Driel
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-09-06
Solid State Lighting Reliability written by W.D. van Driel and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-09-06 with Technology & Engineering categories.
Solid State Lighting Reliability: Components to Systems begins with an explanation of the major benefits of solid state lighting (SSL) when compared to conventional lighting systems including but not limited to long useful lifetimes of 50,000 (or more) hours and high efficacy. When designing effective devices that take advantage of SSL capabilities the reliability of internal components (optics, drive electronics, controls, thermal design) take on critical importance. As such a detailed discussion of reliability from performance at the device level to sub components is included as well as the integrated systems of SSL modules, lamps and luminaires including various failure modes, reliability testing and reliability performance. A follow-up, Solid State Lighting Reliability Part 2, was published in 2017.
Applied Reliability And Quality
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Author : Balbir S. Dhillon
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-02-23
Applied Reliability And Quality written by Balbir S. Dhillon and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-02-23 with Science categories.
Billions of dollars are being spent annually world-wide to develop reliable and good quality products and services. Global competition and other factors are forcing manufacturers and others to produce highly reliable and good quality products and services. This means that reliability and quality principles are now being applied across many diverse sectors of economy and each of these sectors (robotics, health care, power generation, the Internet, textile, food and software) has tailored reliability and quality principles, methods, and procedures to satisfy its specific need. Reliability and quality professionals working in these areas need to know about each other's work activities because this may help them - directly or indirectly - to perform their tasks more effectively. "Applied Reliability and Quality: Fundamentals, Methods and Procedures" meets the need for a single volume that considers applied areas of both reliability and quality. Before now, there has not been one book that covers both applied reliability and quality; so to gain knowledge of each other's specialties, these people had to study various books, articles, or reports on each area. As the first book of its kind, "Applied Reliability and Quality: Fundamentals, Methods and Procedures" will be useful to design engineers, manufacturing engineers, system engineers, engineering and manufacturing managers, reliability specialists, quality specialists, graduate and senior undergraduate students of engineering, researchers and instructors of reliability and quality, and professionals in areas such as health care, software, power generation, robotics, textile, food, and the Internet.
Semiconductor Packaging
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Author : Andrea Chen
language : en
Publisher: CRC Press
Release Date : 2016-04-19
Semiconductor Packaging written by Andrea Chen and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-04-19 with Technology & Engineering categories.
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.