Reliability Of Organic Compounds In Microelectronics And Optoelectronics
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Reliability Of Organic Compounds In Microelectronics And Optoelectronics
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Author : Willem Dirk van Driel
language : en
Publisher: Springer Nature
Release Date : 2022-01-31
Reliability Of Organic Compounds In Microelectronics And Optoelectronics written by Willem Dirk van Driel and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-01-31 with Technology & Engineering categories.
This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems.
Elastomeric Optics
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Author : George K. Knopf
language : en
Publisher: Walter de Gruyter GmbH & Co KG
Release Date : 2022-11-07
Elastomeric Optics written by George K. Knopf and has been published by Walter de Gruyter GmbH & Co KG this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-11-07 with Technology & Engineering categories.
Elastomeric optics exploit light transparent, variable translucent, and reflective stretchable polymers to create novel strain-tunable optical elements and flexible multifunctional optical sheets. Optical sheets are thin, large-area polymer light guide structures that can be used to create a wide variety of passive light harvesting and illumination systems. The book introduces the theoretical principles of elastomeric optics and explores how simple and complex mechanically deformable optical devices can be designed and fabricated. The transmission of light through these optical components or waveguides depends on the selected materials, surface interface, geometric design, optical coupling of embedded micro-structures, and degree of device deformation. In addition to providing a technical foundation for building adaptable optics, the book seeks to inspire the next generation of scientists and engineers to develop innovative solutions far beyond anything imagined today.
Reliability And Failure Analysis Of High Power Led Packaging
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Author : Cher Ming Tan
language : en
Publisher: Woodhead Publishing
Release Date : 2022-09-24
Reliability And Failure Analysis Of High Power Led Packaging written by Cher Ming Tan and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-09-24 with Technology & Engineering categories.
Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide insights for readers regarding the possible failure mechanisms in high-power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to harsher stress conditions for high-power LEDs. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs. - Introduces the failure mechanisms of high-power LEDs under varying environmental conditions and methods of how to test, simulate, and predict them - Describes the chemistry underlying the material degradation and its impact on LEDs - Discusses future directions of new packaging materials for improved performance and reliability of high-power LEDs
Russia Radio Electronics Industry Handbook Strategic Information And Contacts
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Author : IBP USA
language : en
Publisher: Lulu.com
Release Date : 1999-10
Russia Radio Electronics Industry Handbook Strategic Information And Contacts written by IBP USA and has been published by Lulu.com this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999-10 with Business & Economics categories.
Directory Of Published Proceedings
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Author :
language : en
Publisher:
Release Date : 2001
Directory Of Published Proceedings written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Engineering categories.
Energy And Water Development Appropriations For 1997 Department Of Energy Fiscal Year 1997 Budget Justifications
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Author : United States. Congress. House. Committee on Appropriations. Subcommittee on Energy and Water Development
language : en
Publisher:
Release Date : 1996
Energy And Water Development Appropriations For 1997 Department Of Energy Fiscal Year 1997 Budget Justifications written by United States. Congress. House. Committee on Appropriations. Subcommittee on Energy and Water Development and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with Energy development categories.
Physical Concepts Of Materials For Novel Optoelectronic Device Applications Ii
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Author :
language : en
Publisher:
Release Date : 1991
Physical Concepts Of Materials For Novel Optoelectronic Device Applications Ii written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1991 with Optoelectronic devices categories.
Energy And Water Development Appropriations For 1997
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Author : United States. Congress. House. Committee on Appropriations. Subcommittee on Energy and Water Development
language : en
Publisher:
Release Date : 1996
Energy And Water Development Appropriations For 1997 written by United States. Congress. House. Committee on Appropriations. Subcommittee on Energy and Water Development and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with Energy development categories.
American Book Publishing Record
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Author :
language : en
Publisher:
Release Date : 2006
American Book Publishing Record written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006 with American literature categories.
Microelectronics Packaging Handbook
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Author : Rao Tummala
language : en
Publisher: Springer Science & Business Media
Release Date : 1997-01-31
Microelectronics Packaging Handbook written by Rao Tummala and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997-01-31 with Computers categories.
This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.