Lead Free Solder Interconnect Reliability
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Lead Free Solder Interconnect Reliability
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Author : Dongkai Shangguan
language : en
Publisher: ASM International
Release Date : 2005
Lead Free Solder Interconnect Reliability written by Dongkai Shangguan and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with Technology & Engineering categories.
Fundamentals Of Lead Free Solder Interconnect Technology
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Author : Tae-Kyu Lee
language : en
Publisher: Springer
Release Date : 2014-11-05
Fundamentals Of Lead Free Solder Interconnect Technology written by Tae-Kyu Lee and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-11-05 with Technology & Engineering categories.
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
Assembly And Reliability Of Lead Free Solder Joints
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Author : John H. Lau
language : en
Publisher: Springer Nature
Release Date : 2020-05-29
Assembly And Reliability Of Lead Free Solder Joints written by John H. Lau and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-05-29 with Technology & Engineering categories.
This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
Lead Free Solder
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Author : John Hock Lye Pang
language : en
Publisher: Springer
Release Date : 2014-10-30
Lead Free Solder written by John Hock Lye Pang and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-10-30 with Technology & Engineering categories.
Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests.
The Elfnet Book On Failure Mechanisms Testing Methods And Quality Issues Of Lead Free Solder Interconnects
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Author : Günter Grossmann
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-05-12
The Elfnet Book On Failure Mechanisms Testing Methods And Quality Issues Of Lead Free Solder Interconnects written by Günter Grossmann and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-05-12 with Technology & Engineering categories.
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is the work of the European network ELFNET which was founded by the European Commission in the 6th Framework Programme. It brings together contributions from the leading European experts in lead-free soldering. The limited validity of testing methods originating from tin-lead solder was a major point of concern in ELFNET members' discussions. As a result, the network's reliability group decided to bring together the material properties of lead-free solders, as well as the basics of material science, and to discuss their influence on the procedures for accelerated testing. This has led to a matrix of failure mechanisms and their activation and, as a result, to a comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints. The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is written for scientists, engineers and researchers involved with lead-free electronics.
Lead Free Solders
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Author : K. Subramanian
language : en
Publisher: John Wiley & Sons
Release Date : 2012-03-06
Lead Free Solders written by K. Subramanian and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-03-06 with Technology & Engineering categories.
Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers: Phase diagrams and alloy development Effect of minor alloying additions Composite approaches including nanoscale reinforcements Mechanical issues affecting reliability Reliability under impact loading Thermomechanical fatigue Chemical issues affecting reliability Whisker growth Electromigration Thermomigration Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.
Reliability Of Rohs Compliant 2d And 3d Ic Interconnects
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Author : John H. Lau
language : en
Publisher:
Release Date :
Reliability Of Rohs Compliant 2d And 3d Ic Interconnects written by John H. Lau and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on with Green technology categories.
"Unique global coverage of RoHS-compliant materials for electronics manufacturing and for packaging assembly and semiconductor integration Reliability of RoHS-Compliant 2D and 3D IC Interconnects provides comprehensive details on RoHS-compliant electronics packaging solder interconnects. This authoritative guide aids in developing innovative, high-performance, cost-effective, and reliable lead-free interconnects for electronics and optoelectronic products. Reliability of RoHS-Compliant 2D and 3D IC Interconnects Covers chip-level interconnect reliability, first- and second-level interconnect reliability, and 3D IC integration interconnect reliability Addresses challenging problems created by increasing interest in lead-free interconnect reliability of 3D packaging and 3D IC integration Provides information fundamental to research and development of design (mechanical, optical, electrical, and thermal); materials; process; manufacturing; testing; and reliability for lead-free interconnects in RoHS-compliant electronics products Removes road blocks to, avoids unnecessary false starts in, and accelerates design, materials, and process development in packaging technology In-depth details: Introduction to RoHS Compliant Semiconductor and Packaging Technologies; Reliability Engineering of Lead-Free Interconnects; Notes on Failure Criterion; Reliability of 1657-Pin CCGA Lead-Free Solder Joints; Reliability of PBGA Lead-Free Solder Joints; Reliability of LED Lead-Free Interconnects; Reliability of VCSEL Lead-Free Interconnects; Reliability of Low-Temperature Lead-Free (SnBiAg) Solder Joints; Reliability of Lead-Free (SACX) Solder Joints; Chip-to-Wafer (C2W) Lead-Free Interconnect Reliability; Wafer-to-Wafer (W2W) Lead-Free Interconnect Reliability; Through-Silicon-Via (TSV) Interposer Lead-Free Interconnect Reliability; Electromigration of Lead-Free Microbumps for 3D IC Integrations; Effects of Dwell-Time and Ramp-Rates on SAC Thermal Cycling Test Results; Effects of High Strain Rate (Impact) on SAC Solder Bumps; Effects of Voids on Solder Joints Reliability"--
Interconnect Reliability In Advanced Memory Device Packaging
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Author : Chong Leong, Gan
language : en
Publisher: Springer Nature
Release Date : 2023-05-30
Interconnect Reliability In Advanced Memory Device Packaging written by Chong Leong, Gan and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-05-30 with Computers categories.
This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.
A Guide To Lead Free Solders
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Author : John W. Evans
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-01-05
A Guide To Lead Free Solders written by John W. Evans and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-01-05 with Technology & Engineering categories.
The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. Europe and Asia are moving towards legislation to ban the use of lead in solders and public demand in the US will likely have the same result. Producers of solders and manufacturers who use them will have to invent and employ suitable substitutes and A Guide to Lead-free Solders will show them how to do so.
Solder Joint Reliability
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Author : John H. Lau
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27
Solder Joint Reliability written by John H. Lau and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Technology & Engineering categories.
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.