Lead Free Solder Interconnect Reliability

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Lead Free Solder Interconnect Reliability

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Author : Dongkai Shangguan
language : en
Publisher: ASM International
Release Date : 2005

Lead Free Solder Interconnect Reliability written by Dongkai Shangguan and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with Technology & Engineering categories.

Fundamentals Of Lead Free Solder Interconnect Technology

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Author : Tae-Kyu Lee
language : en
Publisher: Springer
Release Date : 2014-11-05

Fundamentals Of Lead Free Solder Interconnect Technology written by Tae-Kyu Lee and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-11-05 with Technology & Engineering categories.

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

Advanced Manufacturing Process Lead Free Interconnect Materials And Reliability Modeling For Electronics Packaging

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Author : Christopher Bailey
language : en
Publisher: Emerald Group Publishing
Release Date : 2006

Advanced Manufacturing Process Lead Free Interconnect Materials And Reliability Modeling For Electronics Packaging written by Christopher Bailey and has been published by Emerald Group Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006 with Electronic packaging categories.

This issue of Soldering & Surface Mount Technology (SSMT) presents a number of papers from the 7th High Density Microsystems Design, Packaging and Failure Analysis (HDP'05) conference held in 2005 in the dynamic city of Shanghai, China. With over 100 high quality technical papers and presentation this annual conference brings together scholars and industrialists from Asia, Europe and the Americas to discuss the challenges and latest advances in high density packaging. This e-book contains six papers from the HDP conference, plus one additional contribution, which discuss the behaviour of key i.

Lead Free Soldering Process Development And Reliability

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Author : Jasbir Bath
language : en
Publisher: John Wiley & Sons
Release Date : 2020-06-12

Lead Free Soldering Process Development And Reliability written by Jasbir Bath and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-06-12 with Technology & Engineering categories.

Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.

Assembly And Reliability Of Lead Free Solder Joints

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Author : John H. Lau
language : en
Publisher: Springer Nature
Release Date : 2020-05-29

Assembly And Reliability Of Lead Free Solder Joints written by John H. Lau and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-05-29 with Technology & Engineering categories.

This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.

Solder Joint Reliability

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Author : John H. Lau
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27

Solder Joint Reliability written by John H. Lau and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Technology & Engineering categories.

Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.

Lead Free Solders

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Author : K. Subramanian
language : en
Publisher: John Wiley & Sons
Release Date : 2012-03-06

Lead Free Solders written by K. Subramanian and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-03-06 with Technology & Engineering categories.

Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers: Phase diagrams and alloy development Effect of minor alloying additions Composite approaches including nanoscale reinforcements Mechanical issues affecting reliability Reliability under impact loading Thermomechanical fatigue Chemical issues affecting reliability Whisker growth Electromigration Thermomigration Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.

Recent Progress In Lead Free Solder Technology

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Author : Mohd Arif Anuar Mohd Salleh
language : en
Publisher: Springer Nature
Release Date : 2022-03-01

Recent Progress In Lead Free Solder Technology written by Mohd Arif Anuar Mohd Salleh and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-03-01 with Technology & Engineering categories.

This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.

Integrated Interconnect Technologies For 3d Nanoelectronic Systems

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Author : Muhannad S. Bakir
language : en
Publisher: Artech House
Release Date : 2008-11-30

Integrated Interconnect Technologies For 3d Nanoelectronic Systems written by Muhannad S. Bakir and has been published by Artech House this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-11-30 with Technology & Engineering categories.

This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.

Lead Free Solder Process Development

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Author : Gregory Henshall
language : en
Publisher: John Wiley & Sons
Release Date : 2011-03-29

Lead Free Solder Process Development written by Gregory Henshall and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-03-29 with Technology & Engineering categories.

Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distribution Examines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB) Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD) Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.