Low Substrate Temperature Modeling Outlook Of Scaled N Mosfet
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Low Substrate Temperature Modeling Outlook Of Scaled N Mosfet
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Author : Nabil Shovon Ashraf
language : en
Publisher: Springer Nature
Release Date : 2022-05-31
Low Substrate Temperature Modeling Outlook Of Scaled N Mosfet written by Nabil Shovon Ashraf and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-05-31 with Technology & Engineering categories.
Low substrate/lattice temperature (
New Prospects Of Integrating Low Substrate Temperatures With Scaling Sustained Device Architectural Innovation
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Author : Nabil Shovon Ashraf
language : en
Publisher: Springer Nature
Release Date : 2022-06-01
New Prospects Of Integrating Low Substrate Temperatures With Scaling Sustained Device Architectural Innovation written by Nabil Shovon Ashraf and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-06-01 with Technology & Engineering categories.
In order to sustain Moore's Law-based device scaling, principal attention has focused on toward device architectural innovations for improved device performance as per ITRS projections for technology nodes up to 10 nm. Efficient integration of lower substrate temperatures (
Low Substrate Temperature Modeling Outlook Of Scaled N Mosfet
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Author : Nabil Shovon Ashraf
language : en
Publisher: Morgan & Claypool Publishers
Release Date : 2018-07-13
Low Substrate Temperature Modeling Outlook Of Scaled N Mosfet written by Nabil Shovon Ashraf and has been published by Morgan & Claypool Publishers this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-07-13 with Technology & Engineering categories.
Low substrate/lattice temperature (
Emerging Electronics And Automation
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Author : Daniel-Ioan Stroe
language : en
Publisher: Springer Nature
Release Date : 2025-02-12
Emerging Electronics And Automation written by Daniel-Ioan Stroe and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2025-02-12 with Technology & Engineering categories.
This book includes peer-reviewed papers presented at the 3rd International Conference on Emerging Electronics & Automation (E2A) 2023. This volume will serve as a comprehensive compilation of the scientific exchanges that took place during the conference at NIT Silchar, India. These proceedings aim to provide readers with insights into the latest scientific endeavors and accomplishments of the conference participants in various emerging fields, including instrumentation, control, signal processing, communication, and related computational techniques. The book seeks to present the global audience with exciting updates, novel findings, and solutions to challenging questions in the field, while also inspiring aspiring scientists to pursue meaningful scientific research. Despite its specialization, the field of instrumentation spans a wide range of disciplines, such as electronics, computation, automation, microelectronic technology, nanomaterials, and biomedical engineering applications. Consequently, this publication is expected to appeal to a diverse audience within the scientific and engineering domains.
Advanced Concepts And Architectures For Plasma Enabled Material Processing
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Author : Oleg O. Baranov
language : en
Publisher: Springer Nature
Release Date : 2022-05-31
Advanced Concepts And Architectures For Plasma Enabled Material Processing written by Oleg O. Baranov and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-05-31 with Technology & Engineering categories.
Plasma-based techniques are widely and successfully used across the field of materials processing, advanced nanosynthesis, and nanofabrication. The diversity of currently available processing architectures based on or enhanced by the use of plasmas is vast, and one can easily get lost in the opportunities presented by each of these configurations. This mini-book provides a concise outline of the most important concepts and architectures in plasma-assisted processing of materials, helping the reader navigate through the fundamentals of plasma system selection and optimization. Architectures discussed in this book range from the relatively simple, user-friendly types of plasmas produced using direct current, radio-frequency, microwave, and arc systems, to more sophisticated advanced systems based on incorporating and external substrate architectures, and complex control mechanisms of configured magnetic fields and distributed plasma sources.
Proceedings Of The International Symposium On The Physical Failure Analysis Of Integrated Circuits
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Author :
language : en
Publisher:
Release Date : 1999
Proceedings Of The International Symposium On The Physical Failure Analysis Of Integrated Circuits written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999 with Integrated circuits categories.
Electrical Electronics Abstracts
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Author :
language : en
Publisher:
Release Date : 1997
Electrical Electronics Abstracts written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Electrical engineering categories.
Electronic Materials Handbook
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Author :
language : en
Publisher: ASM International
Release Date : 1989-11-01
Electronic Materials Handbook written by and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989-11-01 with Technology & Engineering categories.
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Dissertation Abstracts International
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Author :
language : en
Publisher:
Release Date : 1988
Dissertation Abstracts International written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1988 with Dissertations, Academic categories.
Compact Modeling
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Author : Gennady Gildenblat
language : en
Publisher: Springer Science & Business Media
Release Date : 2010-06-22
Compact Modeling written by Gennady Gildenblat and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-06-22 with Technology & Engineering categories.
Most of the recent texts on compact modeling are limited to a particular class of semiconductor devices and do not provide comprehensive coverage of the field. Having a single comprehensive reference for the compact models of most commonly used semiconductor devices (both active and passive) represents a significant advantage for the reader. Indeed, several kinds of semiconductor devices are routinely encountered in a single IC design or in a single modeling support group. Compact Modeling includes mostly the material that after several years of IC design applications has been found both theoretically sound and practically significant. Assigning the individual chapters to the groups responsible for the definitive work on the subject assures the highest possible degree of expertise on each of the covered models.