Low Temperature Multilevel Interconnection Technology Employing A Polyimide
DOWNLOAD
Download Low Temperature Multilevel Interconnection Technology Employing A Polyimide PDF/ePub or read online books in Mobi eBooks. Click Download or Read Online button to get Low Temperature Multilevel Interconnection Technology Employing A Polyimide book now. This website allows unlimited access to, at the time of writing, more than 1.5 million titles, including hundreds of thousands of titles in various foreign languages. If the content not found or just blank you must refresh this page
Low Temperature Multilevel Interconnection Technology Employing A Polyimide
DOWNLOAD
Author : James William Peterson
language : en
Publisher:
Release Date : 1985
Low Temperature Multilevel Interconnection Technology Employing A Polyimide written by James William Peterson and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1985 with categories.
Proceedings Of The Symposium On Multilevel Metallization Interconnection And Contact Technologies
DOWNLOAD
Author : L. B. Rothman
language : en
Publisher:
Release Date : 1987
Proceedings Of The Symposium On Multilevel Metallization Interconnection And Contact Technologies written by L. B. Rothman and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1987 with Electronics categories.
Reduced Thermal Processing For Ulsi
DOWNLOAD
Author : R.A. Levy
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Reduced Thermal Processing For Ulsi written by R.A. Levy and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Science categories.
As feature dimensions of integrated circuits shrink, the associated geometrical constraints on junction depth impose severe restrictions on the thermal budget for processing such devices. Furthermore, due to the relatively low melting point of the first aluminum metallization level, such restrictions extend to the fabrication of multilevel structures that are now essential in increasing packing density of interconnect lines. The fabrication of ultra large scale integrated (ULSI) devices under thermal budget restrictions requires the reassessment of existing and the development of new microelectronic materials and processes. This book addresses three broad but interrelated areas. The first area focuses on the subject of rapid thermal processing (RTP), a technology that allows minimization of processing time while relaxing the constraints on high temperature. Initially developed to limit dopant redistribution, current applications of RTP are shown here to encompass annealing, oxidation, nitridation, silicidation, glass reflow, and contact sintering. In a second but complementary area, advances in equipment design and performance of rapid thermal processing equipment are presented in conjunction with associated issues of temperature measurement and control. Defect mechanisms are assessed together with the resulting properties of rapidly deposited and processed films. The concept of RTP integration for a full CMOS device process is also examined together with its impact on device characteristics.
Mems Materials And Processes Handbook
DOWNLOAD
Author : Reza Ghodssi
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-03-18
Mems Materials And Processes Handbook written by Reza Ghodssi and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-03-18 with Technology & Engineering categories.
MEMs Materials and Processes Handbook" is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on "Materials" and "Processes". The extensive Material Selection Guide" and a "Material Database" guides the reader through the selection of appropriate materials for the required task at hand. The "Processes" section of the book is organized as a catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMs.
Wide Bandgap Semiconductors For Power Electronics
DOWNLOAD
Author : Peter Wellmann
language : en
Publisher: John Wiley & Sons
Release Date : 2022-01-10
Wide Bandgap Semiconductors For Power Electronics written by Peter Wellmann and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-01-10 with Technology & Engineering categories.
Wide Bandgap Semiconductors for Power Electronic A guide to the field of wide bandgap semiconductor technology Wide Bandgap Semiconductors for Power Electronics is a comprehensive and authoritative guide to wide bandgap materials silicon carbide, gallium nitride, diamond and gallium(III) oxide. With contributions from an international panel of experts, the book offers detailed coverage of the growth of these materials, their characterization, and how they are used in a variety of power electronics devices such as transistors and diodes and in the areas of quantum information and hybrid electric vehicles. The book is filled with the most recent developments in the burgeoning field of wide bandgap semiconductor technology and includes information from cutting-edge semiconductor companies as well as material from leading universities and research institutions. By taking both scholarly and industrial perspectives, the book is designed to be a useful resource for scientists, academics, and corporate researchers and developers. This important book: Presents a review of wide bandgap materials and recent developments Links the high potential of wide bandgap semiconductors with the technological implementation capabilities Offers a unique combination of academic and industrial perspectives Meets the demand for a resource that addresses wide bandgap materials in a comprehensive manner Written for materials scientists, semiconductor physicists, electrical engineers, Wide Bandgap Semiconductors for Power Electronics provides a state of the art guide to the technology and application of SiC and related wide bandgap materials.
Handbook Of Semiconductor Manufacturing Technology
DOWNLOAD
Author : Yoshio Nishi
language : en
Publisher: CRC Press
Release Date : 2000-08-09
Handbook Of Semiconductor Manufacturing Technology written by Yoshio Nishi and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000-08-09 with Technology & Engineering categories.
The Handbook of Semiconductor Manufacturing Technology describes the individual processes and manufacturing control, support, and infrastructure technologies of silicon-based integrated-circuit manufacturing, many of which are also applicable for building devices on other semiconductor substrates. Discussing ion implantation, rapid thermal processing, photomask fabrication, chip testing, and plasma etching, the editors explore current and anticipated equipment, devices, materials, and practices of silicon-based manufacturing. The book includes a foreword by Jack S. Kilby, cowinner of the Nobel Prize in Physics 2000 "for his part in the invention of the integrated circuit."
Advanced Polyimide Materials
DOWNLOAD
Author : Shi-Yong Yang
language : en
Publisher: Elsevier
Release Date : 2018-04-20
Advanced Polyimide Materials written by Shi-Yong Yang and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-04-20 with Technology & Engineering categories.
Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research. The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation. Reviews the latest research, development and future prospective of polyimides Describes the progress made in the research on polyimide materials, including polyimide films, matrices for carbon fiber composites, coatings for microelectronics and display devices, forms and fibers Presents a highly organized work that is composed of different sections that are easily compared
Proceedings International Ieee Vlsi Multilevel Interconnection Conference
DOWNLOAD
Author :
language : en
Publisher:
Release Date : 1989
Proceedings International Ieee Vlsi Multilevel Interconnection Conference written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989 with Hybrid integrated circuits categories.
Ftir And Xps Studies Of Polymer Surface Modification In Cf4 O2 Nf3 Microwave Discharges And Of Metal Polyimide Interfaces
DOWNLOAD
Author : Jihperng Leu
language : en
Publisher:
Release Date : 1990
Ftir And Xps Studies Of Polymer Surface Modification In Cf4 O2 Nf3 Microwave Discharges And Of Metal Polyimide Interfaces written by Jihperng Leu and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1990 with categories.
Proceedings Of The Symposium On Polymeric Materials For Electronic Packaging And High Technology Applications
DOWNLOAD
Author : John R. Susko
language : en
Publisher:
Release Date : 1988
Proceedings Of The Symposium On Polymeric Materials For Electronic Packaging And High Technology Applications written by John R. Susko and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1988 with Electrochemistry categories.