Proceedings Of The Symposium On Polymeric Materials For Electronic Packaging And High Technology Applications
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Proceedings Of The Symposium On Polymeric Materials For Electronic Packaging And High Technology Applications
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Author : John R. Susko
language : en
Publisher:
Release Date : 1988
Proceedings Of The Symposium On Polymeric Materials For Electronic Packaging And High Technology Applications written by John R. Susko and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1988 with Electrochemistry categories.
Polymeric Materials For Electronics Packaging And Interconnection
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Author : John H. Lupinski
language : en
Publisher:
Release Date : 1989
Polymeric Materials For Electronics Packaging And Interconnection written by John H. Lupinski and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989 with Science categories.
From a symposium of the ACS 196th meeting, Los Angeles, CA, Sept. 1988. Thirty-nine chapters cover a broad spectrum of topics in four general areas: physical chemistry of materials, properties and applications of encapsulants and gels, and printed circuit board substrates and materials. Also includes a review of the marketing trends which drive packaging technology. Annotation copyrighted by Book News, Inc., Portland, OR
Polymers In Organic Electronics
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Author : Sulaiman Khalifeh
language : en
Publisher: Elsevier
Release Date : 2020-04-01
Polymers In Organic Electronics written by Sulaiman Khalifeh and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-04-01 with Technology & Engineering categories.
Polymers in Organic Electronics: Polymer Selection for Electronic, Mechatronic, and Optoelectronic Systems provides readers with vital data, guidelines, and techniques for optimally designing organic electronic systems using novel polymers. The book classifies polymer families, types, complexes, composites, nanocomposites, compounds, and small molecules while also providing an introduction to the fundamental principles of polymers and electronics. Features information on concepts and optimized types of electronics and a classification system of electronic polymers, including piezoelectric and pyroelectric, optoelectronic, mechatronic, organic electronic complexes, and more. The book is designed to help readers select the optimized material for structuring their organic electronic system.Chapters discuss the most common properties of electronic polymers, methods of optimization, and polymeric-structured printed circuit boards. The polymeric structures of optoelectronics and photonics are covered and the book concludes with a chapter emphasizing the importance of polymeric structures for packaging of electronic devices. - Provides key identifying details on a range of polymers, micro-polymers, nano-polymers, resins, hydrocarbons, and oligomers - Covers the most common electrical, electronic, and optical properties of electronic polymers - Describes the underlying theories on the mechanics of polymer conductivity - Discusses polymeric structured printed circuit boards, including their rapid prototyping and optimizing their polymeric structures - Shows optimization methods for both polymeric structures of organic active electronic components and organic passive electronic components
Proceedings
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Author :
language : en
Publisher:
Release Date :
Proceedings written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on with Electronic apparatus and appliances categories.
Nanopackaging
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Author : James E. Morris
language : en
Publisher: Springer
Release Date : 2018-09-22
Nanopackaging written by James E. Morris and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-09-22 with Technology & Engineering categories.
This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, applications of nanoparticles, graphene, carbon nanotubes and nanowires in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancement. Now in a widely extended second edition, Nanopackaging is an important reference for industrial and academic researchers, as well as practicing engineers seeking information about latest techniques. Twelve new chapters address carbon nanotubes and nanowires, fabrication and properties of graphene, graphene for thermal cooling of microelectronics and for electrical interconnections, packaging of post-CMOS nanoelectronics, environmental and health effects of nanopackaging technologies, and more. This book is an ideal reference for researchers, practicing engineers, and graduate students who are either entering the field for the first time, or are already conducting research and want to expand their knowledge in the field of nanopackaging.
Proceedings Of The 19th Asian Workshop On Polymer Processing Awpp 2022
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Author : Wen Shyang Chow
language : en
Publisher: Springer Nature
Release Date : 2023-06-30
Proceedings Of The 19th Asian Workshop On Polymer Processing Awpp 2022 written by Wen Shyang Chow and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-06-30 with Technology & Engineering categories.
This book presents the selected papers from the 19th Asian Workshop in Polymer Processing (AWPP 2022) highlighting the latest research breakthroughs in the field of polymeric materials and processing technologies. The topics of the conference provides an exclusive forum for intellectually stimulating and engaging interactions among academicians and industrialists to share their recent scientific breakthroughs and emerging trends in polymer processing technologies and their contributions towards environmental sustainability. Its content appeals to the researchers, academics, industry practitioners working in the field of green sustainable polymers.
Polymers For Electronic Photonic Application
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Author : C. P. Wong
language : en
Publisher: Elsevier
Release Date : 2013-10-22
Polymers For Electronic Photonic Application written by C. P. Wong and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-10-22 with Technology & Engineering categories.
The most recent advances in the use of polymeric materials by the electronic industry can be found in Polymers for Electronic and Photonic Applications. This bookprovides in-depth coverage of photoresis for micro-lithography, microelectronic encapsulants and packaging, insulators, dielectrics for multichip packaging,electronic and photonic applications of polymeric materials, among many other topics. Intended for engineers and scientists who design, process, and manufacturemicroelectronic components, this book will also prove useful for hybrid and systems packaging managers who want to be informed of the very latest developments inthis field.* Presents most recent advances in the use of polymeric materials by the electronic industry* Contributions by foremost experts in the field
Proceedings Of The Ieee 1989 National Aerospace And Electronics Conference Naecon 1989
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Author :
language : en
Publisher:
Release Date : 1989
Proceedings Of The Ieee 1989 National Aerospace And Electronics Conference Naecon 1989 written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989 with Avionics categories.
Proceedings Of The Second International Symposium On Diamond Materials
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Author : A. J. Purdes
language : en
Publisher:
Release Date : 1991
Proceedings Of The Second International Symposium On Diamond Materials written by A. J. Purdes and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1991 with Diamond thin films categories.
International Symposium On Electronic Materials And Packaging
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Author :
language : en
Publisher:
Release Date : 2000
International Symposium On Electronic Materials And Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Technology & Engineering categories.
Topics covered by this title include: flip chip running; solder join reliability; emerging technologies; solder materials; delimitation; polymers for packaging; design and process; modelling and testing; material characterization; and package reliability.