Materials Reliability In Microelectronics Viii
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Materials Reliability In Microelectronics Viii
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Author : John C. Bravman
language : en
Publisher:
Release Date : 1998
Materials Reliability In Microelectronics Viii written by John C. Bravman and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with Electrodiffusion categories.
Diffusion Processes In Advanced Technological Materials
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Author : Devendra Gupta
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-01-15
Diffusion Processes In Advanced Technological Materials written by Devendra Gupta and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-01-15 with Science categories.
This new game book for understanding atoms at play aims to document diffusion processes and various other properties operative in advanced technological materials. Diffusion in functional organic chemicals, polymers, granular materials, complex oxides, metallic glasses, and quasi-crystals among other advanced materials is a highly interactive and synergic phenomenon. A large variety of atomic arrangements are possible. Each arrangement affects the performance of these advanced, polycrystalline multiphase materials used in photonics, MEMS, electronics, and other applications of current and developing interest. This book is written by pioneers in industry and academia for engineers, chemists, and physicists in industry and academia at the forefront of today's challenges in nanotechnology, surface science, materials science, and semiconductors.
Fracture Mechanics Applications And Challenges
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Author : M. Fuentes
language : en
Publisher: Elsevier
Release Date : 2000-09-13
Fracture Mechanics Applications And Challenges written by M. Fuentes and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000-09-13 with Technology & Engineering categories.
This book contains 15 fully peer-reviewed Invited Papers which were presented at the 13th Biennial European Conference on Fracture and is a companion to the CD-ROM http://www.elsevier.com/locate/isbn/008043701xProceedings. The organisers of the ECF 13 opted from the very beginning for an application-orientated conference, and consequently, this book contributes to the understanding of fracture phenomena, and disseminates fracture concepts and their application to the solution of engineering problems to practitioners in a wide range of fields. The fields covered in this book can be broadly classified into: elastic-plastic fracture mechanics, fracture dynamics, fatigue and interactive processes, failure, structural integrity, coatings and materials, with applications to the following industrial sectors: transport, aerospace engineering, civil engineering, pipelines and automotive engineering.
Materials Reliability In Microelectronics Viii Volume 516
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Author : John C. Bravman
language : en
Publisher: Materials Research Society
Release Date : 1998-11-11
Materials Reliability In Microelectronics Viii Volume 516 written by John C. Bravman and has been published by Materials Research Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998-11-11 with Technology & Engineering categories.
Reliability concerns have forced interconnect systems to scale more slowly than devices. As a result, reliability engineers and scientists are now responsible for much of the performance and lifetime gains anticipated in the microelectronics industry. To achieve these gains, the interconnect must be viewed as a complex system with many types of reliability issues. A critical understanding of electromigration, stress-induced voiding, mechanical integrity, thermal performance, chemical effects, and oxide reliability are necessary. And of course, new models and materials will likely be necessary to improve the interconnect system for future needs. This book brings together researchers from academia and industry to discuss fundamental mechanisms and phenomena in the reliability field. Topics include: novel measurement techniques; microstructural effects; reliability modelling; stress effects; advanced inter-connect reliability; adhesion and fracture; and packaging reliability issues.
Iutam Symposium On Multiscale Modeling And Characterization Of Elastic Inelastic Behavior Of Engineering Materials
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Author : S. Ahzi
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-04-17
Iutam Symposium On Multiscale Modeling And Characterization Of Elastic Inelastic Behavior Of Engineering Materials written by S. Ahzi and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-04-17 with Technology & Engineering categories.
The papers in this proceeding are a collection of the works presented at the IUTAM symposium-Marrakech 2002 (October 20-25) which brought together scientists from various countries. These papers cover contemporary topics in multiscale modeling and characterization of materials behavior of engineering materials. They were selected to focus on topics related to deformation and failure in metals, alloys, intermetallics and polymers including: experimental techniques, deformation and failure mechanisms, dislocation-based modelling, microscopic-macroscopic averaging schemes, application to forming processes and to phase transformation, localization and failure phenomena, and computational advances. Key areas that are covered by some of the papers include modeling of material deformation at various scales. At the atomistic scale, results from MD simulations pertaining to deformation mechanisms in nano-crystalline materials as well as dislocation-defect interactions are presented. Advances in modeling of deformation in metals using discrete dislocation analyses are also presented, providing an insight into this emerging scientific technique that can be used to model deformation at the microscale. These papers address current engineering problems, including deformation of thin fIlms, dislocation behavior and strength during nanoindentation, strength in metal matrix composites, dislocation-crack interaction, development of textures in polycrystals, and problems involving twining and shape memory behavior. On Behalf of the organizing committee, I would like to thank Professor P.
Materials And Contact Characterisation Viii
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Author : C.A. Brebbia
language : en
Publisher: WIT Press
Release Date : 2017-09-20
Materials And Contact Characterisation Viii written by C.A. Brebbia and has been published by WIT Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-09-20 with Technology & Engineering categories.
Material and contact characterisation is a rapidly advancing field that requires the application of a combination of numerical and experimental methods. Including papers from the International Conference on Computational Methods and Experiments in Material and Contact Characterisation this volume presents the latest research in the field.
Research In Progress
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Author :
language : en
Publisher:
Release Date : 1991
Research In Progress written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1991 with Military research categories.
Research In Progress
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Author : United States. Army Research Office
language : en
Publisher:
Release Date : 1991
Research In Progress written by United States. Army Research Office and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1991 with Military research categories.
Vols. for 1977- consist of two parts: Chemistry, biological sciences, engineering sciences, metallurgy and materials science (issued in the spring); and Physics, electronics, mathematics, geosciences (issued in the fall).
High Temperature Ordered Intermetallic Alloys Viii Volume 552
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Author : Easo P. George
language : en
Publisher:
Release Date : 1999-07-19
High Temperature Ordered Intermetallic Alloys Viii Volume 552 written by Easo P. George and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999-07-19 with Technology & Engineering categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Silicon Front End Technology Materials Processing And Modelling
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Author : Nicholas E. B. Cowern
language : en
Publisher:
Release Date : 1998
Silicon Front End Technology Materials Processing And Modelling written by Nicholas E. B. Cowern and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with Semiconductor doping categories.