Materials Technology And Reliability For Advanced Interconnects 2005 Volume 863
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Materials Technology And Reliability For Advanced Interconnects 2005 Volume 863
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Author : Paul R. Besser
language : en
Publisher:
Release Date : 2005-08-26
Materials Technology And Reliability For Advanced Interconnects 2005 Volume 863 written by Paul R. Besser and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005-08-26 with Technology & Engineering categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This volume was first published in 2005.
Materials Technology And Reliability For Advanced Interconnects And Low K Dielectrics
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Author : G. S. Oehrlein
language : en
Publisher: Cambridge University Press
Release Date : 2014-06-05
Materials Technology And Reliability For Advanced Interconnects And Low K Dielectrics written by G. S. Oehrlein and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-06-05 with Technology & Engineering categories.
This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to protect Cu from chemical attack, and the utilization of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach.
Materials And Strength Of Gas Turbine Parts
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Author : Leonid Borisovich Getsov
language : en
Publisher: Springer Nature
Release Date : 2021-04-17
Materials And Strength Of Gas Turbine Parts written by Leonid Borisovich Getsov and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-04-17 with Science categories.
This book discusses several mechanical and material problems that are typical for gas turbine components. It discusses accelerated tests and other methods for increasing the reliability of gas turbine engines. Special attention is given to non-traditional methods for calculating the strength characteristics and longevity of the main components. This first volume focuses on the selection of materials, deformation and destruction mechanisms in connection with stationary and non-stationary loading, and types of material damage such as the thermal fatigue. Particular attention is paid to the issues of the properties of single crystal alloys, the relationship between structure and properties, the influence of technological factors and long-term operation. The characteristics of creep resistance, crack resistance, and resistance to cyclic deformation of different alloys are given.
Handbook Of Thin Film Deposition
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Author : Krishna Seshan
language : en
Publisher: William Andrew
Release Date : 2018-02-23
Handbook Of Thin Film Deposition written by Krishna Seshan and has been published by William Andrew this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-02-23 with Technology & Engineering categories.
Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes. The book is broken up into three sections: scaling, equipment and processing, and applications. In this newly revised edition, the handbook will also explore the limits of thin film applications, most notably as they relate to applications in manufacturing, materials, design and reliability. Offers a practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance, applications and the limitations faced by those processes Covers core processes and applications in the semiconductor industry and new developments within the photovoltaic and optical thin film industries Features a new chapter discussing Gates Dielectrics
Interconnect Reliability In Advanced Memory Device Packaging
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Author : Chong Leong, Gan
language : en
Publisher: Springer Nature
Release Date : 2023-05-30
Interconnect Reliability In Advanced Memory Device Packaging written by Chong Leong, Gan and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-05-30 with Computers categories.
This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.
Handbook Of Semiconductor Manufacturing Technology
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Author : Yoshio Nishi
language : en
Publisher: CRC Press
Release Date : 2017-12-19
Handbook Of Semiconductor Manufacturing Technology written by Yoshio Nishi and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Materials Processes And Reliability For Advanced Interconnects For Micro And Nanoelectronics 2009
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Author : Martin Gall
language : en
Publisher: Cambridge University Press
Release Date : 2014-06-05
Materials Processes And Reliability For Advanced Interconnects For Micro And Nanoelectronics 2009 written by Martin Gall and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-06-05 with Technology & Engineering categories.
Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics.
Materials Technology And Reliability Of Low K Dielectrics And Copper Interconnects
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Author : Ting Y. Tsui
language : en
Publisher:
Release Date : 2006
Materials Technology And Reliability Of Low K Dielectrics And Copper Interconnects written by Ting Y. Tsui and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006 with Technology & Engineering categories.
Materials And Devices For Smart Systems Ii Volume 888
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Author : Yasubumi Furuya
language : en
Publisher:
Release Date : 2006-04-07
Materials And Devices For Smart Systems Ii Volume 888 written by Yasubumi Furuya and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-04-07 with Technology & Engineering categories.
Smart/intelligent systems is a primary technology for present and future applications in areas ranging from everyday life to aerospace missions, from civil to military environments, from robots to information technology. Smart materials are the critical foundation for high-performance smart devices, and smart devices are fundamental components for smart systems. The three cannot be separated. This book bridges the fields of smart materials, sensing and actuating devices, and intelligent systems, and provides an opportunity for researchers from all three arenas to channel information into a coherent, interdisciplinary community. Topics include: piezoelectric actuators; novel devices and systems; shape memory alloys and magnetostrictive devices; nanometer-scale processing and properties; piezoelectric materials; sensor materials and devices; and electroactive polymer actuators.
Progress In Semiconductor Materials V Volume 891
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Author : Linda J. Olafsen
language : en
Publisher:
Release Date : 2006-06-28
Progress In Semiconductor Materials V Volume 891 written by Linda J. Olafsen and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-06-28 with Science categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.