Mechanical Design Of Electronic Systems
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Mechanical Design Of Electronic Systems
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Author : James W. Dally
language : en
Publisher: College House Enterprises
Release Date : 2008-01-01
Mechanical Design Of Electronic Systems written by James W. Dally and has been published by College House Enterprises this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-01-01 with Electronic packaging categories.
Fundamentals Of Electronic Systems Design
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Author : Jens Lienig
language : en
Publisher: Springer
Release Date : 2017-04-25
Fundamentals Of Electronic Systems Design written by Jens Lienig and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-04-25 with Technology & Engineering categories.
This textbook covers the design of electronic systems from the ground up, from drawing and CAD essentials to recycling requirements. Chapter by chapter, it deals with the challenges any modern system designer faces: The design process and its fundamentals, such as technical drawings and CAD, electronic system levels, assembly and packaging issues and appliance protection classes, reliability analysis, thermal management and cooling, electromagnetic compatibility (EMC), all the way to recycling requirements and environmental-friendly design principles. "This unique book provides fundamental, complete, and indispensable information regarding the design of electronic systems. This topic has not been addressed as complete and thorough anywhere before. Since the authors are world-renown experts, it is a foundational reference for today’s design professionals, as well as for the next generation of engineering students." Dr. Patrick Groeneveld, Synopsys Inc.
Mechanical Aspects In Electronics Systems Design
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Author : Vinay Divakar
language : en
Publisher: GRIN Verlag
Release Date : 2014-08-27
Mechanical Aspects In Electronics Systems Design written by Vinay Divakar and has been published by GRIN Verlag this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-08-27 with Technology & Engineering categories.
Scientific Study from the year 2013 in the subject Engineering - Mechanical Engineering, grade: B+, , course: Electronics Systems Design, language: English, abstract: In chapter 1, the present research carried on the mature laser technology i.e. GaAs, in order to improve its efficiency. The packaging principle used for receivers can be applied for the packaging of the laser driver circuit and the laser source in a single module. The concept of FRACAS (Failure Reporting, Analysis and Corrective Action System) has been described and failure analysis technique for Electrical overstress (EOS) is described. An industrial approach to calculating the reliability of a system with some known data is described. Some challenges with respect to packaging has been discussed in detail and some methods to overcome challenges such as lattice mismatch has been described. Every electronic components or electronic systems have certain specifications based on which it is developed and all components have datasheets of their own. The datasheets consists complete details related to the product such as product design specifications, packaging type, power ratings, dimensions etc. Any components can be selected for a particular application by referring their datasheets. In chapter 2, a datasheet for a DC power supply has been developed covering most of the important details that may be needed for designing and modeling using software tools. The schematic of the power supply is developed and practical tests are performed on the power supply, which has been described in details with the test results. The power supply has four interfaces and the functionality and usability of these interfaces has been shown and described in detail. Before the large scale manufacturing and production of any product, it is necessary to conduct two basic tests i.e. Thermal analysis and vibration tests for any given product. These tests help us to get an insight to the reliability of the product. In chapter 3, the power supply is modeled using the software tool ICEPACK v13, using which thermal analysis is performed on the critical components and the temperature variation curves along with the simulation results has been discussed. The method of casing used for the power supply for modeling and the types of conventions i.e. natural and forced convention systems has been compared and discussed. An experimental set up used for performing vibration testing on the power supply has been demonstrated and described in detail.
Physical Design Of Electronic Systems Materials Technology
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Author : Bell Telephone Laboratories
language : en
Publisher:
Release Date : 1970
Physical Design Of Electronic Systems Materials Technology written by Bell Telephone Laboratories and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1970 with Electronic apparatus and appliances categories.
Practical Guide To The Packaging Of Electronics Second Edition
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Author : Ali Jamnia
language : en
Publisher: CRC Press
Release Date : 2008-11-20
Practical Guide To The Packaging Of Electronics Second Edition written by Ali Jamnia and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-11-20 with Technology & Engineering categories.
As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that concern the field of electronics packaging. First published in 2003, this book has been extensively updated, includes more detail where needed, and provides additional segments for clarification. This volume supplies a solid foundation for heat transfer, vibration, and life expectancy calculations. Topics discussed include various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; shock management; mechanical, electrical, and chemically induced reliability; and more. Unlike many other available works, it neither assumes the reader’s familiarity with the subject nor is it so basic that the reader may lose interest. Dr. Ali Jamnia has published a large number of engineering papers and presentations and is the holder of a number of patents and patent applications. He has been involved in the issues of electronics packaging since the early ‘90s and since 1995 has worked toward the development of innovative electronics systems to aid individuals with physical or cognitive disabilities. By consulting this manual, engineers, program managers, and quality assurance managers involved in electronic systems gain a fundamental grasp of the issues involved in electronics packaging, learn how to define guidelines for a system’s design, develop the ability to identify reliability issues and concerns, and are able to conduct more complete analyses for the final design.
Mechatronic Systems Design And Solid Materials
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Author : Satya Bir Singh
language : en
Publisher: CRC Press
Release Date : 2021-05-10
Mechatronic Systems Design And Solid Materials written by Satya Bir Singh and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-05-10 with Technology & Engineering categories.
This volume elaborates on mechatronics as the synergistic integration of mechanical engineering with electronics and intelligent computer control in the design and manufacturing of industrial products and processes. It considers the integration of mechanical systems (mechanical elements, components, machines), electronic systems (microelectronics, sensor and actuator technology), and information technology. The book’s chapters present the principles of mechatronic systems design and solid materials in small elementary steps, provide an abundance of examples, and feature problems that are as practical as possible without becoming too involved with many extraneous details.
Thermal Modeling And Design Of Electronic Systems And Devices
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Author : American Society of Mechanical Engineers. Winter Annual Meeting
language : en
Publisher:
Release Date : 1990
Thermal Modeling And Design Of Electronic Systems And Devices written by American Society of Mechanical Engineers. Winter Annual Meeting and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1990 with Technology & Engineering categories.
Mechatronics Integrated Mechanical Electronic Systems With Cd
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Author : K.P. Ramachandran
language : en
Publisher: John Wiley & Sons
Release Date : 2008
Mechatronics Integrated Mechanical Electronic Systems With Cd written by K.P. Ramachandran and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008 with Mechatronics categories.
Market_Desc: This textbook is written for undergraduate students embarking on introductory course in Mechatronics and is also a reference book for engineers, and other practicing professionals, who are keen on understanding the principles of Mechatronic systems and engineering. Special Features: · Text presented in an integrated and lucid style.· Design of discrete control systems using fluid power circuits and PLCs explained.· User-friendly book with simple explanations and illustrations.· Many worked out examples and case studies.· Numerous illustrations, review questions, problems and exercises given.· Appendices, solved question and answers included in companion CD.· Instructor Manual CD with Powerpoint presentations and questionnaire to be made available in December 2008. About The Book: This book integrates the principles of electrical and electronic engineering with Mechatronic system application in a simple manner, and is designed for both mechanical/industrial engineers. This book enables one to design and select analog and digital circuits, microprocessor-based components, mechanical devices, sensors and actuators, and control devices to design modern mechatronic systems.Mechatronics - Integrated Mechanical Electronic System, consists of 16 chapters and each chapter begins with learning objectives and a brief introduction. Topics are then divided into labeled sections with explanations, examples, along with appropriate practical applications. A variety of solved problems with step by step solutions are included. Each chapter ends with key terms, summary of the chapter, objective type questions and exercises.
Practical Guide To The Packaging Of Electronics
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Author : Ali Jamnia
language : en
Publisher: CRC Press
Release Date : 2002-10-08
Practical Guide To The Packaging Of Electronics written by Ali Jamnia and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002-10-08 with Technology & Engineering categories.
Whether you are designing a new system or troubleshooting a current one, this ingenious text offers a wealth of valuable information. The author focuses on reliability problems and the design of systems with incomplete criteria and components and provides a simple approach for estimating thermal and mechanical characteristics of electronic systems. Practical Guide to the Packaging of Electronics discusses Packaging/enclosure design and reliability Thermal, junction-to-case, and contact interface resistance Direct and indirect flow system design Fin design and fan selection Vital elements of shock and vibration Thermal stresses and strains in the design and analysis of mechanically reliable systems Reliability models and system failure The selection of engineering software to facilitate system analysis Design parameters in an avionics electronics package Practical Guide to the Packaging of Electronics is an excellent refresher for mechanical, biomedical, electrical and electronics, manufacturing, materials, and quality and reliability engineers, and will be an invaluable text for upper-level undergraduate and graduate students in these disciplines.
Physical Design Of Electronic Systems Design Technology
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Author : Bell Telephone Laboratories
language : en
Publisher:
Release Date : 1970
Physical Design Of Electronic Systems Design Technology written by Bell Telephone Laboratories and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1970 with Electronic systems categories.