Mems Pressure Sensors Fabrication And Process Optimization
DOWNLOAD
Download Mems Pressure Sensors Fabrication And Process Optimization PDF/ePub or read online books in Mobi eBooks. Click Download or Read Online button to get Mems Pressure Sensors Fabrication And Process Optimization book now. This website allows unlimited access to, at the time of writing, more than 1.5 million titles, including hundreds of thousands of titles in various foreign languages. If the content not found or just blank you must refresh this page
Mems Pressure Sensors Fabrication And Process Optimization
DOWNLOAD
Author : Parvej Ahmad Alvi
language : en
Publisher: Lulu.com
Release Date : 2014-07-14
Mems Pressure Sensors Fabrication And Process Optimization written by Parvej Ahmad Alvi and has been published by Lulu.com this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-07-14 with Technology & Engineering categories.
MEMS Pressure Sensors: Fabrication and Process Optimization - describs the step by step fabrication process sequence along with flow chart for fabrication of micro pressure sensors taking into account various aspects of fabrication and designing of the pressure sensors as well as fabrication process optimization. A complete experimental detail before and after each step of fabrication of the sensor has also been discussed. This leads to the uniqueness of the book. MEMS Pressure Sensors: Fabrication and Process Optimization will greatly benefit undergraduate and postgraduate students of MEMS and NEMS courses. Process engineers and technologists in the microelectronics industry including MEMS-based sensors manufacturers.
Piezoresistor Design And Applications
DOWNLOAD
Author : Joseph C. Doll
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-10-30
Piezoresistor Design And Applications written by Joseph C. Doll and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-10-30 with Technology & Engineering categories.
Piezoresistor Design and Applications provides an overview of these MEMS devices and related physics. The text demonstrates how MEMS allows miniaturization and integration of sensing as well as efficient packaging and signal conditioning. This text for engineers working in MEMS design describes the piezoresistive phenomenon and optimization in several applications. Includes detailed discussion of such topics as; coupled models of mechanics, materials and electronic behavior in a variety of common geometric implementations including strain gages, beam bending, and membrane loading. The text concludes with an up-to-date discussion of the need for integrated MEMS design and opportunities to leverage new materials, processes and MEMS technology. Piezoresistor Design and Applications is an ideal book for design engineers, process engineers and researchers.
Modelling Simulation Performance Evaluation And Optimization Of Mems In The Context Of Physiological Pressure Measurement
DOWNLOAD
Author : Dr. Mohd. Zafar Shaikh
language : en
Publisher: Lulu.com
Release Date :
Modelling Simulation Performance Evaluation And Optimization Of Mems In The Context Of Physiological Pressure Measurement written by Dr. Mohd. Zafar Shaikh and has been published by Lulu.com this book supported file pdf, txt, epub, kindle and other format this book has been release on with categories.
High Resolution Manufacturing From 2d To 3d 4d Printing
DOWNLOAD
Author : Simone Luigi Marasso
language : en
Publisher: Springer Nature
Release Date : 2022-10-14
High Resolution Manufacturing From 2d To 3d 4d Printing written by Simone Luigi Marasso and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-10-14 with Technology & Engineering categories.
This book provides a comprehensive presentation of the most frequently used high resolution manufacturing techniques available, as well as the polymeric materials used for each of the techniques. Divided into two parts covering the technologies and materials used and the impact on different research fields and case studies, High Resolution Manufacturing from 2D to 3D/4D Printing: Applications in Engineering and Medicine addresses issues like throughput improvement by volumetric 3D printing and presenting novel applications and case studies. In addition, this book also covers the latest breakthrough developments and innovations to help readers understand the future applications of this technology across various disciplines, including biomedicine, electronics, energy, and photonics.
Modelling And Optimization Of Piezoresistive Pressure Sensors
DOWNLOAD
Author : Michal Olszacki
language : en
Publisher:
Release Date : 2009
Modelling And Optimization Of Piezoresistive Pressure Sensors written by Michal Olszacki and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009 with categories.
Since 1954, when the piezoresistive effect in semiconductors was discovered, the approach to the pressure measurement has changed dramatically and new devices with outstanding performances have appeared on the market. Along with the development of microtechnologies for integrated circuits, a new branch of MEMS called devices have stormed our world. One of the biggest branches of today's microsystems are pressure transducers which use the synergy of the piezoresistivity phenomenon and microfabrication technologies. While the main idea of strain gauge-based pressure measurement has not changed over the last few decades, there has been always a need to develop the design methodology that allows the designer to deliver the optimized product in the shortest possible time at the lowest possible cost. Thus, a lot of work has been done in the field in order to create tools and develop the FTR (first time right) methodology. Obviously, the design of the device that best fulfills the project requirements needs an appropriate simulation that have to be performed at the highest possible details level. Such an approach requires the detailed model of the device and, in case of its high complexity, a lot of computing power. Although over the last decade the most popular approach is the FEM analysis, there are some bottlenecks in such an approach like the difficulty of the implanted layers modeling where the doping profile shape has to be taken into account especially in the coupled electromechanical analysis. In this thesis, we try to present the methodology of the pressure sensor design which uses the analytical model of such a sensor that takes into consideration the nonuniform doping profile of the strain gauge, deals with the basic membrane shapes as well as with thermal and noise issues. The model, despite its limitations in comparison to the FEM one, gives trustworthy results which may be used for the reliable pressure sensor design in an extremely short time. In order to be quantitative, the analysis showing the drawbacks and advantages of the presented method in comparison to the FEM analysis using specialized tools like ANSYS ® and SILVACO-ATHENA® packages is also presented. Then, the model is used in a multi-objective optimization procedure that semi-automatically generates the design of a sensor, taking into account project requirements and constraints. At the end, the statistical analysis that may be helpful to estimate the production yield is performed. All three steps are included in the dedicated design and optimization tool created in a MATLAB ® environment and successfully tested. In the last section, the experimental results of fabricated samples are compared to those obtained by the developed tool.
Mems Nems
DOWNLOAD
Author : Cornelius T. Leondes
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-10-08
Mems Nems written by Cornelius T. Leondes and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-10-08 with Technology & Engineering categories.
This significant and uniquely comprehensive five-volume reference is a valuable source for research workers, practitioners, computer scientists, students, and technologists. It covers all of the major topics within the subject and offers a comprehensive treatment of MEMS design, fabrication techniques, and manufacturing methods. It also includes current medical applications of MEMS technology and provides applications of MEMS to opto-electronic devices. It is clearly written, self-contained, and accessible, with helpful standard features including an introduction, summary, extensive figures and design examples with comprehensive reference lists.
A Hand Book On Fabrication Aspects On Mems Based Pressure Sensors
DOWNLOAD
Author : Parvej Ahmad Alvi
language : en
Publisher: LAP Lambert Academic Publishing
Release Date : 2012-05
A Hand Book On Fabrication Aspects On Mems Based Pressure Sensors written by Parvej Ahmad Alvi and has been published by LAP Lambert Academic Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-05 with categories.
This book is designed as an introduction for the graduate students and researchers who want to understand the trends of MEMS materials and devices. Particularly, this book describes the experimental view of the fabrication of a thin membrane over a conical V-shaped cavity using front side lateral etching technology that proposes a novel front side etching fabrication process for silicon based piezoresistive micro- pressure sensor. As far as the fabrication process is concerned, this technique successfully accomplished a front side etching process laterally to replace the conventional back-side bulk micro-machining. This novel structure of micro pressure sensor can achieve the distinguishing features of the chip size reduction and fabrication costs degradation. This book covers the principles, tools and methods for determining the reliability of micro-electro-mechanical (MEMS)materials, components and devices. Hopefully, this book will be very beneficial to the students of MEMS and NEMS courses.
Design And Fabrication Of A Mems Passive Pressure Sensor
DOWNLOAD
Author : Penglai Li
language : en
Publisher:
Release Date : 2006
Design And Fabrication Of A Mems Passive Pressure Sensor written by Penglai Li and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006 with categories.
Micro-ElectroMechanical Systems is an inter-disciplinary technology field that has seen considerable growth over the years. It utilizes conventional semiconductor fabrication process flow as well as novel micro-fabrication techniques to create highly integrated ElectroMechanical systems such as sensors, actuators, switches, pumps and other devices with a wide range of industrial applications. By providing the capability of creating System-On-A-Chip, MEMS technology offers the prospect of highly sophisticated and integrated systems that are very low cost. The purpose of this project is to design, fabricate, and test a MEMS based, passive pressure sensor as a proof of concept targeted at possible remote sensing applications. For the targeted applications, purely passive sensor is a better alternative to sensors involving active circuitry, since it removes much of the design complexities from the sensor, and no battery is needed. Information such as technology selection, analysis of the sensor's response to pressure, and detailed fabrication process flow will be presented. Results from laboratory testing will also be presented.
Novel Mems Pressure And Temperature Sensors Fabricated On Optical Fibers
DOWNLOAD
Author :
language : en
Publisher:
Release Date : 2001
Novel Mems Pressure And Temperature Sensors Fabricated On Optical Fibers written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with categories.
This thesis presents the design, fabrication, and testing of novel MEMS pressure and temperature sensors fabricated on optical fiber end faces. A simple micromachining process compatible with MEMS was developed in fabricating sensors directly on optical fibers. The pressure sensor configuration involves anodic bonding of a piece of an extremely thin silicon wafer onto the fiber end face over a cavity etched in the central portion of the fiber end face. Final device diameter is thus the same as that of the optical fiber. The temperature sensor is based on anodically bonding a thin piece of silicon onto the fiber end face. The pressure sensors were fabricated on 400 um diameter fibers while temperature sensors were fabricated on both 200 and 400 um diameter fibers. Pressure measurements were made over the 14 to 80 psi range while temperature measurements were made over the 23 to 300 Celcius range. Pressure sensor sensitivities of 0.1 mV/psi and 0.2 mV/psi were obtained. The pressure sensors were designed with cavity diameter d=150 um, and cavity depth h=0.640 um. Diaphragm thickness for the two sensors were t=7.1, and t=3.4 um. Higher sensitivity was achieved by design of a sensor with the thinner diaphragm. A sensor array fabrication effort demonstrated that our micromachining process could be extended to simultaneous processing of an array of fibers. The temperature sensor was fabricated by bonding 3.1 um thick silicon onto the fiber end face. An oxidant-resistant encapsulation scheme for the temperature sensor was proposed, namely aluminum coated silicon nitride (Al/Si3N4). The uncoated side of silicon was bonded to a fiber end face using the anodic bonding method. The measured values of kf=(lambda)-1x(dlambda/dT) for capped and uncapped sensors were kf=(7.5ł0.6)x10-5/Celcius, and kf=(7.2ł0.1)x10-5/Celcius respectively. The measured kf value for the uncapped sensor is equal to that which was determined using the published material properties for crystalline silicon (kf=7.9x10-5/Celcius) within measurement uncertainty. The micromachining process developed for micromachining fiber end faces along with the bonding of silicon to fiber end faces can be extended to fabrication of other MEMS based micro-optic devices where fiber optic interrogation is advantageous.
Poly Sige For Mems Above Cmos Sensors
DOWNLOAD
Author : Pilar Gonzalez Ruiz
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-07-17
Poly Sige For Mems Above Cmos Sensors written by Pilar Gonzalez Ruiz and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-07-17 with Technology & Engineering categories.
Polycrystalline SiGe has emerged as a promising MEMS (Microelectromechanical Systems) structural material since it provides the desired mechanical properties at lower temperatures compared to poly-Si, allowing the direct post-processing on top of CMOS. This CMOS-MEMS monolithic integration can lead to more compact MEMS with improved performance. The potential of poly-SiGe for MEMS above-aluminum-backend CMOS integration has already been demonstrated. However, aggressive interconnect scaling has led to the replacement of the traditional aluminum metallization by copper (Cu) metallization, due to its lower resistivity and improved reliability. Poly-SiGe for MEMS-above-CMOS sensors demonstrates the compatibility of poly-SiGe with post-processing above the advanced CMOS technology nodes through the successful fabrication of an integrated poly-SiGe piezoresistive pressure sensor, directly fabricated above 0.13 m Cu-backend CMOS. Furthermore, this book presents the first detailed investigation on the influence of deposition conditions, germanium content and doping concentration on the electrical and piezoresistive properties of boron-doped poly-SiGe. The development of a CMOS-compatible process flow, with special attention to the sealing method, is also described. Piezoresistive pressure sensors with different areas and piezoresistor designs were fabricated and tested. Together with the piezoresistive pressure sensors, also functional capacitive pressure sensors were successfully fabricated on the same wafer, proving the versatility of poly-SiGe for MEMS sensor applications. Finally, a detailed analysis of the MEMS processing impact on the underlying CMOS circuit is also presented.