Micro And Opto Electronic Materials And Structures Physical Design
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Micro And Opto Electronic Materials And Structures Physical Design
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Author : Ephraim Suhir
language : en
Publisher:
Release Date : 2007
Micro And Opto Electronic Materials And Structures Physical Design written by Ephraim Suhir and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007 with Microelectronics categories.
Micro And Opto Electronic Materials And Structures Physics Mechanics Design Reliability Packaging
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Author : Ephraim Suhir
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-05-26
Micro And Opto Electronic Materials And Structures Physics Mechanics Design Reliability Packaging written by Ephraim Suhir and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-05-26 with Technology & Engineering categories.
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Micro And Opto Electronic Materials And Structures
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Author : Ephraim Suhir
language : en
Publisher:
Release Date : 2007
Micro And Opto Electronic Materials And Structures written by Ephraim Suhir and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007 with categories.
Polymers In Organic Electronics
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Author : Sulaiman Khalifeh
language : en
Publisher: Elsevier
Release Date : 2020-04-01
Polymers In Organic Electronics written by Sulaiman Khalifeh and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-04-01 with Technology & Engineering categories.
Polymers in Organic Electronics: Polymer Selection for Electronic, Mechatronic, and Optoelectronic Systems provides readers with vital data, guidelines, and techniques for optimally designing organic electronic systems using novel polymers. The book classifies polymer families, types, complexes, composites, nanocomposites, compounds, and small molecules while also providing an introduction to the fundamental principles of polymers and electronics. Features information on concepts and optimized types of electronics and a classification system of electronic polymers, including piezoelectric and pyroelectric, optoelectronic, mechatronic, organic electronic complexes, and more. The book is designed to help readers select the optimized material for structuring their organic electronic system.Chapters discuss the most common properties of electronic polymers, methods of optimization, and polymeric-structured printed circuit boards. The polymeric structures of optoelectronics and photonics are covered and the book concludes with a chapter emphasizing the importance of polymeric structures for packaging of electronic devices. - Provides key identifying details on a range of polymers, micro-polymers, nano-polymers, resins, hydrocarbons, and oligomers - Covers the most common electrical, electronic, and optical properties of electronic polymers - Describes the underlying theories on the mechanics of polymer conductivity - Discusses polymeric structured printed circuit boards, including their rapid prototyping and optimizing their polymeric structures - Shows optimization methods for both polymeric structures of organic active electronic components and organic passive electronic components
Encyclopedia Of Packaging Materials Processes And Mechanics Set 1 Die Attach And Wafer Bonding Technology A 4 Volume Set
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Author :
language : en
Publisher: World Scientific
Release Date : 2019-08-27
Encyclopedia Of Packaging Materials Processes And Mechanics Set 1 Die Attach And Wafer Bonding Technology A 4 Volume Set written by and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-08-27 with Technology & Engineering categories.
Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories.The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications.
Extreme Environment Electronics
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Author : John D. Cressler
language : en
Publisher: CRC Press
Release Date : 2017-12-19
Extreme Environment Electronics written by John D. Cressler and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.
Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.
Handbook Of Solid State Diffusion Volume 2
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Author : Aloke Paul
language : en
Publisher: Elsevier
Release Date : 2017-04-13
Handbook Of Solid State Diffusion Volume 2 written by Aloke Paul and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-04-13 with Science categories.
Handbook of Solid State Diffusion, Volume 2: Diffusion Analysis in Material Applications covers the basic fundamentals, techniques, applications, and latest developments in the area of solid-state diffusion, offering a pedagogical understanding for students, academicians, and development engineers. Both experimental techniques and computational methods find equal importance in the second of this two volume set. Volume 2 covers practical issues on diffusion phenomena in bulk, thin film, and in nanomaterials. Diffusion related problems and analysis of methods in industrial applications, such as electronic industry, high temperature materials, nuclear materials, and superconductor materials are discussed. - Presents a handbook with a short mathematical background and detailed examples of concrete applications of the sophisticated methods of analysis - Enables readers to learn the basic concepts of experimental approaches and the computational methods involved in solid-state diffusion - Covers bulk, thin film, and nanomaterials - Introduces the problems and analysis in important materials systems in various applications - Collates contributions from academic and industrial problems from leading scientists involved in developing key concepts across the globe
Through Silicon Vias For 3d Integration
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Author : John Lau
language : en
Publisher: McGraw Hill Professional
Release Date : 2012-09-20
Through Silicon Vias For 3d Integration written by John Lau and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-09-20 with Technology & Engineering categories.
A comprehensive guide to TSV and other enabling technologies for 3D integration Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed. This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems. Coverage includes: Nanotechnology and 3D integration for the semiconductor industry TSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing TSVs: mechanical, thermal, and electrical behaviors Thin-wafer strength measurement Wafer thinning and thin-wafer handling Microbumping, assembly, and reliability Microbump electromigration Transient liquid-phase bonding: C2C, C2W, and W2W 2.5D IC integration with interposers 3D IC integration with interposers Thermal management of 3D IC integration 3D IC packaging
Moisture Sensitivity Of Plastic Packages Of Ic Devices
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Author : X.J. Fan
language : en
Publisher: Springer Science & Business Media
Release Date : 2010-07-23
Moisture Sensitivity Of Plastic Packages Of Ic Devices written by X.J. Fan and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-07-23 with Technology & Engineering categories.
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
Computational And Experimental Mechanics Of Advanced Materials
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Author : Vadim V. Silberschmidt
language : en
Publisher: Springer Science & Business Media
Release Date : 2009-11-24
Computational And Experimental Mechanics Of Advanced Materials written by Vadim V. Silberschmidt and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-11-24 with Technology & Engineering categories.
Advanced materials play a crucial role in modern engineering applications where they are often exposed to complex loading and environmental conditions. In many cases, new approaches are needed to characterise these materials and to model their behaviour. Such approaches should be calibrated and validated by specific experimental techniques, quantifying both microstructural features and respective mechanisms at various length scales. The book provides an overview of modern modelling tools and experimental methods that can be employed to analyse and estimate properties and performance of advanced materials. A special feature of the book is the analysis of case studies used to demonstrate the strategies of solving the real-life problems, in which the microstructure of materials directly affects their response to loading and/or environmental conditions. The reader will benefit from a detailed analysis of various methods as well as their implementation for dealing with various advanced materials.