Microelectronics Ii
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Microelectronics Ii
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Author :
language : en
Publisher:
Release Date : 1983
Microelectronics Ii written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1983 with Microelectronics categories.
Materials Science In Microelectronics Ii
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Author : Eugene Machlin
language : en
Publisher: Elsevier
Release Date : 2010-07-07
Materials Science In Microelectronics Ii written by Eugene Machlin and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-07-07 with Technology & Engineering categories.
The subject matter of thin-films – which play a key role in microelectronics – divides naturally into two headings: the processing / structure relationship, and the structure / properties relationship. Part II of 'Materials Science in Microelectronics' focuses on the latter of these relationships, examining the effect of structure on the following: •Electrical properties•Magnetic properties•Optical properties•Mechanical properties•Mass transport properties•Interface and junction properties•Defects and properties - Captures the importance of thin films to microelectronic development - Examines the cause / effect relationship of structure on thin film properties
Microelectronics Packaging Handbook
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Author : Rao Tummala
language : en
Publisher: Springer Science & Business Media
Release Date : 1997-01-31
Microelectronics Packaging Handbook written by Rao Tummala and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997-01-31 with Computers categories.
This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
Microelectronics Packaging Handbook
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Author : R.R. Tummala
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27
Microelectronics Packaging Handbook written by R.R. Tummala and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Computers categories.
Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
The Socio Economic Impact Of Microelectronics
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Author : J. Berting
language : en
Publisher: Elsevier
Release Date : 2013-10-22
The Socio Economic Impact Of Microelectronics written by J. Berting and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-10-22 with Technology & Engineering categories.
The Socio-Economic Impact of Microelectronics contains papers presented at an international conference on socio-economic problems and potentialities of the application of micro-electronics held in Zandvoort, the Netherlands, in September 1979. Organized into eight sections, this book begins with the technological evaluation of microelectronics. Subsequent sections focus on the social economic and political consequences of the widespread use of microelectronics; opportunities and problems for socialist countries brought about by microelectronics technology; effects of microelectronics on developing countries; as well as problems connected with industrial relations and organization of work. The influence of the technology on political/economic, epistemological, ethical/moral, and esthetic values and a broad concept of informatics introducing the notions of living and non-living environments as well as of human, non-human, constructed, natural, and abstract systems are explained. The last section contains the conclusions of the chairman of the conference on the application of microelectronics.
Microelectronic Interconnections And Assembly
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Author : G.G. Harman
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Microelectronic Interconnections And Assembly written by G.G. Harman and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.
Microcircuit Reliability Bibliography
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Author :
language : en
Publisher:
Release Date : 1974
Microcircuit Reliability Bibliography written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1974 with Integrated circuits categories.
Proceedings For The Second Workshop On Smart Power Power Integrated Circuits Technology And Applications
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Author :
language : en
Publisher:
Release Date : 1994
Proceedings For The Second Workshop On Smart Power Power Integrated Circuits Technology And Applications written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with Integrated circuits categories.
Microelectronics And Microsystems
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Author : Luigi Fortuna
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Microelectronics And Microsystems written by Luigi Fortuna and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
The book presents the best contributions, extracted from the theses written by the students who have attended the second edition of the Master in Microelectronics and Systems that has been organized by the Universita degli Studi di Catania and that has been held at the STMicroelectronics Company (Catania Site) from May 2000 to January 2001. In particular, the mentioned Master has been organized among the various ac tivities of the "Istituto Superiore di Catania per la Formazione di Eccellenza". The Institute is one of the Italian network of universities selected by MURST (Ministry University Research Scientific Technology). The first aim of tl;te Master in Microelectronics and Systems is to increase the skills of the students with the Laurea Degree in Physics or Electrical Engineering in the more advanced areas as VLSI system design, high-speed low-voltage low-power circuitS and RF systems. The second aim has been to involve in the educational program companies like STMicroelectronics, ACCENT and ITEL, interested in emergent microelectronics topics, to cooperate with the University in developing high-level research projects. Besides the tutorial activity during the teaching hours, provided by national and international researchers, a significant part of the School has been dedicated to the presentation of specific CAD tools and experiments in order to prepare the students to solve specific problems during the stage period and in the thesis work.
Metal Matrix Composites
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Author : J. Paulo Davim
language : en
Publisher: Walter de Gruyter GmbH & Co KG
Release Date : 2014-10-24
Metal Matrix Composites written by J. Paulo Davim and has been published by Walter de Gruyter GmbH & Co KG this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-10-24 with Technology & Engineering categories.
Metal Matrix Composites (MMC's) have found an increased use in various industries due to their special mechanical and physical properties. They are a composite material with at least two constituent parts, one being a metal and are made by dispersing a reinforcing material into a metal matrix. The markets are: telecommunications, automotive, power semiconductor, opto-electronics, military and aerospace, heavy transportation, space systems and satellites, medical, and industrial lighting. Applications within these markets include microwave, micro-electronic packaging, laser diode, HB-LED’s, and advanced radar.