Millimeter Wave Packaging And Module Technology Developments In Japan
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Millimeter Wave Packaging And Module Technology Developments In Japan
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Author :
language : en
Publisher:
Release Date : 1910
Millimeter Wave Packaging And Module Technology Developments In Japan written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1910 with categories.
This paper presents an overview of recent trends in millimeter-wave packaging and module technology development in Japan. For commercial millimeter-wave applications such as wireless radio links, wireless LANs, automotive radars and so on, packaging and module technologies with high performance and productivity are required. Ceramic-base packages up to W-band, flip-chip bonding and packaging of CPW MMICs for low cost and high reproducible assembling, and extremely compact multi-layer HTCC transmitter/receiver MCMs for 60GHz band communications, have been developed.
Millimeter Wave Ic Packaging Technology State Of The Art And Future Trends
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Author :
language : en
Publisher:
Release Date : 2000
Millimeter Wave Ic Packaging Technology State Of The Art And Future Trends written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with categories.
This paper presents an overview of recent state of the art technologies and future trends in millimeter-wave MMIC packaging in the aspects of low cost, high productivity and high functionality. Developments of ceramic packages up to W-band have been progressed by design innovation. LTCC Technology with thick film printing has realized low-cost packages and 60GHz-band antenna integrated MCMs. Multi-junctional integrated modules have been proposed utilizing Si micromachining technologies.
Microwave And Millimeter Wave Electronic Packaging
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Author : Rick Sturdivant
language : en
Publisher: Artech House
Release Date : 2013-12-01
Microwave And Millimeter Wave Electronic Packaging written by Rick Sturdivant and has been published by Artech House this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-12-01 with Technology & Engineering categories.
Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. This resource presents you with the electronic packaging issues unique to microwave and millimeter-wave frequencies and reviews lower frequency packaging techniques so they can be adapted to higher frequency designs. You are provided with 30 practical examples throughout the book, as well as three free downloadable software analysis programs.
Advanced Millimeter Wave Technologies
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Author : Duixian Liu
language : en
Publisher: John Wiley & Sons
Release Date : 2009-04-06
Advanced Millimeter Wave Technologies written by Duixian Liu and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-04-06 with Technology & Engineering categories.
This book explains one of the hottest topics in wireless and electronic devices community, namely the wireless communication at mmWave frequencies, especially at the 60 GHz ISM band. It provides the reader with knowledge and techniques for mmWave antenna design, evaluation, antenna and chip packaging. Addresses practical engineering issues such as RF material evaluation and selection, antenna and packaging requirements, manufacturing tolerances, antenna and system interconnections, and antenna One of the first books to discuss the emerging research and application areas, particularly chip packages with integrated antennas, wafer scale mmWave phased arrays and imaging Contains a good number of case studies to aid understanding Provides the antenna and packaging technologies for the latest and emerging applications with the emphases on antenna integrations for practical applications such as wireless USB, wireless video, phase array, automobile collision avoidance radar, and imaging
Systems Level Packaging For Millimeter Wave Transceivers
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Author : MLADEN. BOZANIC
language : en
Publisher: Springer
Release Date : 2019-06-04
Systems Level Packaging For Millimeter Wave Transceivers written by MLADEN. BOZANIC and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-06-04 with categories.
2000 International Symposium On Microelectronics
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Author :
language : en
Publisher:
Release Date : 2000
2000 International Symposium On Microelectronics written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Electronic ceramics categories.
This text constitutes proceedings from the International Symposium on Microelectronics that took place in Boston, Massachusetts in September, 2000.
Antenna In Package Technology And Applications
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Author : Duixian Liu
language : en
Publisher: John Wiley & Sons
Release Date : 2020-03-31
Antenna In Package Technology And Applications written by Duixian Liu and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-03-31 with Technology & Engineering categories.
A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
Proceedings Of The International Symposium On Microelectronics
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Author :
language : en
Publisher:
Release Date : 2002
Proceedings Of The International Symposium On Microelectronics written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Hybrid integrated circuits categories.
Advances In Imaging And Electron Physics
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Author :
language : en
Publisher: Academic Press
Release Date : 2012-11-01
Advances In Imaging And Electron Physics written by and has been published by Academic Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-11-01 with Technology & Engineering categories.
Advances in Imaging and Electron Physics merges two long-running serials--Advances in Electronics and Electron Physics and Advances in Optical and Electron Microscopy. This series features extended articles on the physics of electron devices (especially semiconductor devices), particle optics at high and low energies, microlithography, image science and digital image processing, electromagnetic wave propagation, electron microscopy, and the computing methods used in all these domains. Contributions from leading authorities Informs and updates on all the latest developments in the field
Advanced Organics For Electronic Substrates And Packages
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Author : Andrew E Fletcher
language : en
Publisher: Elsevier
Release Date : 2013-10-22
Advanced Organics For Electronic Substrates And Packages written by Andrew E Fletcher and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-10-22 with Science categories.
Advanced Organics for Electronic Substrates and Packages provides information on packaging, which is one of the most technologically intensive activities in the electronics industry. The electronics packaging community has realized that while semiconductor devices continue to be improved upon for performance, cost, and reliability, it is the interconnection or packaging of these devices that will limit the performance of the systems. Technology must develop packaging for transistor chips, with high levels of performance and integration providing cooling, power, and interconnection, and yet preserve the performance of the semiconductors with minimum package delay to the system. Trends in each of the major packaging technologies include chip level connection, providing the required connections between the chip and the semiconductor package. The power distribution to the chip and heat removal from the chip; first level packages providing all the necessary wiring; interconnections and power distribution; first-to-second level interconnections; and second level packages providing all the necessary wiring, connections, power distribution, and power supply connection are included as well. This book is a useful and informative reference to students or individuals studying or conducting research within the field of electronic engineering.