Modeling And Simulation For Signal And Power Integrity Of Electronic Packages
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Modeling And Simulation For Signal And Power Integrity Of Electronic Packages
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Author : Jae Young Choi
language : en
Publisher:
Release Date : 2012
Modeling And Simulation For Signal And Power Integrity Of Electronic Packages written by Jae Young Choi and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012 with Electronic packaging categories.
The objective of this dissertation is to develop electrical modeling and co-simulation methodologies for signal and power integrity of package and board applications. The dissertation includes 1) the application of the finite element method to the optimization for decoupling capacitor selection and placement on a power delivery network (PDN), 2) the development of a PDN modeling method effective for multidimensional and multilayer geometries, 3) the analysis and modeling of return path discontinuities (RPDs), and 4) the implementation of the absorbing boundary condition for PDN modeling.\r : \r : The optimization technique for selection and placement of decoupling capacitors uses a genetic algorithm (GA) and the multilayer finite element method (MFEM), a PDN modeling method using FEM. The GA is customized for the decoupling problem to enhance the convergence speed of the optimization. The mathematical modifications necessary for the incorporation of the capacitor model into MFEM is also presented. \r : \r : The main contribution of this dissertation is the development of a new modeling method, the multilayer triangular element method (MTEM), for power/ground planes of a PDN. MTEM creates a surface mesh on each plane-pair using dual graphs; a non-uniform triangular mesh (Delaunay triangulation) and its orthogonal counterpart (Voronoi diagram), to which electromagnetic and equivalent circuit concepts are applied. The non-uniform triangulation is especially efficient for discretizing multidimensional and irregular geometries which are common in package and board PDNs. Moreover, MTEM generates a sparse, banded, and symmetric system matrix, which enables efficient computations. For a given plane-pair, MTEM extracts an equivalent circuit that is consistent with the physics-based planar-circuit model of a plane-pair. Thus, the values of the lumped elements can be simply calculated from the physical parameters, such as material properties and mesh geometries of each unit-cell. Consequently, the modeling of MTEM is flexible and easy to modify for further extensions, such as the incorporation of external circuits, e.g. decoupling capacitors and vertical interconnects.\r : \r : Power and ground planes provide paths for the return current of signal traces. Typically, planes have discontinuities such as via holes, plane cutouts, and split planes that disturb flow of signal return currents. At the discontinuity, return currents have to detour or switch to different layers, causing signal and power integrity problems. Therefore, a separate analysis of signal interconnects will neglect the significant coupling with a PDN, and the result will not be reliable. In this dissertation, the co-simulation of the signal and power integrity is presented focusing on the modeling of RPDs created by split planes, apertures, and vias. \r : \r : Plane resonance is one of the main sources of power integrity problems in package and board PDNs. A number of techniques have been developed and published in literature to reduce or prevent the resonance of a plane-pair. One of the techniques is to surround plane-pair edges with absorbing material that effectively damps the outgoing parallel-plate wave and minimizes the reflection. To model this behavior, the boundary condition of MTEM needs to be changed from its original form, the open-circuit boundary condition. In this dissertation, the application of the 1st order absorbing boundary condition to MTEM is presented.
Power Integrity Modeling And Design For Semiconductors And Systems
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Author : Madhavan Swaminathan
language : en
Publisher: Pearson Education
Release Date : 2007-11-19
Power Integrity Modeling And Design For Semiconductors And Systems written by Madhavan Swaminathan and has been published by Pearson Education this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-11-19 with Technology & Engineering categories.
The First Comprehensive, Example-Rich Guide to Power Integrity Modeling Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art. Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise. The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications. The authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.
Electrical Modeling And Design For 3d System Integration
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Author : Er-Ping Li
language : en
Publisher: John Wiley & Sons
Release Date : 2012-03-19
Electrical Modeling And Design For 3d System Integration written by Er-Ping Li and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-03-19 with Technology & Engineering categories.
New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.
Semiconductor Modeling
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Author : Roy Leventhal
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-01-10
Semiconductor Modeling written by Roy Leventhal and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-01-10 with Technology & Engineering categories.
Discusses process variation, model accuracy, design flow and many other practical engineering, reliability and manufacturing issues Gives a good overview for a person who is not an expert in modeling and simulation, enabling them to extract the necessary information to competently use modeling and simulation programs Written for engineering students and product design engineers
Digital Signal Integrity
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Author : Brian Young
language : en
Publisher: Prentice Hall
Release Date : 2001
Digital Signal Integrity written by Brian Young and has been published by Prentice Hall this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Computers categories.
State-of-the-art techniques for predicting and achieving target performance levels Theory, practice, general signal integrity issues, and leading-edge experimental techniques Model and simulate high-speed digital systems for maximum performance Maximizing the performance of digital systems means optimizing their high-speed interconnections. Digital Signal Integrity gives engineers all the theory and practical methods they need to accurately model and simulate those interconnections and predict real-world performance. Whether you're modeling microprocessors, memories, DSPs, or ASICs, these techniques will get you to market faster with greater reliability. Coverage includes: In-depth reviews of inductance, capacitance, resistance, single and multiconductor transmission lines, generalized termination schemes, crosstalk, differential signaling, and other modeling/simulation issues Multiconductor interconnects: packages, sockets, connectors and buses Modal decomposition: understanding the outputs generated by commercial modeling software Layer peeling with time-domain reflectometry: its power and limitations Experimental techniques for characterizing interconnect parasitics In Digital Signal Integrity, Motorola senior engineer Brian Young presents broad coverage of modeling from data obtained through electromagnetic simulation, transmission line theory, frequency and time-domain modeling, analog circuit simulation, digital signaling, and architecture. Young offers a strong mathematical foundation for every technique, as well as over 100 end-of-chapter problems. If you're stretching the performance envelope, you must be able to rely on your models and simulations. With this book, you can.
Power Integrity For I O Interfaces
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Author : Vishram S. Pandit
language : en
Publisher: Pearson Education
Release Date : 2010-10-13
Power Integrity For I O Interfaces written by Vishram S. Pandit and has been published by Pearson Education this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-10-13 with Technology & Engineering categories.
Foreword by Joungho Kim The Hands-On Guide to Power Integrity in Advanced Applications, from Three Industry Experts In this book, three industry experts introduce state-of-the-art power integrity design techniques for today’s most advanced digital systems, with real-life, system-level examples. They introduce a powerful approach to unifying power and signal integrity design that can identify signal impediments earlier, reducing cost and improving reliability. After introducing high-speed, single-ended and differential I/O interfaces, the authors describe on-chip, package, and PCB power distribution networks (PDNs) and signal networks, carefully reviewing their interactions. Next, they walk through end-to-end PDN and signal network design in frequency domain, addressing crucial parameters such as self and transfer impedance. They thoroughly address modeling and characterization of on-chip components of PDNs and signal networks, evaluation of power-to-signal coupling coefficients, analysis of Simultaneous Switching Output (SSO) noise, and many other topics. Coverage includes The exponentially growing challenge of I/O power integrity in high-speed digital systems PDN noise analysis and its timing impact for single-ended and differential interfaces Concurrent design and co-simulation techniques for evaluating all power integrity effects on signal integrity Time domain gauges for designing and optimizing components and systems Power/signal integrity interaction mechanisms, including power noise coupling onto signal trace and noise amplification through signal resonance Performance impact due to Inter Symbol Interference (ISI), crosstalk, and SSO noise, as well as their interactions Validation techniques, including low impedance VNA measurements, power noise measurements, and characterization of power-to-signal coupling effects Power Integrity for I/O Interfaces will be an indispensable resource for everyone concerned with power integrity in cutting-edge digital designs, including system design and hardware engineers, signal and power integrity engineers, graduate students, and researchers.
Signal And Power Integrity Simplified
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Author : Eric Bogatin
language : en
Publisher: Pearson Education
Release Date : 2009-07-13
Signal And Power Integrity Simplified written by Eric Bogatin and has been published by Pearson Education this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-07-13 with Technology & Engineering categories.
The #1 Practical Guide to Signal Integrity Design—Now Updated with Extensive New Coverage! This book brings together up-to-the-minute techniques for finding, fixing, and avoiding signal integrity problems in your design. Drawing on his work teaching more than five thousand engineers, world-class signal and power integrity expert Eric Bogatin systematically reviews the root causes of all six families of signal integrity problems and shows how to design them out early in the design cycle. This edition’s extensive new content includes a brand-new chapter on S-parameters in signal integrity applications, and another on power integrity and power distribution network design—topics at the forefront of contemporary electronics design. Coverage includes A fully up-to-date introduction to signal integrity and physical design How design and technology selection can make or break the performance of the power distribution network Exploration of key concepts, such as plane impedance, spreading inductance, decoupling capacitors, and capacitor loop inductance Practical techniques for analyzing resistance, capacitance, inductance, and impedance Solving signal integrity problems via rules of thumb, analytic approximation, numerical simulation, and measurement Understanding how interconnect physical design impacts signal integrity Managing differential pairs and losses Harnessing the full power of S-parameters in high-speed serial link applications Ensuring power integrity throughout the entire power distribution path Realistic design guidelines for improving signal integrity, and much more Unlike books that concentrate on theoretical derivation and mathematical rigor, this book emphasizes intuitive understanding, practical tools, and engineering discipline. Designed for electronics industry professionals from beginners to experts it will be an invaluable resource for getting signal integrity designs right the first time, every time.
High Speed Signaling
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Author : Kyung Suk (Dan) Oh
language : en
Publisher: Prentice Hall
Release Date : 2011-10-07
High Speed Signaling written by Kyung Suk (Dan) Oh and has been published by Prentice Hall this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-10-07 with Technology & Engineering categories.
New System-Level Techniques for Optimizing Signal/Power Integrity in High-Speed Interfaces--from Pioneering Innovators at Rambus, Stanford, Berkeley, and MIT As data communication rates accelerate well into the multi-gigahertz range, ensuring signal integrity both on- and off-chip has become crucial. Signal integrity can no longer be addressed solely through improvements in package or board-level design: Diverse engineering teams must work together closely from the earliest design stages to identify the best system-level solutions. In High-Speed Signaling, several of the field’s most respected practitioners and researchers introduce cutting-edge modeling, simulation, and optimization techniques for meeting this challenge. Edited by pioneering experts Drs. Dan Oh and Chuck Yuan, these contributors explain why noise and jitter are no longer separable, demonstrate how to model their increasingly complex interactions, and thoroughly introduce a new simulation methodology for predicting link-level performance with unprecedented accuracy. The authors address signal integrity from architecture through high-volume production, thoroughly discussing design, implementation, and verification. Coverage includes New advances in passive-channel modeling, power-supply noise and jitter modeling, and system margin prediction Methodologies for balancing system voltage and timing budgets to improve system robustness in high-volume manufacturing Practical, stable formulae for converting key network parameters Improved solutions for difficult problems in the broadband modeling of interconnects Equalization techniques for optimizing channel performance Important new insights into the relationships between jitter and clocking topologies New on-chip measurement techniques for in-situ link performance testing Trends and future directions in signal integrity engineering High-Speed Signaling thoroughly introduces new techniques pioneered at Rambus and other leading high-tech companies and universities: approaches that have never before been presented with this much practical detail. It will be invaluable to everyone concerned with signal integrity, including signal and power integrity engineers, high-speed I/O circuit designers, and system-level board design engineers.
Power Integrity Modeling And Design For Semiconductors And Systems
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Author : Madhavan Swaminathan
language : en
Publisher:
Release Date : 2007
Power Integrity Modeling And Design For Semiconductors And Systems written by Madhavan Swaminathan and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007 with Integrated circuits categories.
The First Comprehensive, Example-Rich Guide to Power Integrity Modeling Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art. Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise. The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications. The authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.
2016 Ieee 20th Workshop On Signal And Power Integrity Spi
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Author :
language : en
Publisher:
Release Date : 2016
2016 Ieee 20th Workshop On Signal And Power Integrity Spi written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016 with Interconnects (Integrated circuit technology) categories.