Monolithic 3d Advantage

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Monolithic 3d Advantage

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Author :
language : en
Publisher: Iulia Tomut
Release Date :

Monolithic 3d Advantage written by and has been published by Iulia Tomut this book supported file pdf, txt, epub, kindle and other format this book has been release on with categories.

Monolithic 3d In General

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language : en
Publisher: Iulia Tomut
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Monolithic 3d In General written by and has been published by Iulia Tomut this book supported file pdf, txt, epub, kindle and other format this book has been release on with categories.

Chips 2020 Vol 2

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Author : Bernd Höfflinger
language : en
Publisher: Springer
Release Date : 2015-09-19

Chips 2020 Vol 2 written by Bernd Höfflinger and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-09-19 with Science categories.

The release of this second volume of CHIPS 2020 coincides with the 50th anniversary of Moore’s Law, a critical year marked by the end of the nanometer roadmap and by a significantly reduced annual rise in chip performance. At the same time, we are witnessing a data explosion in the Internet, which is consuming 40% more electrical power every year, leading to fears of a major blackout of the Internet by 2020. The messages of the first CHIPS 2020, published in 2012, concerned the realization of quantum steps for improving the energy efficiency of all chip functions. With this second volume, we review these messages and amplify upon the most promising directions: ultra-low-voltage electronics, nanoscale monolithic 3D integration, relevant-data, brain- and human-vision-inspired processing, and energy harvesting for chip autonomy. The team of authors, enlarged by more world leaders in low-power, monolithic 3D, video, and Silicon brains, presents new vistas in nanoelectronics, promising Moore-like exponential growth sustainable through to the 2030s.

Nano Chips 2030

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Author : Boris Murmann
language : en
Publisher: Springer Nature
Release Date : 2020-06-08

Nano Chips 2030 written by Boris Murmann and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-06-08 with Science categories.

In this book, a global team of experts from academia, research institutes and industry presents their vision on how new nano-chip architectures will enable the performance and energy efficiency needed for AI-driven advancements in autonomous mobility, healthcare, and man-machine cooperation. Recent reviews of the status quo, as presented in CHIPS 2020 (Springer), have prompted the need for an urgent reassessment of opportunities in nanoelectronic information technology. As such, this book explores the foundations of a new era in nanoelectronics that will drive progress in intelligent chip systems for energy-efficient information technology, on-chip deep learning for data analytics, and quantum computing. Given its scope, this book provides a timely compendium that hopes to inspire and shape the future of nanoelectronics in the decades to come.

Monolithic 3d Integration Of Single Grain Silicon Tfts

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Author : M.R. Tajari Mofrad
language : en
Publisher:
Release Date : 2012

Monolithic 3d Integration Of Single Grain Silicon Tfts written by M.R. Tajari Mofrad and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012 with categories.

Embedded Cooling Of Electronic Devices Conduction Evaporation And Single And Two Phase Convection

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Author : Madhusudan Iyengar
language : en
Publisher: World Scientific
Release Date : 2024-01-10

Embedded Cooling Of Electronic Devices Conduction Evaporation And Single And Two Phase Convection written by Madhusudan Iyengar and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-01-10 with Technology & Engineering categories.

This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.

Physical Design For 3d Integrated Circuits

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Author : Aida Todri-Sanial
language : en
Publisher: CRC Press
Release Date : 2017-12-19

Physical Design For 3d Integrated Circuits written by Aida Todri-Sanial and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.

Handbook Of 3d Integration Volume 4

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Author : Paul D. Franzon
language : en
Publisher: John Wiley & Sons
Release Date : 2019-01-25

Handbook Of 3d Integration Volume 4 written by Paul D. Franzon and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-01-25 with Technology & Engineering categories.

This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.

Cmosetr 2015 Vol 6 Materials Track

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Author : CMOS Emerging Technologies Research
language : en
Publisher: CMOS Emerging Technologies Research
Release Date : 2015-05-22

Cmosetr 2015 Vol 6 Materials Track written by CMOS Emerging Technologies Research and has been published by CMOS Emerging Technologies Research this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-05-22 with categories.

Presentation slides for the Materials track at CMOSETR 2015, May 20-22, 2015.

Monolithic 3d Ics

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Author :
language : en
Publisher: Iulia Tomut
Release Date :

Monolithic 3d Ics written by and has been published by Iulia Tomut this book supported file pdf, txt, epub, kindle and other format this book has been release on with categories.