More Than Moore 2 5d And 3d Sip Integration
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More Than Moore 2 5d And 3d Sip Integration
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Author : Riko Radojcic
language : en
Publisher: Springer
Release Date : 2017-02-08
More Than Moore 2 5d And 3d Sip Integration written by Riko Radojcic and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-02-08 with Technology & Engineering categories.
This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore’s Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product.
Flip Chip Technologies
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Author : John H. Lau
language : en
Publisher: McGraw-Hill Professional Publishing
Release Date : 1996
Flip Chip Technologies written by John H. Lau and has been published by McGraw-Hill Professional Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with Technology & Engineering categories.
A guide to flip chip technologies, for professionals in flip chip and MCM research and development, and for engineers and technical managers choosing design and manufacturing processes for electronic packaging and interconnect systems. Discusses economic, design, material, quality, and reliability issues of flip chip technologies, and details aspects of classical solder-bumped flip chip interconnect technologies; the next generations of flip chip technologies; and known-good-die testing for multiple module applications. Annotation copyright by Book News, Inc., Portland, OR
Materials For Advanced Packaging
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Author : Daniel Lu
language : en
Publisher: Springer
Release Date : 2016-11-18
Materials For Advanced Packaging written by Daniel Lu and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-11-18 with Technology & Engineering categories.
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
The Nuclear Many Body Problem
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Author : Peter Ring
language : en
Publisher: Springer Science & Business Media
Release Date : 2004-03-25
The Nuclear Many Body Problem written by Peter Ring and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-03-25 with Health & Fitness categories.
Study Edition
Silicon
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Author : Paul Siffert
language : en
Publisher: Springer Science & Business Media
Release Date : 2004-07-26
Silicon written by Paul Siffert and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-07-26 with Science categories.
With topics ranging from epitaxy through lattice defects and doping to quantum computation, this book provides a personalized survey of the development and use of silicon, the basis for the revolutionary changes in our lives sometimes called "The Silicon Age." Beginning with the very first developments more than 50 years ago, it reports on all aspects of silicon and silicon technology up to its use in exciting new technologies, including a glance at possible future developments. A team of expert authors, many of them pioneers in the field, have written informative and stimulating contributions that will be of interest to all scientists working with silicon.
Electronic Signatures In Law
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Author : Stephen Mason
language : en
Publisher: Cambridge University Press
Release Date : 2012-01-26
Electronic Signatures In Law written by Stephen Mason and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-01-26 with Business & Economics categories.
Using case law from multiple jurisdictions, Stephen Mason examines the nature and legal bearing of electronic signatures.
Heat Capacity And Thermal Expansion At Low Temperatures
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Author : T.H.K. Barron
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Heat Capacity And Thermal Expansion At Low Temperatures written by T.H.K. Barron and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Science categories.
The birth of this monograph is partly due to the persistent efforts of the General Editor, Dr. Klaus Timmerhaus, to persuade the authors that they encapsulate their forty or fifty years of struggle with the thermal properties of materials into a book before they either expired or became totally senile. We recognize his wisdom in wanting a monograph which includes the closely linked properties of heat capacity and thermal expansion, to which we have added a little 'cement' in the form of elastic moduli. There seems to be a dearth of practitioners in these areas, particularly among physics postgraduate students, sometimes temporarily alleviated when a new generation of exciting materials are found, be they heavy fermion compounds, high temperature superconductors, or fullerenes. And yet the needs of the space industry, telecommunications, energy conservation, astronomy, medical imaging, etc. , place demands for more data and understanding of these properties for all classes of materials - metals, polymers, glasses, ceramics, and mixtures thereof. There have been many useful books, including Specific Heats at Low Tempera tures by E. S. Raja Gopal (1966) in this Plenum Cryogenic Monograph Series, but few if any that covered these related topics in one book in a fashion designed to help the cryogenic engineer and cryophysicist. We hope that the introductory chapter will widen the horizons of many without a solid state background but with a general interest in physics and materials.
Robotic Systems
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Author : S.G. Tzafestas
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Robotic Systems written by S.G. Tzafestas and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
Robotics is a modern interdisciplinary field that has emerged from the marriage of computerized numerical control and remote manipulation. Today's robotic systems have intelligence features, and are able to perform dexterous and intelligent human-like actions through appropriate combination of learning, perception, planning, decision making and control. This book presents advanced concepts, techniques and applications reflecting the experience of a wide group of specialists in the field. Topics include: kinematics, dynamics, path planning and tracking, control, mobile robotics, navigation, robot programming, and sophisticated applications in the manufacturing, medical, and other areas.
Complex Computing Networks
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Author : Izzet Cem Göknar
language : en
Publisher: Springer Science & Business Media
Release Date : 2006-05-31
Complex Computing Networks written by Izzet Cem Göknar and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-05-31 with Science categories.
This book contains the ceremonials and the proceedings pertaining to the Int- national Symposium CCN2005 on “Complex Computing-Networks: A Link between Brain-like and Wave-Oriented Electrodynamics Algorithms,” convened at Do ?u ? University of Istanbul, Turkey, on 13–14 June 2005, in connection with the bestowal of the honorary doctorate degrees on Professors Leopold B. Felsen and Leon O. Chua, for their extraordinary achievements in electromagnetics, and n- linear systems, respectively. The symposium was co-organized by Cem Göknar and Levent Sevgi, in consultation with Leopold B. Felsen and Leon O. Chua. Istanbul is a city with wonderful natural and historical surroundings, a city not only interconnecting Asia and Europe but also Eastern and Western cultures. Therefore, CCN2005 was a memorable event not only in the lifetime of Drs. Felsen, Chua, and their families, but also for all the other participants who were there to congratulate the recipients and participate in the symposium.
Information Science And Applications
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Author : Kuinam J. Kim
language : en
Publisher: Springer
Release Date : 2019-12-19
Information Science And Applications written by Kuinam J. Kim and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-12-19 with Technology & Engineering categories.
This book presents selected papers from the 10th International Conference on Information Science and Applications (ICISA 2019), held on December 16–18, 2019, in Seoul, Korea, and provides a snapshot of the latest issues regarding technical convergence and convergences of security technologies. It explores how information science is at the core of most current research as well as industrial and commercial activities. The respective chapters cover a broad range of topics, including ubiquitous computing, networks and information systems, multimedia and visualization, middleware and operating systems, security and privacy, data mining and artificial intelligence, software engineering and web technology, as well as applications and problems related to technology convergence, which are reviewed and illustrated with the aid of case studies. Researchers in academia, industry, and at institutes focusing on information science and technology will gain a deeper understanding of the current state of the art in information strategies and technologies for convergence security.