Multiconductor Transmission Line Analysis For Board Level Digital Design
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Multiconductor Transmission Line Analysis For Board Level Digital Design
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Author : E. Maitre
language : en
Publisher:
Release Date : 1994
Multiconductor Transmission Line Analysis For Board Level Digital Design written by E. Maitre and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with Computer engineering categories.
The Electronic Packaging Handbook
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Author : Glenn R. Blackwell
language : en
Publisher: CRC Press
Release Date : 2017-12-19
The Electronic Packaging Handbook written by Glenn R. Blackwell and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.
The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
High Speed Circuit Board Signal Integrity Second Edition
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Author : Stephen C. Thierauf
language : en
Publisher: Artech House
Release Date : 2017-04-30
High Speed Circuit Board Signal Integrity Second Edition written by Stephen C. Thierauf and has been published by Artech House this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-04-30 with Technology & Engineering categories.
This thoroughly updated leading-edge circuit design resource offers the knowledge needed to quickly pinpoint transmission problems that can compromise the entire circuit design. This new edition demonstrates how to apply EM theory to solve signal integrity problems with a practical application-oriented approach. Discussing both design and debug issues at gigabit per second data rates, the book serves as a practical reference for projects involving high-speed serial signaling on printed wiring boards. Step-by-step, this book goes from reviewing the essentials of linear circuit theory, to examining practical issues of pulse propagation along lossless and lossy transmission lines. It provides detailed guidelines for crosstalk, attenuation, power supply decoupling, and layer stackup tradeoffs (including pad/antipad tradeoffs). Other key topics include the construction of etched conductors, analysis of return paths and split planes, microstrip and stripline characteristics, and SMT capacitors. Filled with on-the-job-proven examples, this hands-on reference is the book that engineers can turn to time and again to design out and troubleshoot circuit signal loss and impedance problems.
Compact Models And Measurement Techniques For High Speed Interconnects
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Author : Rohit Sharma
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-02-17
Compact Models And Measurement Techniques For High Speed Interconnects written by Rohit Sharma and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-02-17 with Technology & Engineering categories.
Compact Models and Measurement Techniques for High-Speed Interconnects provides detailed analysis of issues related to high-speed interconnects from the perspective of modeling approaches and measurement techniques. Particular focus is laid on the unified approach (variational method combined with the transverse transmission line technique) to develop efficient compact models for planar interconnects. This book will give a qualitative summary of the various reported modeling techniques and approaches and will help researchers and graduate students with deeper insights into interconnect models in particular and interconnect in general. Time domain and frequency domain measurement techniques and simulation methodology are also explained in this book.
Handbook Of Engineering Electromagnetics
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Author : Rajeev Bansal
language : en
Publisher: CRC Press
Release Date : 2004-09-01
Handbook Of Engineering Electromagnetics written by Rajeev Bansal and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-09-01 with Science categories.
Engineers do not have the time to wade through rigorously theoretical books when trying to solve a problem. Beginners lack the expertise required to understand highly specialized treatments of individual topics. This is especially problematic for a field as broad as electromagnetics, which propagates into many diverse engineering fields. The time h
Scientific And Technical Aerospace Reports
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Author :
language : en
Publisher:
Release Date : 1985
Scientific And Technical Aerospace Reports written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1985 with Aeronautics categories.
Power Integrity Modeling And Design For Semiconductors And Systems
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Author : Madhavan Swaminathan
language : en
Publisher: Pearson Education
Release Date : 2008
Power Integrity Modeling And Design For Semiconductors And Systems written by Madhavan Swaminathan and has been published by Pearson Education this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008 with Technology & Engineering categories.
Madhavan Swaminathanreceived his B.E. in Electronics and Communication from Regional Engineering College, Tiruchirapalli in 1985 and his M.S. and Ph.D. degrees in Electrical Engineering from Syracuse University in 1989 and 1991, respectively. He is currently the Joseph M. Pettit Professor in Electronics in the School of Electrical and Computer Engineering and Deputy Director of the Packaging Research Center, Georgia Tech. He is also the cofounder of Jacket Micro Devices, a company specializing in RF modules for wireless applications. Prior to joining Georgia Tech he was with IBM where he worked on packaging for super computers. His work on Power Integrity has won several awards and he was made an IEEE Fellow for his contributions in this area. Ege Enginreceived his B.S. and M.S. degrees in electrical engineering from Middle East Technical University, Ankara, Turkey, and from University of Paderborn, Germany. From 2001 to 2004 he was with the Fraunhofer-Institute for Reliability and Microintegration in Berlin. During this time he also received his Ph.D. from the University of Hannover, Germany. He is currently a Research Engineer in the School of Electrical and Computer Engineering and an Assistant Research Director of the Packaging Research Center at Georgia Tech. He has more than 40 publications in refereed journals and conferences in the areas of signal and power integrity modeling and simulation. The First Comprehensive, Example-Rich Guide to Power Integrity Modeling Professionals need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high-speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art. Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise. The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications. The authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain plane modeling, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for time- and frequency-domain analysis Introduce three leading time domain simulation methods: rational function methods, signal flow graphs, and MNA Present these and other advanced case studies: high-speed servers, high-speed differential signaling, chip package analysis, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that takes advantage of high-speed systems. During my (M.S) undergraduate days in a little town called Tiruchirapalli in Southern India, we used to have frequent voltage and current surges that knocked out all the electrical equipment such as fans and lights in our rooms. Frustrated, my friend once remarked, "We are Powerless to solve the Current problem." Of course, he meant this in jest, but little did I realize that this would become the theme of my research for many years. Though my area is on Semiconductors and computer system
Analysis Of Multiconductor Transmission Lines
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Author : Clayton R. Paul
language : en
Publisher: John Wiley & Sons
Release Date : 2007-10-26
Analysis Of Multiconductor Transmission Lines written by Clayton R. Paul and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-10-26 with Technology & Engineering categories.
The essential textbook for electrical engineering students and professionals-now in a valuable new edition The increasing use of high-speed digital technology requires that all electrical engineers have a working knowledge of transmission lines. However, because of the introduction of computer engineering courses into already-crowded four-year undergraduate programs, the transmission line courses in many electrical engineering programs have been relegated to a senior technical elective, if offered at all. Now, Analysis of Multiconductor Transmission Lines, Second Edition has been significantly updated and reorganized to fill the need for a structured course on transmission lines in a senior undergraduate- or graduate-level electrical engineering program. In this new edition, each broad analysis topic, e.g., per-unit-length parameters, frequency-domain analysis, time-domain analysis, and incident field excitation, now has a chapter concerning two-conductor lines followed immediately by a chapter on MTLs for that topic. This enables instructors to emphasize two-conductor lines or MTLs or both. In addition to the reorganization of the material, this Second Edition now contains important advancements in analysis methods that have developed since the previous edition, such as methods for achieving signal integrity (SI) in high-speed digital interconnects, the finite-difference, time-domain (FDTD) solution methods, and the time-domain to frequency-domain transformation (TDFD) method. Furthermore, the content of Chapters 8 and 9 on digital signal propagation and signal integrity application has been considerably expanded upon to reflect all of the vital information current and future designers of high-speed digital systems need to know.
The Software Encyclopedia 2001
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Author :
language : en
Publisher:
Release Date : 2001
The Software Encyclopedia 2001 written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Computer industry categories.
Science Abstracts
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Author :
language : en
Publisher:
Release Date : 1995
Science Abstracts written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995 with Electrical engineering categories.