Nanopackaging From Nanomaterials To The Atomic Scale
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Nanopackaging From Nanomaterials To The Atomic Scale
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Author : Xavier Baillin
language : en
Publisher: Springer
Release Date : 2015-08-06
Nanopackaging From Nanomaterials To The Atomic Scale written by Xavier Baillin and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-08-06 with Science categories.
This book is a first attempt to merge two different communities: scientists and technologists. Therefore, it is not a general overview covering all the fields of nanopackaging, but is mainly focused on two topics. The first topic deals with atomic scale devices or circuit requirements, as well as related recent technological developments; for example, surface science engineering and atomic scale interconnects studies. The second main part of the book brings CNT nano-materials solutions for resolving interconnect or thermal management problems in microelectronics device packaging. This book is not just useful for those who attended the International Workshop on Nanopackaging in Grenoble, but can provide valuable information to scientists and technologists in the nanopackaging community.
On Surface Atomic Wires And Logic Gates
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Author : Marek Kolmer
language : en
Publisher: Springer
Release Date : 2017-02-22
On Surface Atomic Wires And Logic Gates written by Marek Kolmer and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-02-22 with Science categories.
Written by leading international experts, this book summarizes the advances in sample preparation, design and construction of dangling bond atomic scale wires and logic gate circuits at the surface of a passivated semi-conductor. Individual chapters cover different aspects of the sample fabrication from research and development point of view, present design and construction as well as microscopic and spectroscopic characteristics of single dangling atomic wires and logic gates, and discuss the tools for design of large atomic scale circuit on a surface.This edited volume includes selected contributions from the “International Workshop on Atomic Wires” held in Krakow in September 2014 completed and updated with most current results up to mid-2016, and offers for the first time an overview of up-to-date knowledge in the burgeoning field of atomic scale circuits. The book will appeal to researchers and scholars interested in nanoscience and its various sub-fields including, in particular, molecular electronics, atomic scale electronics and nanoelectronics.
Nanopackaging
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Author : James E. Morris
language : en
Publisher: Springer
Release Date : 2018-09-22
Nanopackaging written by James E. Morris and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-09-22 with Technology & Engineering categories.
This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, applications of nanoparticles, graphene, carbon nanotubes and nanowires in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancement. Now in a widely extended second edition, Nanopackaging is an important reference for industrial and academic researchers, as well as practicing engineers seeking information about latest techniques. Twelve new chapters address carbon nanotubes and nanowires, fabrication and properties of graphene, graphene for thermal cooling of microelectronics and for electrical interconnections, packaging of post-CMOS nanoelectronics, environmental and health effects of nanopackaging technologies, and more. This book is an ideal reference for researchers, practicing engineers, and graduate students who are either entering the field for the first time, or are already conducting research and want to expand their knowledge in the field of nanopackaging.
Nanopackaging From Nanomaterials To The Atomic Scale
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Author : Xavier Baillin
language : en
Publisher:
Release Date : 2015
Nanopackaging From Nanomaterials To The Atomic Scale written by Xavier Baillin and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015 with categories.
This book is a first attempt to merge two different communities: scientists and technologists. Therefore, it is not a general overview covering all the fields of nanopackaging, but is mainly focused on two topics. The first topic deals with atomic scale devices or circuit requirements, as well as related recent technological developments; for example, surface science engineering and atomic scale interconnects studies. The second main part of the book brings CNT nano-materials solutions for resolving interconnect or thermal management problems in microelectronics device packaging. This book is not just useful for those who attended the International Workshop on Nanopackaging in Grenoble, but can provide valuable information to scientists and technologists in the nanopackaging community.
Molecular Architectonics
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Author : Takuji Ogawa
language : en
Publisher: Springer
Release Date : 2017-07-06
Molecular Architectonics written by Takuji Ogawa and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-07-06 with Science categories.
This book draws on the main themes covered during the International Workshop on Molecular Architectonics which took place in Shiretoko, Japan from August 3 to 6, 2015. The concepts and results explored in this book relate to the term “molecular architectonics” which stands for electronic, optical and information-processing functions being orchestrated by molecular assemblies. This area is defined as the third stage of single-molecule electronics and builds on stage one, where measurements were performed on single-molecule layered films, and stage two, the resulting quantitative analyses. In this work, experts come together to write about the most important aspects of molecular architectonics. This interdisciplinary, visionary and unique book is of interest to scientists working on electronic materials, surface science and information processing sciences using noise and fluctuation.
Materials For Advanced Packaging
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Author : Daniel Lu
language : en
Publisher: Springer
Release Date : 2016-11-18
Materials For Advanced Packaging written by Daniel Lu and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-11-18 with Technology & Engineering categories.
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Smart Nanocontainers
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Author : Phuong Nguyen Tri
language : en
Publisher: Elsevier
Release Date : 2019-11-08
Smart Nanocontainers written by Phuong Nguyen Tri and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-11-08 with Technology & Engineering categories.
Smart Nanocontainers explores the fundamental concepts and emerging applications of nanocontainers in biomedicine, pharmaceuticals and smart materials. In pharmaceuticals, nanocontainers have advantages over their micro-counterparts, including more efficient drug detoxification, higher intracellular uptake, better stability, less side effects and higher biocompatibility with tissue and cells. In materials science, such as coating technology, they help by making coatings smarter, stronger and more durable. This important reference will help anyone who wants to learn more on how nanocontainers are used to provide the controlled release of active agents, including their applications in smart coatings, corrosion, drug delivery, diagnosis, agri-food and gas storage. - Discusses how the molecular design of nanocarriers can be optimized to increase performance - Explores how nanocarriers are being used to produce a new generation of active coatings - Explains how nanocarriers are being used to deliver more effective nanoscale drug delivery
Nanotechnology In Electronics For Miniaturized Devices And Circuits
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Author : Ms. Priyanka
language : en
Publisher: RK Publication
Release Date : 2024-12-17
Nanotechnology In Electronics For Miniaturized Devices And Circuits written by Ms. Priyanka and has been published by RK Publication this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-12-17 with Technology & Engineering categories.
Nanotechnology in Electronics for Miniaturized Devices and Circuits the transformative impact of nanotechnology on electronic components, enabling ultra-compact, high-performance devices. This nanoscale materials, fabrication techniques, and emerging applications in transistors, memory storage, sensors, and quantum computing. It examines advancements in nanoelectronics, including carbon nanotubes, graphene-based circuits, and molecular electronics, highlighting their role in enhancing speed, efficiency, and energy consumption. With a focus on current research and future prospects, this serves as a comprehensive resource for students, researchers, and industry professionals navigating the rapidly evolving landscape of miniaturized electronic systems.
Peridynamic Modeling Numerical Techniques And Applications
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Author : Erkan Oterkus
language : en
Publisher: Elsevier
Release Date : 2021-04-24
Peridynamic Modeling Numerical Techniques And Applications written by Erkan Oterkus and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-04-24 with Technology & Engineering categories.
This book provides readers with an incisive look at cutting-edge peridynamic modeling methods, numerical techniques, their applications, and potential future directions for the field. It starts with an introductory chapter authored by Stewart Silling, who originally developed peridynamics. It then looks at new concepts in the field, with chapters covering dual-horizon peridynamics, peridynamics for axisymmetric analysis, beam and plate models in peridynamics, coupled peridynamics and XFEM, peridynamics for dynamic fracture modeling, and more. From there, it segues into coverage of cutting-edge applications of peridynamics, exploring its biological applications, modeling at the nanoscale, peridynamics for composites delamination and damage in ceramics, and more, concluding with a chapter on the application of artificial intelligence and machine learning in peridynamics. - Covers modeling methods, numerical techniques, applications, and future directions for the field - Discusses techniques such as dual-horizon peridynamics, damage modeling using the phase-field approach, and contact analysis of rigid and deformable bodies with refined non-ordinary state-based peridynamics - Looks at a range of different peridynamic applications such as ice modeling, fiber-reinforced composite modeling, modeling at nanoscale, and more
Fundamentals Of Device And Systems Packaging Technologies And Applications Second Edition
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Author : Rao Tummala
language : en
Publisher: McGraw Hill Professional
Release Date : 2019-11-20
Fundamentals Of Device And Systems Packaging Technologies And Applications Second Edition written by Rao Tummala and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-11-20 with Technology & Engineering categories.
A fully updated, comprehensive guide to electronic packaging technologies This thoroughly revised resource offers rigorous and complete coverage of microsystems packaging at both the device and system level. You will get in-depth guidance on the latest technologies from academic and industry leaders. New chapters cover topics highly relevant to today's small and ultra-small systems. Fundamentals of Microsystems Packaging, Second Edition, discusses the entire field, from wafer to systems, and clearly explains every major contributing technology. The book details emerging systems, including smart wearables, the Internet of Things, bioelectronics for medical applications, cloud computing, and much more. Microelectronics, photonics, MEMS, sensors, RF, and wireless technologies are fully covered. • Covers the electrical, mechanical, chemical, and materials aspects of each technology • Contains examples of all common configurations and technologies • Written by the leading author in the field