Parasitic Substrate Coupling In High Voltage Integrated Circuits
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Parasitic Substrate Coupling In High Voltage Integrated Circuits
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Author : Pietro Buccella
language : en
Publisher: Springer
Release Date : 2018-03-14
Parasitic Substrate Coupling In High Voltage Integrated Circuits written by Pietro Buccella and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-03-14 with Technology & Engineering categories.
This book introduces a new approach to model and predict substrate parasitic failures in integrated circuits with standard circuit design tools. The injection of majority and minority carriers in the substrate is a recurring problem in smart power ICs containing high voltage, high current switching devices besides sensitive control, protection and signal processing circuits. The injection of parasitic charges leads to the activation of substrate bipolar transistors. This book explores how these events can be evaluated for a wide range of circuit topologies. To this purpose, new generalized devices implemented in Verilog-A are used to model the substrate with standard circuit simulators. This approach was able to predict for the first time the activation of a latch-up in real circuits through post-layout SPICE simulation analysis. Discusses substrate modeling and circuit-level simulation of parasitic bipolar device coupling effects in integrated circuits; Includes circuit back-annotation of the parasitic lateral n-p-n and vertical p-n-p bipolar transistors in the substrate; Uses Spice for simulation and characterization of parasitic bipolar transistors, latch-up of the parasitic p-n-p-n structure, and electrostatic discharge (ESD) protection devices; Offers design guidelines to reduce couplings by adding specific protections.
Towards A Modeling Synthesis Of Two Or Three Dimensional Circuits Through Substrate Coupling And Interconnections Noises And Parasites
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Author : Christian Gontrand
language : en
Publisher: Bentham Science Publishers
Release Date : 2014-04-21
Towards A Modeling Synthesis Of Two Or Three Dimensional Circuits Through Substrate Coupling And Interconnections Noises And Parasites written by Christian Gontrand and has been published by Bentham Science Publishers this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-04-21 with Technology & Engineering categories.
The number of transistors in integrated circuits doubles every two years, as stipulated by Moore’s law, and this has been the driving force for the huge development of the microelectronics industry in the past 50 years – currently advanced to the nanometric scale. This e-book is dedicated to electronic noises and parasites, accounting for issues involving substrate coupling and interconnections, in the perspective of the 3D integration: a second track for enhancing integration, also compatible with Moore’s law. This reference explains the modeling of 3D circuits without delving into the latest advances, but highlights crucial problems, for instance electro-thermo-mechanical problems, which could be addressed through 3D modeling. The book also explains electromagnetic interferences , at different modeling levels (device and circuit) oriented towards 3D integration technologies. It also covers substrate noise, such as disturbances of digital blocks, power bounces, phase noise in oscillators, both at the device level, such as carriers or field fluctuations, and circuit levels. The entanglement between interconnect and substrate is also discussed. This e-book serves as a reference for advanced graduates or researchers in the field of micro and nano electronics interested in topics relevant to electromagnetic interference or the ‘noise’ domain, at device or circuit and system levels
Substrate Noise Coupling In Rfics
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Author : Ahmed Helmy
language : en
Publisher: Springer
Release Date : 2010-11-25
Substrate Noise Coupling In Rfics written by Ahmed Helmy and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-11-25 with Technology & Engineering categories.
The book reports modeling and simulation techniques for substrate noise coupling effects in RFICs and introduces isolation structures and design guides to mitigate such effects with the ultimate goal of enhancing the yield of RF and mixed signal SoCs. The book further reports silicon measurements, and new test and noise isolation structures. To the authors’ knowledge, this is the first title devoted to the topic of substrate noise coupling in RFICs as part of a large SoC.
Noise Coupling In System On Chip
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Author : Thomas Noulis
language : en
Publisher: CRC Press
Release Date : 2018-01-09
Noise Coupling In System On Chip written by Thomas Noulis and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-01-09 with Technology & Engineering categories.
Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends.
High Voltage Integrated Circuits
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Author : B. Jayant Baliga
language : en
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
Release Date : 1988
High Voltage Integrated Circuits written by B. Jayant Baliga and has been published by Institute of Electrical & Electronics Engineers(IEEE) this book supported file pdf, txt, epub, kindle and other format this book has been release on 1988 with Technology & Engineering categories.
Very Good,No Highlights or Markup,all pages are intact.
High Ratio Voltage Conversion In Cmos For Efficient Mains Connected Standby
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Author : Hans Meyvaert
language : en
Publisher: Springer
Release Date : 2016-05-24
High Ratio Voltage Conversion In Cmos For Efficient Mains Connected Standby written by Hans Meyvaert and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-05-24 with Technology & Engineering categories.
This book describes synergetic innovation opportunities offered by combining the field of power conversion with the field of integrated circuit (IC) design. The authors demonstrate how integrating circuits enables increased operation frequency, which can be exploited in power converters to reduce drastically the size of the discrete passive components. The authors introduce multiple power converter circuits, which are very compact as result of their high level of integration. First, the limits of high-power-density low-voltage monolithic switched-capacitor DC-DC conversion are investigated to enable on-chip power granularization. AC-DC conversion from the mains to a low voltage DC is discussed, enabling an efficient and compact, lower-power auxiliary power supply to take over the power delivery during the standby mode of mains-connected appliances, allowing the main power converter of these devices to be shut down fully.
Smart Power Integration
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Author : Mohamed Abouelatta
language : en
Publisher: John Wiley & Sons
Release Date : 2022-09-14
Smart Power Integration written by Mohamed Abouelatta and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-09-14 with Technology & Engineering categories.
Smart power integration is at the crossroads of different fields of electronics such as high and low power, engine control and electrothermal studies of devices and circuits. These circuits are complex and are heavily influenced by substrate coupling, especially where 3D integration is concerned. This book provides an overview of smart power integration, including high voltage devices, dedicated and compatible processes, as well as isolation techniques. Two types of integration are highlighted: modular or hybrid integration, together with compatible devices such as the insulated gate bipolar transistor (IGBT); and monolithic integration, specifically through the paradigm of functional integration. Smart Power Integration outlines the main MOS devices for high voltage integrated circuits, and explores into the fields of codesign, coupling hardware and software design, including applications to motor control. Studies focusing on heat pipes for electronics cooling are also outlined.
High Performance Integrated Circuit Design
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Author : Emre Salman
language : en
Publisher: McGraw Hill Professional
Release Date : 2012-08-14
High Performance Integrated Circuit Design written by Emre Salman and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-08-14 with Technology & Engineering categories.
The latest techniques for designing robust, high performance integrated circuits in nanoscale technologies Focusing on a new technological paradigm, this practical guide describes the interconnect-centric design methodologies that are now the major focus of nanoscale integrated circuits (ICs). High Performance Integrated Circuit Design begins by discussing the dominant role of on-chip interconnects and provides an overview of technology scaling. The book goes on to cover data signaling, power management, synchronization, and substrate-aware design. Specific design constraints and methodologies unique to each type of interconnect are addressed. This comprehensive volume also explains the design of specialized circuits such as tapered buffers and repeaters for data signaling, voltage regulators for power management, and phase-locked loops for synchronization. This is an invaluable resource for students, researchers, and engineers working in the area of high performance ICs. Coverage includes: Technology scaling Interconnect modeling and extraction Signal propagation and delay analysis Interconnect coupling noise Global signaling Power generation Power distribution networks CAD of power networks Techniques to reduce power supply noise Power dissipation Synchronization theory and tradeoffs Synchronous system characteristics On-chip clock generation and distribution Substrate noise in mixed-signal ICs Techniques to reduce substrate noise
Fundamentals Of High Frequency Cmos Analog Integrated Circuits
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Author : Duran Leblebici
language : en
Publisher: Springer Nature
Release Date : 2021-03-10
Fundamentals Of High Frequency Cmos Analog Integrated Circuits written by Duran Leblebici and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-03-10 with Technology & Engineering categories.
This textbook is ideal for senior undergraduate and graduate courses in RF CMOS circuits, RF circuit design, and high-frequency analog circuit design. It is aimed at electronics engineering students and IC design engineers in the field, wishing to gain a deeper understanding of circuit fundamentals, and to go beyond the widely-used automated design procedures. The authors employ a design-centric approach, in order to bridge the gap between fundamental analog electronic circuits textbooks and more advanced RF IC design texts. The structure and operation of the building blocks of high-frequency ICs are introduced in a systematic manner, with an emphasis on transistor-level operation, the influence of device characteristics and parasitic effects, and input–output behavior in the time and frequency domains. This second edition has been revised extensively, to expand some of the key topics, to clarify the explanations, and to provide extensive design examples and problems. New material has been added for basic coverage of core topics, such as wide-band LNAs, noise feedback concept and noise cancellation, inductive-compensated band widening techniques for flat-gain or flat-delay characteristics, and basic communication system concepts that exploit the convergence and co-existence of Analog and Digital building blocks in RF systems. A new chapter (Chapter 5) has been added on Noise and Linearity, addressing key topics in a comprehensive manner. All of the other chapters have also been revised and largely re-written, with the addition of numerous, solved design examples and exercise problems.
Advanced Field Solver Techniques For Rc Extraction Of Integrated Circuits
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Author : Wenjian Yu
language : en
Publisher: Springer Science & Business
Release Date : 2014-04-21
Advanced Field Solver Techniques For Rc Extraction Of Integrated Circuits written by Wenjian Yu and has been published by Springer Science & Business this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-04-21 with Technology & Engineering categories.
Resistance and capacitance (RC) extraction is an essential step in modeling the interconnection wires and substrate coupling effect in nanometer-technology integrated circuits (IC). The field-solver techniques for RC extraction guarantee the accuracy of modeling, and are becoming increasingly important in meeting the demand for accurate modeling and simulation of VLSI designs. Advanced Field-Solver Techniques for RC Extraction of Integrated Circuits presents a systematic introduction to, and treatment of, the key field-solver methods for RC extraction of VLSI interconnects and substrate coupling in mixed-signal ICs. Various field-solver techniques are explained in detail, with real-world examples to illustrate the advantages and disadvantages of each algorithm. This book will benefit graduate students and researchers in the field of electrical and computer engineering as well as engineers working in the IC design and design automation industries. Dr. Wenjian Yu is an Associate Professor at the Department of Computer Science and Technology at Tsinghua University in China; Dr. Xiren Wang is a R&D Engineer at Cadence Design Systems in the USA.