Photonics Packaging Integration And Interconnects
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Photonics Packaging Integration And Interconnects
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Author :
language : en
Publisher:
Release Date : 2007
Photonics Packaging Integration And Interconnects written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007 with Microelectronic packaging categories.
Integrated Circuit Packaging Assembly And Interconnections
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Author : William Greig
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-04-24
Integrated Circuit Packaging Assembly And Interconnections written by William Greig and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-04-24 with Technology & Engineering categories.
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.
Photonics Packaging Integration And Interconnects Ix
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Author :
language : en
Publisher:
Release Date : 2008
Photonics Packaging Integration And Interconnects Ix written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008 with categories.
Optoelectronic Interconnects Vii Photonics Packaging And Integration Ii
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Author : Michael R. Feldman
language : en
Publisher: SPIE-International Society for Optical Engineering
Release Date : 2000
Optoelectronic Interconnects Vii Photonics Packaging And Integration Ii written by Michael R. Feldman and has been published by SPIE-International Society for Optical Engineering this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Technology & Engineering categories.
Photonics Packaging And Integration
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Author :
language : en
Publisher:
Release Date : 2003
Photonics Packaging And Integration written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Microelectronic packaging categories.
Optical Interconnects For Data Centers
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Author : Tolga Tekin
language : en
Publisher: Woodhead Publishing
Release Date : 2016-11-01
Optical Interconnects For Data Centers written by Tolga Tekin and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-11-01 with Computers categories.
Current data centre networks, based on electronic packet switches, are experiencing an exponential increase in network traffic due to developments such as cloud computing. Optical interconnects have emerged as a promising alternative offering high throughput and reduced power consumption. Optical Interconnects for Data Centers reviews key developments in the use of optical interconnects in data centres and the current state of the art in transforming this technology into a reality. The book discusses developments in optical materials and components (such as single and multi-mode waveguides), circuit boards and ways the technology can be deployed in data centres. Optical Interconnects for Data Centers is a key reference text for electronics designers, optical engineers, communications engineers and R&D managers working in the communications and electronics industries as well as postgraduate researchers. - Summarizes the state-of-the-art in this emerging field - Presents a comprehensive review of all the key aspects of deploying optical interconnects in data centers, from materials and components, to circuit boards and methods for integration - Contains contributions that are drawn from leading international experts on the topic
Integrated Optical Interconnect Architectures For Embedded Systems
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Author : Ian O'Connor
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-11-07
Integrated Optical Interconnect Architectures For Embedded Systems written by Ian O'Connor and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-11-07 with Technology & Engineering categories.
This book provides a broad overview of current research in optical interconnect technologies and architectures. Introductory chapters on high-performance computing and the associated issues in conventional interconnect architectures, and on the fundamental building blocks for integrated optical interconnect, provide the foundations for the bulk of the book which brings together leading experts in the field of optical interconnect architectures for data communication. Particular emphasis is given to the ways in which the photonic components are assembled into architectures to address the needs of data-intensive on-chip communication, and to the performance evaluation of such architectures for specific applications.
Nano Bio Electronic Photonic And Mems Packaging
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Author : C.P. Wong
language : en
Publisher: Springer Science & Business Media
Release Date : 2009-12-23
Nano Bio Electronic Photonic And Mems Packaging written by C.P. Wong and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-12-23 with Technology & Engineering categories.
Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.
Photonic Networks Components And Applications Proceedings Of The Montebello Workshop
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Author : J Terry
language : en
Publisher: World Scientific
Release Date : 1991-03-07
Photonic Networks Components And Applications Proceedings Of The Montebello Workshop written by J Terry and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 1991-03-07 with categories.
This Workshop gathered engineers and scientists to discuss their recent research and issues related to photonic networks and their topologies, the enabling devices and applications these networks support. Optical communication, neural, sensor and computer networks were considered. Another part of the workshop was devoted to network components based on optical fibre, semiconductor and organic materials such as lasers, amplifiers and detectors, integrated optic and optoelectronic circuits. Applications in communications, optical sensing and signal processing were addressed, with particular emphasis on avionics, submarine, space as well as office, residential, medical and specialized (captive) services.
Nanopackaging
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Author : James E. Morris
language : en
Publisher: Springer Science & Business Media
Release Date : 2008-12-30
Nanopackaging written by James E. Morris and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-12-30 with Technology & Engineering categories.
Nanotechnologies are being applied to microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior mechanical, electrical, or thermal properties of carbon nanotubes. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancement. “Nanopackaging” is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of their field, and others with interests in nanotechnology. It will survey the application of nanotechnologies to electronics packaging, as represented by current research across the field.