Power Hvmos Devices Compact Modeling
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Power Hvmos Devices Compact Modeling
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Author : Wladyslaw Grabinski
language : en
Publisher: Springer Science & Business Media
Release Date : 2010-07-20
Power Hvmos Devices Compact Modeling written by Wladyslaw Grabinski and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-07-20 with Technology & Engineering categories.
Semiconductor power electronics plays a dominant role due its increased efficiency and high reliability in various domains including the medium and high electrical drives, automotive and aircraft applications, electrical power conversion, etc. Power/HVMOS Devices Compact Modeling will cover very extensive range of topics related to the development and characterization power/high voltage (HV) semiconductor technologies as well as modeling and simulations of the power/HV devices and smart power integrated circuits (ICs). Emphasis is placed on the practical applications of the advanced semiconductor technologies and the device level compact/spice modeling. This book is intended to provide reference information by selected, leading authorities in their domain of expertise. They are representing both academia and industry. All of them have been chosen because of their intimate knowledge of their subjects as well as their ability to present them in an easily understandable manner.
Scientific Computing In Electrical Engineering Scee 2010
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Author : Bastiaan Michielsen
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-01-06
Scientific Computing In Electrical Engineering Scee 2010 written by Bastiaan Michielsen and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-01-06 with Mathematics categories.
Selected from papers presented at the 8th Scientific Computation in Electrical Engineering conference in Toulouse in 2010, the contributions to this volume cover every angle of numerically modelling electronic and electrical systems, including computational electromagnetics, circuit theory and simulation and device modelling. On computational electromagnetics, the chapters examine cutting-edge material ranging from low-frequency electrical machine modelling problems to issues in high-frequency scattering. Regarding circuit theory and simulation, the book details the most advanced techniques for modelling networks with many thousands of components. Modelling devices at microscopic levels is covered by a number of fundamental mathematical physics papers, while numerous papers on model order reduction help engineers and systems designers to bring their modelling of industrial-scale systems within the reach of present-day computational power. Complementing these more specific papers, the volume also contains a selection of mathematical methods which can be used in any application domain.
Springer Handbook Of Semiconductor Devices
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Author : Massimo Rudan
language : en
Publisher: Springer Nature
Release Date : 2022-11-10
Springer Handbook Of Semiconductor Devices written by Massimo Rudan and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-11-10 with Technology & Engineering categories.
This Springer Handbook comprehensively covers the topic of semiconductor devices, embracing all aspects from theoretical background to fabrication, modeling, and applications. Nearly 100 leading scientists from industry and academia were selected to write the handbook's chapters, which were conceived for professionals and practitioners, material scientists, physicists and electrical engineers working at universities, industrial R&D, and manufacturers. Starting from the description of the relevant technological aspects and fabrication steps, the handbook proceeds with a section fully devoted to the main conventional semiconductor devices like, e.g., bipolar transistors and MOS capacitors and transistors, used in the production of the standard integrated circuits, and the corresponding physical models. In the subsequent chapters, the scaling issues of the semiconductor-device technology are addressed, followed by the description of novel concept-based semiconductor devices. The last section illustrates the numerical simulation methods ranging from the fabrication processes to the device performances. Each chapter is self-contained, and refers to related topics treated in other chapters when necessary, so that the reader interested in a specific subject can easily identify a personal reading path through the vast contents of the handbook.
3d Tcad Simulation For Semiconductor Processes Devices And Optoelectronics
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Author : Simon Li
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-10-01
3d Tcad Simulation For Semiconductor Processes Devices And Optoelectronics written by Simon Li and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-10-01 with Technology & Engineering categories.
Technology computer-aided design, or TCAD, is critical to today’s semiconductor technology and anybody working in this industry needs to know something about TCAD. This book is about how to use computer software to manufacture and test virtually semiconductor devices in 3D. It brings to life the topic of semiconductor device physics, with a hands-on, tutorial approach that de-emphasizes abstract physics and equations and emphasizes real practice and extensive illustrations. Coverage includes a comprehensive library of devices, representing the state of the art technology, such as SuperJunction LDMOS, GaN LED devices, etc.
Compact Modeling
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Author : Gennady Gildenblat
language : en
Publisher: Springer Science & Business Media
Release Date : 2010-06-22
Compact Modeling written by Gennady Gildenblat and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-06-22 with Technology & Engineering categories.
Most of the recent texts on compact modeling are limited to a particular class of semiconductor devices and do not provide comprehensive coverage of the field. Having a single comprehensive reference for the compact models of most commonly used semiconductor devices (both active and passive) represents a significant advantage for the reader. Indeed, several kinds of semiconductor devices are routinely encountered in a single IC design or in a single modeling support group. Compact Modeling includes mostly the material that after several years of IC design applications has been found both theoretically sound and practically significant. Assigning the individual chapters to the groups responsible for the definitive work on the subject assures the highest possible degree of expertise on each of the covered models.
Nanoscale Devices
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Author : Brajesh Kumar Kaushik
language : en
Publisher: CRC Press
Release Date : 2020-06-30
Nanoscale Devices written by Brajesh Kumar Kaushik and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-06-30 with categories.
The primary aim of this book is to discuss various aspects of nanoscale devices design and their applications including transport mechanism, modeling, and circuit applications. Furthermore, the book will develop a strong foundation to understand the need for moving from conventional MOSFET to the novel devices, as well as, how the device physics and transport phenomenon changes with reduction in the device size to a nanoscale regime. Details about the simulation technique and/or fabrication process flow of the various nanoscale devices is included along with simulated results of device performance parameters. The numerical and theoretical methods will be used to describe the related concepts. Key Features, Provides a platform for modeling and analysis of state-of-the-art devices in nanoscale regime, Reviews issues related to optimizing the sub-nanometer device performance, Addresses simulation aspect and/or fabrication process of devices, Explores associated circuit design aspects and applications, Includes design problems at the end of each chapter Book jacket.
Power Electronic Packaging
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Author : Yong Liu
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-02-15
Power Electronic Packaging written by Yong Liu and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-02-15 with Technology & Engineering categories.
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Wafer Bonding
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Author : Marin Alexe
language : en
Publisher: Springer Science & Business Media
Release Date : 2004-05-14
Wafer Bonding written by Marin Alexe and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-05-14 with Science categories.
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Rf And Microwave Power Amplifier Design
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Author : Andrei Grebennikov
language : en
Publisher: McGraw Hill Professional
Release Date : 2004-09-15
Rf And Microwave Power Amplifier Design written by Andrei Grebennikov and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-09-15 with Technology & Engineering categories.
This is a rigorous tutorial on radio frequency and microwave power amplifier design, teaching the circuit design techniques that form the microelectronic backbones of modern wireless communications systems. Suitable for self-study, corporate training, or Senior/Graduate classroom use, the book combines analytical calculations and computer-aided design techniques to arm electronic engineers with every possible method to improve their designs and shorten their design time cycles.